JPH0322437Y2 - - Google Patents
Info
- Publication number
- JPH0322437Y2 JPH0322437Y2 JP20169486U JP20169486U JPH0322437Y2 JP H0322437 Y2 JPH0322437 Y2 JP H0322437Y2 JP 20169486 U JP20169486 U JP 20169486U JP 20169486 U JP20169486 U JP 20169486U JP H0322437 Y2 JPH0322437 Y2 JP H0322437Y2
- Authority
- JP
- Japan
- Prior art keywords
- parking
- suspension chain
- suspended
- parking pallet
- suspension
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000725 suspension Substances 0.000 claims description 42
- 238000004873 anchoring Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
Landscapes
- Conveying And Assembling Of Building Elements In Situ (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Warehouses Or Storage Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20169486U JPH0322437Y2 (el) | 1986-12-27 | 1986-12-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP20169486U JPH0322437Y2 (el) | 1986-12-27 | 1986-12-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS63106859U JPS63106859U (el) | 1988-07-11 |
JPH0322437Y2 true JPH0322437Y2 (el) | 1991-05-16 |
Family
ID=31165385
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP20169486U Expired JPH0322437Y2 (el) | 1986-12-27 | 1986-12-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0322437Y2 (el) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8901733B2 (en) | 2001-02-15 | 2014-12-02 | Qualcomm Incorporated | Reliable metal bumps on top of I/O pads after removal of test probe marks |
US9369175B2 (en) | 2001-09-17 | 2016-06-14 | Qualcomm Incorporated | Low fabrication cost, high performance, high reliability chip scale package |
-
1986
- 1986-12-27 JP JP20169486U patent/JPH0322437Y2/ja not_active Expired
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8901733B2 (en) | 2001-02-15 | 2014-12-02 | Qualcomm Incorporated | Reliable metal bumps on top of I/O pads after removal of test probe marks |
US9369175B2 (en) | 2001-09-17 | 2016-06-14 | Qualcomm Incorporated | Low fabrication cost, high performance, high reliability chip scale package |
Also Published As
Publication number | Publication date |
---|---|
JPS63106859U (el) | 1988-07-11 |
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