JPH03219084A - Sealing material for partial plating and its production and partial plating method - Google Patents

Abstract

PURPOSE:To produce a high precision sealing material easily, rapidly, and inexpensively by placing a lead frame on a modeling part formed on a substrate, allowing a pin to engage with a hole to perform positioning, and then exerting pressing. CONSTITUTION:A modeling agent in a liquid state easy of molding is applied to a substrate 1 which has chemical resistance and dimensional stability and on which a pin 4 for positioning is projectedly provided, by which a modeling part 5 is formed. Subsequently, a lead frame 2 to be partially plated is placed as a male mold on the above modeling part 5. A clearance 6 and a hole 3 for positioning are provided to this lead frame 2, and the pin 4 is allowed to engage with the hole 3 to carry out positioning. This lead frame 2 is uniformly pressed from above, and the modeling agent is allowed to flow into the clearance 6 and the modeling agent overflown the clearance 6 is removed. After the modeling part 5 is hardened in this engaged state, the lead frame 2 is detached. By this method, a sealing material A for partial plating having a pattern part 7 for sealing molded as a male mold with high precision can be obtained.

Description

[Detailed Description of the Invention] Purpose of the Invention [Industrial Field of Application] The present invention provides a seal for applying partial plating with high precision to predetermined parts of a thin plate having a fine frame pattern, particularly a lead frame. The present invention relates to a material, a method for manufacturing the sealant, and a partial plating method using the sealant.

[Conventional technology]

In order to bond IC chips and transistors, fine frame patterns such as die pads and doped pins (hereinafter simply referred to as pins) are formed on the lead frame.
Partial plating of gold or silver is applied to designated areas.

As IC chips and the like become more dense, smaller, and have more pins, the frame pattern is required to be partially plated at predetermined locations in a higher density.

Conventionally, there have been the following sealing means for partial plating. i) A sealing material made of silicone rubber or sponge is mechanically pressed onto the required plating points of the lead frame (for example, see Japanese Patent Publication No. 5'l-15675), ii) A sealant made of silicone rubber or sponge is opened at the required plating points. Laminating a punched film onto a lead frame, iI
) The important plating parts of the lead frame are coated with a photoresist film.

[Problem to be solved by the invention]

However, among the above conventional sealing means for partial plating, i
) that use rubber or sponge sealing material,
If the object to be plated is a flat surface, complete sealing is possible, but if a fine frame pattern such as a lead frame is formed, the sealant cannot fit between each pin. As a result, the seal becomes incomplete, and the pin (1
Displacement plating Ql will precipitate due to liquid leakage to the 0 side. Since it was easy to peel off, it could come into contact with adjacent pins between narrow pins, causing leaks, and since the pin length was short, it would protrude outside of the resin mold, impairing the sealing effect, resulting in defective products.

Moreover, in devices that use this rubber or sponge sealing material, the larger the die pad is due to the number of pins on the lead frame, the more likely the seal on the back of the die pad becomes incomplete, and the plating solution can enter and form a plating crotch. Ru. This easily peels off, causing bubbles to form during resin molding, for example.

In addition, since the above ii) laminated punched film is disposable for each lead frame, it is extremely uneconomical when produced in large numbers like lead frames.

Furthermore, when using the photoresist described in Section 2.iii), when the resist IQ is formed by screen printing,
There were some areas where the resist film did not stick, and it was not possible to coat the resist film reliably. When using transfer printing, it is difficult to obtain the #1 film thickness, which results in filling the spaces between each pin and the holes for guide pins with a resist film.When spraying is applied, there is no need for a resist film. It is uneconomical as it covers a lot of areas, which causes a lot of loss.
There were problems such as.

The present invention aims to solve the drawbacks and problems of the conventional partial plating sealing means described above.

That is, the first object of the present invention is to attach the lead frame to a lead frame (there are various fine patterns, but lead frames with the same pattern can always be plated in an optimal state to reliably seal many important points. To provide a partially plated sealing material that prevents plating from adhering to the material.A second object is to provide a sealing material manufacturing method that allows the above-mentioned material to be manufactured as easily and inexpensively as possible.Third. The purpose of the present invention is to provide a partial plating method in which plating can be reliably performed without displacement plating or resulting defects, and in which the sealing material can be used with conventional partial plating equipment. That's true.

Structure of the Invention [Means for Solving the Problems] i) The first part of the 1-minute plating sealing material (A) according to the present invention is: on a substrate (1) having chemical resistance and dimensional stability, A positioning pin (4) protrudes corresponding to the positioning hole (3) of the partially plated lead frame (2), and a female mold formed by molding the lead frame (2) itself as a male mold, and is chemical resistant. Seal pattern plate part (7) with elasticity, releasability, and elasticity
It is made up of the following.

(See Figures 1 and 3) 1)) The second part of the sealing material for partial plating (A) according to the present invention is to partially plate the substrate (1) which has chemical resistance and dimensional stability. A positioning pin (4) protrudes corresponding to the positioning hole (3) of the lead frame (2), and a female mold formed by molding the lead frame (2) itself as a male mold, which has chemical resistance and mold release properties.・Elastic seal pattern plate (7)
and the above-mentioned sealing pattern plate part (7).
), the die pad (10) of the lead frame (2)
A vacuum suction hole (21) communicating with the substrate (1) is formed at the contact portion (to) the back surface (see FIGS. 12 to 18).

iii) The first method of molding the sealing material for partial plating (A) according to the present invention is to form a lead frame (2) to be partially plated on a substrate +1) having chemical resistance and dimensional stability (Fig. 2). Next, a positioning pin (4) is provided protrudingly corresponding to the positioning hole (3) of the substrate (see Fig. 4). A mold-making part (6) is formed by applying a mold-making part (6) that has elasticity, releasability, and elasticity (see Figure 5). Next, a male The lead frame (2) to be partially plated as a mold (see Figure 2) itself,
Place it face up so that the positioning hole (3) engages with the positioning pin (4) (see Figure 6), then press the surface of the lead frame (2) as the male die evenly. ,
Inject the molding strip into the gap (6) and remove the molding portion protruding from the surface of the lead frame (2) (see Figure 7), and then, in the above-mentioned engaged state, the molding portion After curing (5), the lead frame (2) as a male mold is removed from the molding part (5) to form a female mold seal with the lead frame (2) to be partially plated as a male mold. This is a molded pattern plate portion (7) (see Fig. 8, Fig. 1, and Fig. 3).

iv) The second method of mounting the sealing material for partial plating (A) according to the present invention is to position the partially plated frame (2) on the substrate +1) having chemical resistance and dimensional stability. Locating pins (4) are provided protrudingly in correspondence with the holes (3), and then a liquid material that is easy to mold and has chemical resistance, mold releasability, and elasticity after hardening is placed on the substrate (1). A molding part (6) is formed by applying a molding part (6), and then a lead frame (2) to be partially plated as a male mold is placed on the molding part (5) on the back side. so that the positioning hole (3) engages with the positioning pin (4)! ! Next, the surface of the lead frame (2) serving as the male mold is pressed uniformly to cause the molding stripes to flow into the gap (6), and to remove the mold protruding from the surface of the lead frame (2). By removing the molding part, and then curing the molding part (5) in the above-mentioned engaged state, removing the lead frame (2) as a male mold from the molding part (5). , mold a female sealing pattern plate part (7) using the lead frame (2) to be partially plated as a male type, and then mold the lead frame (2) of the sealing pattern plate part (7). Contact part to back side of die pad OI (2
A vacuum suction hole (21) communicating with the substrate (1) is formed in the hole.

■) The first partial plating method using the sealing material (A) according to the present invention is to use a lead frame (2) (second A sealing material (see figure) which has a male sealing pattern plate (7) and a female sealing pattern plate (7).
A) (see Fig. 8, Fig. 1, and Fig. 3). Next, the sealing pattern plate portion (7) of the sealing material (A) is formed.
), engage the lead frame (2) to be partially plated from the back side while engaging the positioning hole (3) of the lead frame (2) with the positioning pin (4) on the sealing material (A) side. (2) in a sealed manner except for the surface (see Figure 9).Next, on the surface of the lead frame (2), press a masking material (8) having openings (9) at the locations where partial plating is required, and apply the masking material (8) to the exposed locations. (see Figure 10), then remove the plated lead frame (2) from the sealing material (A) (see Figure 1)), and then continue using the sealing material (A). The other lead frame (2) is sealed and partially plated.

vi) The second partial plating method using the sealing material (A) according to the present invention is to prepare the lead frame (2) itself, which has chemical resistance, mold releasability, and elasticity and is to be partially plated, into a male. A sealing material (A) having a female-shaped sealing pattern plate part (7) is formed in advance, and then the sealing pattern plate part (7) of the sealing material (A) is formed.
), engage the lead frame (2) to be partially plated from the back side while engaging the positioning hole (3) of the lead frame (2) with the positioning pin (4) on the sealing material (A) side. (2) is sealed except for the surface, and then a masking material (8) having openings (9) at the locations where partial plating is required is pressed onto the surface of the lead frame (2), and
Of the above sealing pattern plate part (7), die pad 0
[Reduced pressure suction hole (2) formed in the contact part to the back side (2)
Air is sucked from 1) to forcibly bring the back side of the die pad 00) into close contact with the pattern Fi part (7), and in this state partial plating is applied to the exposed areas, and then the above lead frame (2) after plating is applied. is removed from the sealing material (A), and after that, the sealing material (A) is used to attach the other lead frame (
2) is sealed and partially plated.

In the above configuration, the lead frame (2) to be partially plated as a male type is the lead frame (2) to be partially plated.
) may have the same frame pattern.

[For production]

) First, the operation when assembling the sealing material for partial plating according to the present invention will be described.

The surface of the board (1) has a lead frame (
Locating pin (2) corresponding to the positioning hole (3)
4) should be made to stick out. Therefore, when placing the lead frame (2) as a male mold on the molding capital (5) coated and formed on the substrate (1), the positioning hole (3) is engaged with the positioning pin (4). This allows the lead frame (2) to be placed in an accurate position, and the lead frame (2) will not shift even after being placed.

A substrate (
1) is made of a dimensionally stable material.

Therefore, no deformation or dimensional error occurs in the sealing pattern plate (7) between its molding and subsequent plating.

Molding part (5) formed by applying liquid molding part
The coating was applied a little thicker than the male lead frame (2). Therefore, the molded sealing pattern plate portions (7) are connected at the lower surface to prevent deformation and seal the lower surface of the lead frame (2) during plating processing.

When molding the sealing pattern plate part (7), the molding part is liquid and has excellent moldability, and also uniformly presses the surface of the +J lead frame 2) as a male mold. Therefore, the molding part becomes a convex part that surely flows into the gap (6) of the frame pattern, and conversely, the part corresponding to the die pad 00) and each pin 0υ becomes a concave part, and the sealing pattern plate part of the female pattern becomes a concave part. (7) is molded with high precision.

In addition, when installing the second partially plated seal material having the vacuum suction hole (21), although not shown, the lead frame as a male mold is removed from the hardened molding part (5). After removing (2), the above sealing pattern plate g3
(Out of 71, die pad 0 of lead frame (2)
0) At the contact part (2) to the back surface, there is a vacuum suction hole (2) facing the communication hole (22) formed in advance on the substrate (1).
1) should be drilled.

[) Next, the effect when performing partial plating treatment using the sealing material according to the present invention will be described.

The sealing material (A) described in ``2'' is the sealing pattern plate part (
7) From the surface, insert the positioning hole (
A positioning pin (4) corresponding to 3) protrudes.

Therefore, when performing partial plating using the sealing material (A), it is only necessary to rotate the lead frame (2) to be partially plated so that the positioning pin (4) matches the positioning hole (3). . In this way, the sealing material (A) of the lead frame (2) is accurately engaged within the sealing pattern plate (7).

Also, sealing pattern 1 & 91 of sealing material (A)
) f7) C. Lead frame to be partially plated (2)
A female-shaped board with a male-shaped one and a dimensionally stable substrate (
1) Formed on top.

Therefore, the sealing pattern plate portion (
7) has a high degree of male-male relationship with the lead frame (2) to be partially plated, with no dimensional errors or positional deviations, and the two can be completely engaged.

That is, in this engaged state, only the surface of the lead frame (2) is exposed, and each side of the die pad 0ω, each pin (II), etc. is provided with an elastic sealing pattern plate (7).
are in close contact. Therefore, each side is reliably sealed, and the plating solution does not leak to the side of the pin 00.

Further, the sealing pattern plate part (7) of this sealing material (A)
) is such that when the lead frame (2) to be partially plated is engaged, the surfaces of both +71 (2) are on the same plane.

Therefore, when suppressing the area where plating is required with the masking material (8) with the opening (9), there is no gap (6) between the masking material (8) and the T& leak along the surface of the lead frame (2). There is no.

Moreover, partial plating with this sealing material (A) differs from conventional sealing means in that the lead frame (2) to be partially plated is engaged within the sealing pattern plate (7), but other than that, the partial plating with the sealing material (A) is different from conventional sealing means. This is similar to the partial plating means that is pressed by.

Therefore, when using the sealing material (A), there is no need for a special partial plating device, and partial plating can be performed with high precision using a conventional partial plating device.

This sealing material (A) does not seal only one male lead frame (2) itself.

Since the lead frame (2) is formed with high precision,
The sealing material (A) is applied to a lead frame (2) with the same pattern.
) can be sequentially sealed over a large number of sheets. Further, even if there is a minute dimensional error in the lead frame (2), the error is absorbed by the elasticity of the sealing pattern Fi portion (7), and sealing is performed with high precision in the same manner as described above.

In addition, when partial plating is performed using the sealing material for partial plating having the second vacuum suction hole (21), there is a partial plating in the sealing pattern plate part (7) of the sealing material (A). Engage the lead frame (2) to be plated from the back side,
After pressing the masking material (8) on the surface of the lead frame (2), the part of the sealing pattern plate part (7) that contacts the back surface of the die pad QO (the vacuum suction hole (21) formed in 2r4) is pressed. Air is sucked in from.

Therefore, since the back surface of the die pad a is forcibly brought into close contact with the pattern plate part (7), the number of die pads can be increased by increasing the number of pins.
Even with large lead frame (2) of 01, Daibara I'
(10) The back surface is completely sealed, so no plating solution enters and no unnecessary plating film is formed.

〔Example〕

FIGS. 1 to 1I show a first sealing material (
A), and FIGS. 12 to 19 relate to the second sealing material (A) according to the present invention.

As a material for the substrate (1) having chemical resistance and dimensional stability when molding the sealing material (A), for example, hard vinyl chloride resin, glass epoxy resin, etc. are preferable.

Also, mold making part (5) and sealing pattern plate part (7)
The mold-making oil must be liquid and easy to mold, and must have releasability, chemical resistance, and elasticity after curing.For example, the material must be a room-temperature curing type that hardens at room temperature and has dimensional stability. Silicone resin may be used. However, it may be a heat-curable silicone resin, epoxy acrylate or other acrylic resin, polyester resin, vinyl chloride, butadiene rubber, isopyrene rubber, or the like.

The means for applying the molding agent onto the substrate (1) may be by using a brush, but is not limited to such application in the narrow sense, and may also be applied by, for example, spraying, printing, or other application means.

To remove the molding agent protruding from the surface of the lead frame (2), it is sufficient to force it to flow out to the side when pressing the lead frame (2) with a pusher plate QI, but it is also possible to scrape it off with a roller or squeegee. good.

As a curing means for the molding part (5), in order to prevent dimensional errors, it is preferable to use the above-mentioned room temperature curing type silicone resin and to cure it at room temperature. However, in order to shorten the curing time, it is also possible to irradiate with ultraviolet rays or correct the dimensions and heat-cure.

A plurality of decompression suction holes (21) in the second sealing material (A) according to the present invention may be provided at the contact portion (to) the die pad OI as shown in FIGS. 13 and 14. ,
It may be one piece as shown in FIGS. 15 and 16. Alternatively, as shown in FIGS. 17 and 18, a shallow groove (23) may be formed in which a vacuum suction hole (21) is provided.

In addition, when plating with the sealing material (A) according to the present invention, the sealing material (A) may be turned upward as shown in FIG. 1O and the plating solution may be applied from above, or the plating solution may be applied from above as shown in FIG. Alternatively, the sealing material (A) may be oriented downward and the plating solution may be applied from below.

In the figure, 0 to 4 die pad engagement parts, q'5 to the pin engagement recess, Oa to the tie bar engagement recess, Oe to the frame side frame θ engagement recesses, 0η to the masking material substrate, and 0 to the sparger. 101 is a partially plated portion, (24) is a pressing member, and (25) is a suction hole in the pressing member.

Effects of the Invention As is clear from the foregoing, the sealing material for partial plating, its manufacturing method, and partial plating method according to the present invention have extremely useful effects compared to conventional ones.

That is, with conventional sealing means for partial plating, the sealing effect of the sealing material is insufficient, displacement plating is deposited on the side of each pin, resulting in defective products, and the punched film is disposable for each lead frame. There are various problems such as being uneconomical, the photoresist film not adhering to the photoresist film, and conversely filling the spaces between the pins.

1) On the other hand, the sealing material for partial plating according to the present invention is a sealing pattern plate formed by molding a lead frame to be partially plated into a type 1II. Therefore, lead frames with the same pattern have a completely male and female relationship, and the sealing effect can always be exhibited in an optimal state.

1)) Furthermore, in the method for manufacturing a sealing material according to the present invention, the lead frame itself to be partially plated as described above is used as a male mold,
The pattern plate for sealing is molded using a molding agent that has moldability. Therefore, there is no need to manufacture a mold, and the sealing material having a female pattern that has a completely male-male relationship with the partially plated resin frame can be manufactured very easily, quickly, and inexpensively.

iii) Further, in the partial plating method according to the present invention, the lead frame to be partially plated as described above is molded as a male mold, and the partially plated lead frame is engaged with the sealing pattern plate to achieve sealing. be. Therefore, the lead frame can be sealed with high precision, and precipitation of displacement plating and the occurrence of defective products due to it can be eliminated.

Further, the partial plating method using this sealing material does not require the preparation of a special plating device, and partial plating can be performed at u16 degrees using the same plating device as in the past.

Moreover, when the second sealing material according to the present invention having holes for vacuum suction is used in the part of the sealing material that contacts the back surface of the die pad, after pressing the surface of the lead frame with the masking material, Air is sucked through the hole.

Therefore, the back side of the die pad can be forcibly brought into close contact with the pattern plate portion of the sealing material, so even if the die pad has become thicker due to the increase in the number of pins in the lead frame, the back side can be completely sealed unlike before. Therefore, it is possible to prevent the plating solution from entering the back surface of the die pad, prevent the adhesion of unnecessary plating that easily peels off, and eliminate the cause of air bubbles during molding.

[Brief explanation of drawings]

FIG. 1 is a partially enlarged perspective view showing an embodiment of the first sealing material according to the present invention, and FIG. 2 is a partially enlarged perspective view of a lead frame as a male mold for molding the sealing material shown in FIG. 1. , 3rd
The figure is a plan view of a part of the sealing material shown in Figure 1, and Figures 4, 5, 6, 7, 8, 9, 1O, and 1) are FIG. 12 is a partially enlarged perspective view showing an embodiment of the second sealing material according to the present invention; FIG. Fig. 13 is a bottom view of the main part of the sealing material shown in Fig. 12, Fig. 14 is an enlarged longitudinal sectional front view when using the same, and Fig. 15 is the main part of another embodiment of the second sealing material. Fig. 16 is a vertical enlarged front view when using the same, Fig. 17 is a bottom view of the main part of yet another embodiment of the second sealing material, and Fig. 18 is when using it. FIG. 19 is an enlarged longitudinal front view showing an embodiment of the partial plating method using the sealing material shown in FIG.
The figure is an enlarged perspective view of a pin plated by the partial plating method according to the present invention, and FIG. 21 is an enlarged perspective view of a pin partially plated with a conventional masking material. Drawing code (A) - Sealing material (2) - Lead frame (4) - Positioning pin (6) - Gap (8) - One die pad 0 of masking material a - Die pad engaging recess a) - Pin engaging recess (20+-Contact part (1) One board (3) - Positioning hole (5) - Mold-making part (7) - Pattern plate part (9) - Opening 0υ - Partial plating part of pin Q91 (21) - Vacuum suction Hole drawing code (A) - Sealing material (1) +21- Q7-Door frame (3) (4) - Positioning pin (5) +61-1'J gap (71 (8) - Masking material (9) 01 - Die pad αυ Engagement concave concave jilt Ql partial plating part (21) - Decompression suction hole 1!5 Plate positioning hole Molding part pattern @ part opening pin drawing code (A) - Sole material (l) - Substrate (2) - Lead frame (3) - Positioning hole (4) - Positioning pin (5) - Molding part (6) - Gap
(7) - Pattern plate part + 81 - Masking material
(9) - Koiichi Sekiguchi Diver Node αυ - Pin ω - Die pad engaging recess 01 - Pin engaging recess o 1 part plating part I21) - Contact part (21) - Decompression suction hole No. 4 Knoll material (1) One substrate Lead frame (3) - Positioning hole positioning pin (5) - Gap for molding part (7)
- Pattern plate masking material (9) - Opening die pad αυ - Pinogui pad engagement recess Pin engagement recess SIIogl Partial contact of plated part 55 minutes
(21) - Viewing surface code for vacuum suction (Al - Knoll material (2) - Lead frame (4) - Positioning pin (6) - Gap (8) - Masking material (l [l - Die pad ■ - Die pad attachment Fitting recess llm - Pino engagement recess 121-1 Concubine 5B molecule l + one substrate (3) - Positioning hole (5) - Shooting part (7) - Batano slope (9) - Opening qυ - Pin 0 Partially plated (2I) - Decompression suction hole No. 10 Figure 12 Figure 16 Figure 15 Figure 15 Drawing code (A) - Knoll material (2) - Lead frame (41 - Positioning pin (6) - Gap ( 8) - Masking material 01 - Die pad (2) - Die pad engaging recess A J1 - Pin engaging recess Q4 - Contact part Board positioning hole molding part Putter 7 Fi Opening Pino Q91 Partially plated part (21) - Wi Figure 18 Seal material for suction hole il + 1 board lead frame (31- Positioning hole positioning pin (51- Gap for molding part (7)
- Pattern handling part 7 skin material (9) - Opening die pad 0υ - Pin die pad engagement recess and engagement recess ill A9 + Partially plated J6 contact area (21) - Decompression suction box Fig. 19 Drawing code (A) - Knoll Material (21 - Lead frame (4) - Positioning pin (61 - Gap (81 - Masking material - Die pad hit - Die pad engagement four parts θj - Pin engagement recess 1) 1 - Contact part + 1) One substrate (3) -Positioning hole (5) -Mold making part (7) -Pattern slope (9) -Opening 01) -Pin G cloudy part notch (21) -#yo pressure suction hole

Claims (6)

[Claims] (1) Positioning holes (3) of the lead frame (2) to be partially plated on the substrate (1) which has chemical resistance and dimensional stability.
) and a female mold formed by molding the lead frame (2) itself as a male mold.
A sealing material for partial plating, which is provided with a sealing pattern plate part (7) having chemical resistance, mold releasability, and elasticity. (2) Positioning holes (3) for the lead frame (2) to be partially plated on the substrate (1) which has chemical resistance and dimensional stability.
) and a female mold formed by molding the lead frame (2) itself as a male mold.
A seal pattern plate part (7) having chemical resistance, female shape, and elasticity is formed, and of the seal pattern plate part (7), the die pad (
10) A sealing material for partial plating in which a vacuum suction hole (21) leading to the substrate (1) side is formed in the contact portion (20) to the back surface. (3) Positioning holes (3) for the lead frame (2) to be partially plated on the substrate (1) which has chemical resistance and dimensional stability.
), and then protruding positioning pins (4) corresponding to the substrate (1) are placed on the substrate (1) to form a molding material that is liquid and has easy moldability and has chemical resistance, mold releasability, and elasticity after hardening. A molding part (6) is formed by applying a molding agent, and then a lead frame (2) is partially plated as a male mold on the molding part (5).
From the back side, the positioning hole (3) is inserted into the positioning pin (4).
), and then uniformly presses the surface of the lead frame (2) serving as the male mold to flow the molding agent into the gap (6), and (2) Remove the molding agent protruding from the surface, and then harden the molding part (5) in the above-mentioned engaged state, and then remove the lead as a male mold from the molding part (5). A method for manufacturing a sealing material for partial plating, in which a female sealing pattern plate part (7) is formed using a male lead frame (2) to be partially plated by removing the frame (2). (4) Positioning holes (3) for the lead frame (2) to be partially plated on the substrate (1) which has chemical resistance and dimensional stability.
), and then protruding positioning pins (4) corresponding to the substrate (1) are placed on the substrate (1) to form a molding material that is liquid and has easy moldability and has chemical resistance, mold releasability, and elasticity after hardening. A molding part (6) is formed by applying a molding agent, and then a lead frame (2) is partially plated as a male mold on the molding part (5).
From the back side, the positioning hole (3) is inserted into the positioning pin (4).
), and then uniformly presses the surface of the lead frame (2) serving as the male mold to flow the molding agent into the gap (6), and (2) Remove the molding agent protruding from the surface, and then harden the molding part (5) in the above-mentioned engaged state, and then remove the lead as a male mold from the molding part (5). By removing the frame (2), a female sealing pattern plate part (7) is formed using the lead frame (2) to be partially plated as a male type, and then the sealing pattern plate part (7) is molded. Among them, a vacuum suction hole (21) leading to the substrate (1) side is provided in the contact portion (20) of the lead frame (2) with the back surface of the die pad (10).
) A manufacturing method for a sealing material for partial plating, in which a hole is formed. (5) A sealing material (A) that has chemical resistance, mold releasability, and elasticity, and has a female sealing pattern plate (7) with the lead frame (2) to be partially plated as the male type. Next, the sealing pattern plate part (7) of the sealing material (A) is formed.
), the lead frame (2) itself to be partially plated,
The positioning hole (3) is engaged with the positioning pin (4) on the sealing material (A) side from the back side to seal the lead frame (2) except for the surface, and then,
A masking material (8) having openings (9) at locations where partial plating is required is pressed onto the surface of the lead frame (2) to partially plate the exposed locations, and then the lead frame (2) after plating is applied. is removed from the sealing material (A), and thereafter the sealing material (A) is removed.
) is a partial plating method in which the other lead frame (2) is sealed and partially plated. (6) A sealing material (A) that has chemical resistance, mold releasability, and elasticity, and has a female sealing pattern plate (7) with the lead frame (2) to be partially plated as the male type. Next, the sealing pattern plate part (7) of the sealing material (A) is formed.
), the lead frame (2) itself to be partially plated,
The positioning hole (3) is engaged with the positioning pin (4) on the sealing material (A) side from the back side to seal the lead frame (2) except for the surface, and then,
A masking material (8) having openings (9) at locations where partial plating is required is pressed onto the surface of the lead frame (2), and a masking material (8) is applied to the back surface of the die pad (10) within the sealing pattern plate (7). Air is sucked from the vacuum suction hole (21) formed in the contact portion (20), and the die pad (
10) Forcibly bring the back side into close contact with the pattern plate part (7),
In this state, partial plating is applied to the exposed areas, and then the lead frame (2) after plating is removed from the sealing material (A), and thereafter, the lead frame (2) is removed from the sealing material (A).
) is a partial plating method in which the other lead frame (2) is sealed and partially plated.