JPH03214743A - Manufacturing system of semiconductor device - Google Patents

Abstract

PURPOSE:To improve the utilization factor of equipment by a method wherein a reference control part which obtains respective manufacturing conditions in accordance with information from a central control unit is provided and, further, an automatic condition setting part which sets the manufacturing conditions automatically is provided. CONSTITUTION:A storage case 3 in which unfinished goods or finished goods are stored and which has an individual identification mark 31, a central control unit 2 which receives information from each manufacturing apparatus and transmits information corresponding to the received information to each manufacturing apparatus through a communication line 4 and which has a communication control part 21, a communication control part 12 which transmits the detected identification mark 31 from the manufacturing apparatus 1 to the central control unit 2 through the communication line 4, and an automatic condition setting part 15 which sets the conditions for the respective processing means automatically in accordance with the given manufacturing conditions and which is incorporated by the manufacturing apparatus 1 are provided. With this constitution, the equipment utilization factor can be improved and high productivity multiple-type small-quantity production can be realized.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a manufacturing system for semiconductor devices, and more particularly to a manufacturing system used for manufacturing a wide variety of semiconductor devices in small quantities.

[Conventional technology]

In recent years, the demand for semiconductor devices has continued to increase as electronic components used in home appliances, industrial electronic equipment, transportation equipment, and communication equipment have become integrated circuits. In addition, there are various varieties, especially in the shape and size of the package, and the size of the pellet, and in terms of production,
The production process from the guising process of cutting semiconductor chips in the form of pellets from the diffused wafer to the process of sealing the semiconductor chips with resin is so-called high-mix, low-volume production. Therefore, unless equipment is operated efficiently, productivity will not increase and costs will not decrease.

For this reason, each manufacturing device on the production line is replaced with general-purpose equipment as much as possible, and batch-type production is performed, or the types of products flowing on the line are unified as much as possible, parts are input, and line production is performed to increase efficiency. It was implemented with a high level of

FIG. 3 is a block diagram of a manufacturing apparatus for explaining an example of a conventional semiconductor device manufacturing system.

For example, normally each manufacturing device 1 in this manufacturing system
As shown in the figure, b is a supply section 3a equipped with a storage case 3b for storing semiconductor device semi-finished products such as pellets, lead frames, bonding materials, etc., and a supply section 3a for carrying out necessary processing on the supplied semi-finished products. Feeding mechanism and processing stage 1
6, and a control device that controls these mechanical parts and the processing stage 16. In addition, when processing this semi-finished product, the operator learns the model name of the semi-finished product from the control sheet attached to the semi-finished product, and from the list of predetermined model names and manufacturing processing conditions, The conditions were found, and the manufacturing conditions were set in the manufacturing equipment 1b for processing.

FIG. 4 is a block diagram for explaining another example of a conventional semiconductor device manufacturing system. In addition, as another manufacturing system, for example, as shown in the same figure, each manufacturing apparatus 1c
If there is a central control device 2a that is a higher-level control means for group management, the detection unit 1 of the manufacturing device 1b detects the model name of the semi-finished product or the semi-finished product displayed on the storage case 3 of the semi-finished product.
lb detects this and transmits it to the communication control unit 12b of the manufacturing apparatus 1b.
communication control section 2 of the central control device 2a via the communication line 4.
1a, specific manufacturing processing conditions are retrieved from the correspondence table between model names and manufacturing processing conditions registered in advance in the correspondence table storage unit 14a of the central control device 2a, and this is communicated to the display device 2o. It is sent via line 4 and the manufacturing processing conditions are displayed.

Based on the display on the display device 20, the operator sets processing conditions for the manufacturing apparatus 1b via the control device 10 and performs processing.

[Problem to be solved by the invention]

However, in the conventional manufacturing system described above, especially in the former case, the operator finds the manufacturing processing conditions from a list and sets them, which can lead to incorrect setting of the processing conditions due to human error. However, there is a problem of machining defects. In addition, machining conditions have to be reset more often when switching types, which not only causes the problems mentioned above, but also increases preparatory work such as changing storage cases and tools, which reduces equipment operation. There are drawbacks that seriously reduce the rate. Furthermore, when the latter higher-level control device is used, it is necessary to display a unique model name on the semi-finished product or semi-finished product storage case, so especially when the semi-finished product storage case is used repeatedly, it must be displayed each time. The drawback was that the model name had to be redisplayed. That is, in low-volume, high-mix production, the number of man-hours required to redisplay the display cannot be ignored, which reduces production efficiency.

Further, as a countermeasure against this, for example, it is possible to repeatedly use the same model name, but this is not a good idea because the work of sorting by the same model name and the number of man-hours for managing these are enormous. Furthermore, in any of the manufacturing systems, each manufacturing condition is set by the operator, so there is a limit to the number of machines that the operator can handle, which reduces productivity.

SUMMARY OF THE INVENTION An object of the present invention is to provide a high-mix, low-volume manufacturing system for semiconductor devices that eliminates such drawbacks, improves equipment utilization rate, and has high productivity.

[Means to solve the problem]

6 1. The first semiconductor device manufacturing system according to the present invention includes:
A storage case that is provided with identification marks that do not overlap depending on the product type and that stores unprocessed semi-finished products or processed semi-finished products; a manufacturing device that performs a predetermined processing on the semi-finished products; means for detecting the indication before processing; a first communication means attached to the manufacturing apparatus for transmitting the detected identification indication via a communication line; and a second communication means for receiving the transmitted identification indication. a central control unit having a communication means; a first search unit attached to the central control unit; The first communication means receives information on the model name of the semiconductor device, and based on this information, the manufacturing condition is stored in a correspondence table storage unit that stores the manufacturing condition corresponding to the model name of each semiconductor device, which is set in advance. and a second one attached to the manufacturing equipment.
and automatic condition setting means for automatically setting conditions for each processing means of the manufacturing apparatus based on the manufacturing conditions.

2. A second semiconductor device manufacturing system according to the present invention includes, in the first semiconductor device manufacturing system, separately providing a storage case for storing processed semi-finished products and a storage case for storing unprocessed semi-finished products. It is characterized by comprising respective means for detecting identification marks on these storage cases, and first communication means provided independently for transmitting information on these identification marks via communication lines.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a block diagram of a semiconductor device manufacturing system showing a first embodiment of the present invention. This semiconductor device manufacturing system includes a plurality of manufacturing devices that perform various processing on semiconductor device semi-finished products, and a central control device that communicates and exchanges information regarding each of the semi-finished products with each of these manufacturing devices.

That is, as shown in the figure, this manufacturing system includes a storage case 3 that displays identification marks 31 that do not overlap depending on the type of product, a storage case 3 that stores a plurality of parts that are semi-finished products of semiconductor devices, and a storage case 3 that stores a plurality of parts that are semi-finished products of semiconductor devices. A manufacturing apparatus 1 having a processing stage 16 for processing the semi-finished product, and a detection unit 1 attached to the manufacturing apparatus 1 for detecting an identification mark 31 before processing this semi-finished product.
1, a central control device 2 having a communication control section 21 that receives information from each manufacturing device and sends information corresponding to this information to each manufacturing device via a communication line 4; A communication control unit 12 that sends data from the device 1 to the central control unit 2 via the communication line 4; and a correspondence table storage unit that stores a correspondence table for each type in which the model name of the semiconductor device determined from the identification display 31 is set in advance. The search control unit 22 performs a search from 23, and the communication control unit 21 sends the model name of the searched semiconductor device to the communication control unit 12, and the model name of each semiconductor device is set in advance based on the sent information. The corresponding manufacturing condition is searched from the correspondence table storage unit 14 that stores a comparison table of manufacturing conditions corresponding to the name, and the search control unit 13 attached to the manufacturing apparatus 1 performs each process of the manufacturing apparatus 1 according to the manufacturing condition. The automatic condition setting section 15 is attached to the manufacturing apparatus 1 and is configured to automatically set conditions in the apparatus.

Next, the operation of this manufacturing system will be explained. First, a storage case 3 with an identification mark 31 such as a bar code or a memorized magnetic tape in which the model name of the product is displayed as an individual code is sent. Here, this barcode may not be attached to the storage case and may be used as a barcode form.

Next, this storage case 3 is loaded into the supply section 17 of the manufacturing apparatus 1. Next, the detection unit 11 reads the identification display 31, and the communication control unit 12 sends information on the identification display 31 to the communication control unit 21 of the central control unit 2 via the communication line 4.

Based on the sent information, the search control section 22 retrieves the model name of the product corresponding to the information from the correspondence table storage section 23 in which the correspondence table is registered in advance. Here, in this correspondence table storage section 23, a relationship between a specific identification mark and a specific model name is stored in advance in a previous process. Next, the information retrieved by the communication control unit 21 (model name, ROM code, loft number, etc.) is sent to the communication control unit 12 of the manufacturing apparatus 1 via the communication line 4.

Next, based on the information sent to the communication control section 12, the search control section 13 retrieves manufacturing processing conditions from the correspondence table storage section 14. Here, the correspondence table storage unit 14 stores in advance each manufacturing processing condition corresponding to each specific product model name. Next, these manufacturing processing conditions are entered into the automatic condition setting section 15, and conditions are set for each mechanical section of the manufacturing apparatus 1, and processing into a semi-finished product on the processing stage 16 is started.

Next, when the processing is completed, the attached inspection equipment (not shown)
The quality of machining is judged and the number of defects is counted. Next, the processed semi-finished product is stored in the storage case 3 again from the processing stage 16.

Next, the communication control unit 12 sends, for example, the individual code of the storage case, the number of defects, the code of the manufacturing device, etc. to the central control device as a work completion report. Next, the storage case containing the processed semi-finished product is sent to a manufacturing device for the next process, and the manufacturing device for the next process performs the process by exchanging information with the central control unit in the same manner as described above.

With such a manufacturing system, the production line can be operated without operator intervention, and even if the type of semi-finished product changes, the corresponding processing conditions can be immediately searched and the manufacturing equipment can be automatically and reliably installed. It has the advantage of being able to set conditions.

FIG. 2 is a block diagram of a semiconductor device manufacturing system showing a second embodiment of the present invention. As shown in the figure, in addition to the manufacturing system of the first embodiment described above, this manufacturing system includes a communication control section 12a that is independently connected to the communication line 4, and an identification display 31a of the supplied storage case 3a. This is because a detecting section 11a is provided to read the information. Then, the detection unit 11 and the communication control unit 12 described in the above-mentioned embodiments detect the identification display and other information (rod number, number of defects, etc.) of the storage case 3 in which the processed semi-finished products are stored after the processing is completed. On the other hand, the detection unit 11a reads the identification display 31a of the storage case 3a that stores the additional semi-finished products to be supplied, and the communication control unit 12a reads the identification mark 31a of the storage case 3a that stores the additional semi-finished products to be supplied.
It is to send it to. As a result, the manufacturing equipment W1a receives information from the central control device 2 as in the above-mentioned embodiment, and
It is possible to set the manufacturing processing conditions of the manufacturing equipment 1a and process the product.In addition, this manufacturing system is a manufacturing system used when the shape or size of the semi-finished product changes before and after processing, and is used to store the processed semi-finished product. This is a case where the storage case 3 is different from the storage case 3a that stores the supplied unprocessed semi-finished products. This means that the storage case 3 for storing processed semi-finished products is located in the storage section 19, the identification display 31 of this storage case 3 is detected by the detection section 11, and transmitted to the central control section 2 by the communication control section 12. By doing so, the correspondence table between the identification indication and the specific model name that has been determined in advance is updated, and the identification indication stored in the correspondence table storage unit 23 is replaced with this identification indication 3.
It is to rewrite it to 1.

In other words, in this manufacturing system, when inputting a semi-finished product into a certain process, once the combination of model name and individual code 1 3 is input, the correspondence between the product model name and each code is automatically determined. It has the advantage of being able to update the table.

For example, even if the individual codes when supplying unprocessed semi-finished products to manufacturing equipment are different from the individual codes on the processed storage side, the individual codes on the storage side can be read and communicated to the central control unit. The ability to update individual codes. Therefore, even if the manufacturing equipment in the next process reads the code, the updated code has already been registered, so there is no problem in the next process.

〔Effect of the invention〕

As explained above, the present invention provides a storage case in which unprocessed semi-finished products or processed semi-finished products are stored and which has individual identification marks, and a storage case that reads the identification marks and allows the model name of the corresponding product to be read by communication means. By providing a central control unit that obtains the production conditions, and a manufacturing device that has a search control unit that obtains each manufacturing condition using information from the central control unit, and an automatic condition setting unit that automatically sets the manufacturing conditions, it is possible to Eliminates human errors caused by intervention, reduces the incidence of defective products, reduces man-hours for managing display on storage cases, reduces man-hours for setting processing conditions by changing product types, and man-hours for managing parts between processes. Since it is possible to reduce the amount of noise and reduce the burden on workers, etc., it is possible to improve the equipment utilization rate and obtain a highly productive high-mix, low-volume manufacturing system for semiconductor devices.

[Brief explanation of drawings]

FIG. 1 is a block diagram of a semiconductor device manufacturing system showing a first embodiment of the invention, FIG. 2 is a block diagram of a semiconductor device manufacturing system showing a second embodiment of the invention, and FIG. 3 is a block diagram of a semiconductor device manufacturing system showing a second embodiment of the invention. FIG. 4 is a block diagram of a manufacturing apparatus for explaining an example of a conventional semiconductor device manufacturing system. FIG. 4 is a block diagram for explaining another example of the conventional semiconductor device manufacturing system. 1, 1a, 1b, '1. c--Manufacturing equipment, 2, 2 a
- central control unit, 3, 3a, 3b...storage case;
4... Communication line, 5-9... Missing number, 10... Control device, 11, lla, 1 l b-... Detection unit, 12
, 12a, 12b, 21, 2 1 a-communication control unit, 1
3, 2 2... Search control unit, 14, 23... Correspondence table storage unit, 15... Automatic condition setting unit, 16... Processing stage, 17, 17a, 18... Supply unit, 19・・・
- Storage section, 20...display device.

Claims (1)

[Scope of Claims] 1. A storage case that is provided with identification marks that do not overlap depending on the product type and that stores unprocessed semi-finished products or processed semi-finished products, and a manufacturing device that performs predetermined processing on the semi-finished products;
means attached to the manufacturing apparatus and detecting the identification mark before processing; and a first means attached to the manufacturing apparatus and transmitting the detected identification mark via a communication line.
and a second communication means for receiving the sent identification indication.
a central control unit having a communication means; a first search unit attached to the central control unit that searches for the model name of the semiconductor device determined from the identification display from a preset correspondence table; and a first search unit attached to the central control unit; The first communication means receives information on the model name of the semiconductor device that has been updated, and manufactures the semiconductor device from a correspondence table storage unit that stores manufacturing conditions corresponding to the model name of each semiconductor device, which is set in advance based on this information. A semiconductor characterized in that it has a second search means attached to the manufacturing apparatus for extracting conditions, and an automatic condition setting means for automatically setting conditions for each processing means of the manufacturing apparatus based on the manufacturing conditions. Equipment manufacturing system. 2. A storage case for storing processed semi-finished products and a storage case for storing unprocessed semi-finished products are provided separately, and respective means for detecting identification markings on these storage cases and information on these identification markings are provided. 2. The semiconductor device manufacturing system according to claim 1, further comprising independently provided first communication means for transmitting data via a communication line.