JPH0321854U - - Google Patents
Info
- Publication number
- JPH0321854U JPH0321854U JP8203489U JP8203489U JPH0321854U JP H0321854 U JPH0321854 U JP H0321854U JP 8203489 U JP8203489 U JP 8203489U JP 8203489 U JP8203489 U JP 8203489U JP H0321854 U JPH0321854 U JP H0321854U
- Authority
- JP
- Japan
- Prior art keywords
- lead terminal
- semiconductor device
- semiconductor chip
- molded part
- synthetic resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 8
- 229920003002 synthetic resin Polymers 0.000 claims 1
- 239000000057 synthetic resin Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082034U JP2512441Y2 (ja) | 1989-07-11 | 1989-07-11 | 合成樹脂封止型半導体装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989082034U JP2512441Y2 (ja) | 1989-07-11 | 1989-07-11 | 合成樹脂封止型半導体装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0321854U true JPH0321854U (US06229276-20010508-P00081.png) | 1991-03-05 |
| JP2512441Y2 JP2512441Y2 (ja) | 1996-10-02 |
Family
ID=31628492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989082034U Expired - Lifetime JP2512441Y2 (ja) | 1989-07-11 | 1989-07-11 | 合成樹脂封止型半導体装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2512441Y2 (US06229276-20010508-P00081.png) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001031704A1 (fr) * | 1999-10-28 | 2001-05-03 | Rohm Co., Ltd. | Dispositif a semi-conducteurs |
| JP2002217349A (ja) * | 2001-01-17 | 2002-08-02 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
| JP2010212736A (ja) * | 1999-10-28 | 2010-09-24 | Rohm Co Ltd | 半導体装置 |
| JP2014135324A (ja) * | 2013-01-08 | 2014-07-24 | Joek Kim | リード線が改良されたダイオードパッケージ及びその製造方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57176751A (en) * | 1981-04-22 | 1982-10-30 | Toshiba Corp | Semiconductor device |
| JPS58216448A (ja) * | 1982-06-09 | 1983-12-16 | Hitachi Ltd | 半導体装置及びその製造方法 |
-
1989
- 1989-07-11 JP JP1989082034U patent/JP2512441Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS57176751A (en) * | 1981-04-22 | 1982-10-30 | Toshiba Corp | Semiconductor device |
| JPS58216448A (ja) * | 1982-06-09 | 1983-12-16 | Hitachi Ltd | 半導体装置及びその製造方法 |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001031704A1 (fr) * | 1999-10-28 | 2001-05-03 | Rohm Co., Ltd. | Dispositif a semi-conducteurs |
| JP2001196518A (ja) * | 1999-10-28 | 2001-07-19 | Rohm Co Ltd | 半導体装置 |
| JP2010212736A (ja) * | 1999-10-28 | 2010-09-24 | Rohm Co Ltd | 半導体装置 |
| JP4651153B2 (ja) * | 1999-10-28 | 2011-03-16 | ローム株式会社 | 半導体装置 |
| JP2002217349A (ja) * | 2001-01-17 | 2002-08-02 | Rohm Co Ltd | 半導体装置の製造方法および半導体装置 |
| JP4494654B2 (ja) * | 2001-01-17 | 2010-06-30 | ローム株式会社 | 半導体装置の製造方法および半導体装置 |
| JP2014135324A (ja) * | 2013-01-08 | 2014-07-24 | Joek Kim | リード線が改良されたダイオードパッケージ及びその製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2512441Y2 (ja) | 1996-10-02 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |