JPH06224096A - Manufacture of semiconductor - Google Patents
Manufacture of semiconductorInfo
- Publication number
- JPH06224096A JPH06224096A JP1059593A JP1059593A JPH06224096A JP H06224096 A JPH06224096 A JP H06224096A JP 1059593 A JP1059593 A JP 1059593A JP 1059593 A JP1059593 A JP 1059593A JP H06224096 A JPH06224096 A JP H06224096A
- Authority
- JP
- Japan
- Prior art keywords
- semi
- finished product
- manufacturing apparatus
- processing
- bar code
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 75
- 239000004065 semiconductor Substances 0.000 title claims abstract description 24
- 238000004891 communication Methods 0.000 claims abstract description 31
- 239000011265 semifinished product Substances 0.000 claims description 75
- 238000000034 method Methods 0.000 abstract description 3
- 230000005540 biological transmission Effects 0.000 abstract 1
- 239000000047 product Substances 0.000 description 25
- 238000010586 diagram Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000010276 construction Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Control By Computers (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
- Multi-Process Working Machines And Systems (AREA)
- General Factory Administration (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明は半導体製造装置に関し、
特に少量多品種の半導体装置の生産に使用される半導体
製造装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus,
In particular, the present invention relates to a semiconductor manufacturing apparatus used for producing a large number of semiconductor devices in small quantities.
【０００２】[0002]
【従来の技術】半導体装置の多品種少量生産体制下にあ
る半導体製造現場において、製造途中の半導体装置（半
製品）の品種に合わせて半導体製造装置の品種切換えは
日頃頻繁に発生している。この品種切換えとは、半導体
製造装置に製造加工条件を設定することあるいは半導体
製造装置のメカ段取のことである。2. Description of the Related Art At a semiconductor manufacturing site under a high-mix low-volume production system for semiconductor devices, the type of semiconductor manufacturing device is frequently changed according to the type of semiconductor device (semi-finished product) being manufactured. This product type switching is setting of manufacturing / processing conditions in the semiconductor manufacturing apparatus or mechanical setup of the semiconductor manufacturing apparatus.
【０００３】従来の半導体製造装置を、図３を参照して
説明する。同図は製造装置３１が図示しない中央制御装
置に管理される場合を示すブロック図である。上記中央
制御装置からは通信回線３２を介して製造装置３１の通
信制御部３３に製造加工条件が送られる。それら製造加
工条件をもとに加工制御部３４により加工ステ−ジ３５
にて半製品に加工が施される。半製品は半製品供給部３
６にある半製品収納ケ−ス３７ａから加工ステ−ジ３５
に供給され、加工後、半製品収納部３８にある半製品収
納ケ−ス３７ｂに収められる。A conventional semiconductor manufacturing apparatus will be described with reference to FIG. This figure is a block diagram showing a case where the manufacturing apparatus 31 is managed by a central control unit (not shown). From the central control unit, manufacturing / processing conditions are sent to the communication control unit 33 of the manufacturing apparatus 31 via the communication line 32. Based on these manufacturing and processing conditions, the processing stage 34 is processed by the processing control unit 34.
The semi-finished products are processed at. Semi-finished product is semi-finished product supply unit 3
6 from the semi-finished product storage case 37a to the processing stage 35
Are supplied to the semi-finished product storage case 38b in the semi-finished product storage section 38 after processing.
【０００４】このように製造装置が上記中央制御装置に
接続された構成の半導体製造装置であっても、作業者が
半製品収納ケ−ス３７ａに付随される管理表に従い、上
記中央制御装置に製造加工条件を設定している。つま
り、品種切換え作業は作業者の判断により行っている。
従って、作業者の判断ミスにより品種切換えを実施せず
に半製品を加工したりあるいは間違った品種切換えを行
い加工したため、不良品を作ることが多々あった。Even if the manufacturing apparatus is a semiconductor manufacturing apparatus configured to be connected to the central control unit as described above, the worker is controlled by the central control unit according to the management table attached to the semi-finished product storage case 37a. Manufacturing and processing conditions are set. In other words, the type switching work is performed by the operator's judgment.
Therefore, a semi-finished product is processed without performing product type switching or an incorrect product type switching is performed due to operator's misjudgment, and thus defective products are often produced.
【０００５】[0005]
【発明が解決しようとする課題】上述のように、作業者
の判断により品種切換え作業を行うことは、人為的ミス
により不良品を作ることもあり歩留まりが悪い。更に、
作業者の負担が高く、半導体製造装置の稼働率を低下さ
せている。それ故に、本発明の目的は、確実に品種切換
えが実施され、生産性の高い半導体製造装置を提供する
ことである。As described above, performing the product type switching work based on the operator's judgment may result in defective products due to human error, resulting in poor yield. Furthermore,
The burden on the operator is high and the operation rate of the semiconductor manufacturing equipment is reduced. Therefore, an object of the present invention is to provide a semiconductor manufacturing apparatus in which product types are surely switched and which has high productivity.
【０００６】[0006]
【課題を解決するための手段】半導体製造装置は、半導
体装置の半製品に加工を施す製造装置と、該製造装置に
通信回線を介して接続し上記製造装置を管理する中央制
御装置とから構成される。上記製造装置は、加工前の半
製品が収納される第一半製品収納ケ−スに添付された識
別表示を読み取る第一読み取り手段と、上記中央制御装
置とデ−タ送受を行う下位通信手段と、上記中央制御装
置に設定される製造加工条件により上記半製品を加工す
る加工手段と、加工後の半製品が収納される第二半製品
収納ケ−スに添付された識別表示を読み取る第二読み取
り手段とを有する。また、上記中央制御装置は、上記製
造装置とデ−タ送受を行う上位通信手段と、上記識別表
示に対応する半製品の品種情報を保持する情報保持手段
と、上記製造装置より送信された上記識別表示に基づき
上記製造装置の製造加工条件を判断する判断手段とを有
する。A semiconductor manufacturing apparatus comprises a manufacturing apparatus for processing a semi-finished semiconductor device and a central control unit for controlling the manufacturing apparatus by connecting to the manufacturing apparatus via a communication line. To be done. The manufacturing apparatus includes first reading means for reading an identification mark attached to a first semi-finished product storage case in which a semi-finished product before processing is stored, and lower communication means for transmitting and receiving data to and from the central control unit. A processing means for processing the semi-finished product under the manufacturing and processing conditions set in the central control unit, and a reading means for reading the identification mark attached to the second semi-finished product storage case in which the processed semi-finished product is stored. And two reading means. Further, the central control unit has a higher-order communication means for transmitting and receiving data to and from the manufacturing apparatus, an information holding section for holding semi-finished product type information corresponding to the identification display, and the above-mentioned transmitted from the manufacturing apparatus. And a determination means for determining the manufacturing / processing conditions of the manufacturing apparatus based on the identification display.
【０００７】[0007]
【作用】上記構成において、半製品の加工前に、上記第
一読み取り手段により上記第一半製品収納ケ−スの識別
表示が読み取られ、その識別表示は上記下位通信手段に
より上記上位通信手段に送られ、上記情報保持手段から
その識別表示に対応する半製品の品種情報が検索され製
造加工条件が上記判断手段により判断され、上記判断は
上記上位通信手段から上記下位通信手段により送られ
る。上記判断に従い上記製造装置に設定された製造加工
条件に基づき上記加工手段により上記半製品が加工され
る。上記半製品の加工後に、上記第二読み取り手段によ
り上記第二半製品収納ケ−スの識別表示が読み取られ、
その識別表示は上記下位通信手段により上記上位通信手
段に送られ、上記情報保持手段にその識別表示と上記半
製品の品種情報が対応するように記憶される。In the above construction, the identification display of the first semi-finished product storage case is read by the first reading means before the processing of the semi-finished product, and the identification display is given to the upper communication means by the lower communication means. The semi-finished product type information corresponding to the identification display is retrieved from the information holding means, the manufacturing and processing conditions are judged by the judging means, and the judgment is sent from the upper communication means by the lower communication means. According to the judgment, the semi-finished product is processed by the processing means based on the manufacturing processing conditions set in the manufacturing apparatus. After the processing of the semi-finished product, the identification display of the second semi-finished product storage case is read by the second reading means,
The identification display is sent to the upper communication means by the lower communication means, and stored in the information holding means so that the identification display and the product type information of the semi-finished product correspond to each other.
【０００８】[0008]
【実施例】以下、本発明の一実施例を図面を参照して説
明する。図１によれば、半導体装置の半製品に加工を施
す製造装置１０は通信回線１０１を介して中央制御装置
２０と接続される。半製品が収納される半製品収納ケ−
ス１０２には、他の半製品収納ケ−スと重複しない固有
の識別表示としてバ−コ−ド１０３が添付されている。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. According to FIG. 1, a manufacturing apparatus 10 for processing a semi-finished semiconductor device is connected to a central control unit 20 via a communication line 101. Semi-finished product storage case where semi-finished products are stored
A bar code 103 is attached to the case 102 as a unique identification display that does not overlap with other semi-finished product storage cases.
【０００９】製造装置１０は、加工前に半製品供給部１
１にある半製品収納ケ−ス１０２ａに添付されているバ
−コ−ド１０３ａを読み取るバ−コ−ドリ−ダ１２ａ及
びバ−コ−ド読み取り制御部１３ａと、半製品に加工を
施す加工ステ−ジ１４及び加工制御部１５と、加工後に
半製品収納部１６にある半製品収納ケ−ス１０２ｂに添
付されているバ−コ−ド１０３ｂを読み取るバ−コ−ド
リ−ダ１２ｂ及びバ−コ−ド読み取り制御部１３ｂと、
中央制御装置２０と通信（デ−タ送受）を行う通信制御
部１７とを有する。また中央制御装置２０は、製造装置
１０と通信を行う通信制御部２１と、品種情報を有する
情報部２２と、製造装置の品種切換えの有無を判断する
判断部２３とから構成される。The manufacturing apparatus 10 includes a semi-finished product supply unit 1 before processing.
1 is a bar code reader 12a for reading a bar code 103a attached to a semi-finished product storage case 102a and a bar code reading control section 13a, and a process for working a semi-finished product. The stage 14 and the processing control unit 15, and the bar code reader 12b and the bar code reader 12b for reading the bar code 103b attached to the semi-finished product storage case 102b in the semi-finished product storage unit 16 after processing. A code reading controller 13b,
It has a central controller 20 and a communication controller 17 that communicates (transmits and receives data). The central control unit 20 is composed of a communication control unit 21 that communicates with the manufacturing apparatus 10, an information unit 22 that has product type information, and a determination unit 23 that determines whether or not the product type of the manufacturing device is switched.
【００１０】次に、動作を説明する。予め、半製品収納
ケ−ス１０２に添付されるバ−コ−ドに対応するよう
に、半製品の品種情報は情報部２２に保持されている。
先ず、半製品供給部１１にある半製品収納ケ−ス１０２
ａに添付されたバ−コ−ド１０３ａをバ−コ−ドリ−ダ
１２ａにて読み取り、そのバ−コ−ド情報を製造装置１
０の通信制御部１７から通信回線を介して中央制御装置
２０の通信制御部２１に送信する。情報部２２に保持さ
れる上記バ−コ−ド情報に対応した品種情報を判断部２
３が検索し、上記品種情報と製造装置１０が現在設定さ
れている品種情報とを比較し、品種切換えの必要有無を
判断する。ここで品種切換えとは、製造装置１０のメカ
段取りと製造装置１０に設定する製造加工条件のことで
ある。Next, the operation will be described. The semi-finished product type information is held in the information section 22 in advance so as to correspond to the bar code attached to the semi-finished product storage case 102.
First, the semi-finished product storage case 102 in the semi-finished product supply unit 11
The bar code 103a attached to a is read by the bar code reader 12a, and the bar code information is read by the manufacturing apparatus 1
It is transmitted from the communication control unit 17 of 0 to the communication control unit 21 of the central control device 20 via the communication line. The judging section 2 determines the kind information corresponding to the above bar code information held in the information section 22.
3 makes a comparison and compares the product type information with the product type information currently set by the manufacturing apparatus 10 to determine whether or not it is necessary to switch the product type. Here, the product type change means mechanical setup of the manufacturing apparatus 10 and manufacturing processing conditions set in the manufacturing apparatus 10.
【００１１】判断部２３が下す判断の一例として、 （１）．加工禁止（品種切換えが必要） （２）．条件付き加工許可（加工数の限定） （３）．限定なしで加工許可（製造装置側で１回の許可
に対する加工数をパラメ−タにて保持している）があ
る。As an example of the judgment made by the judgment unit 23, (1). Prohibition of processing (requiring product type change) (2). Conditional processing permission (limited number of processing) (3). There is no limitation on processing (the manufacturing machine holds the number of processing for one permission by a parameter).
【００１２】（１）の判断の場合、製造装置１０側の品
種切換え（メカ段取り）をする必要があり、作業者が品
種切換えを行い、端末１０４を通じて中央制御装置に品
種交換の終了を通知する。その後、再び判断部２３によ
り判断される。In the case of the determination (1), it is necessary to switch the product type (mechanical setup) on the manufacturing apparatus 10 side, the operator switches the product type, and notifies the central control unit through the terminal 104 of the end of the product type exchange. . Then, the judgment unit 23 makes a judgment again.
【００１３】（２）及び（３）の判断の場合、製造装置
１０側の品種切換えは必要とせず製造装置１０に製造加
工条件を設定する場合である。（２）の判断の場合は、
最大Ｘ個半製品を収納される半製品収納ケ−ス１０２
に、実際に収納されている半製品がＹ（Ｙ＜Ｘ）個であ
る場合に有効である。（３）の判断の場合は、製造装置
１０側が加工数を設定している場合に有効である。In the case of the judgments (2) and (3), it is a case where the manufacturing apparatus 10 side is not required to switch the product type and the manufacturing processing conditions are set in the manufacturing apparatus 10. In the case of (2),
Semi-finished product storage case 102 that can store up to X semi-finished products
It is effective when the number of semi-finished products actually stored is Y (Y <X). The determination of (3) is effective when the manufacturing device 10 side sets the number of processes.
【００１４】上述のような判断、例えば判断（２）が判
断部２３にて決定されると、それら製造加工条件は通信
制御部２１から通信回線１０１を介し通信制御部１７へ
送信され、加工制御部１５に上記製造加工条件が設定さ
れる。半製品収納ケ−ス１０２ａから半製品は加工ステ
−ジ１４に送られ加工され、半製品収納部１６の半製品
収納ケ−ス１０２ｂに収められる。全ての半製品が加工
された後、半製品収納ケ−ス１０２ｂに添付されている
バ−コ−ド１０３ｂをバ−コ−ドリ−ダ１２ｂが読み取
り、そのバ−コ−ド情報を通信制御部１７より通信回線
１０１を介して通信制御部２１に送信する。それによ
り、半製品収納ケ−ス１０２ｂを識別するバ−コ−ド１
０３ｂの情報と、それに対応する半製品収納ケ−ス１０
２ｂに収納される半製品の品種情報とが情報部２２に記
憶される。When the above-mentioned judgment, for example, judgment (2) is decided by the judgment unit 23, the manufacturing and processing conditions are transmitted from the communication control unit 21 to the communication control unit 17 via the communication line 101, and the processing control is carried out. The manufacturing and processing conditions are set in the section 15. The semi-finished product is sent from the semi-finished product storage case 102a to the processing stage 14 where it is processed and stored in the semi-finished product storage case 102b of the semi-finished product storage unit 16. After all the semi-finished products have been processed, the bar code reader 12b reads the bar code 103b attached to the semi-finished product storage case 102b, and the bar code information is controlled by communication. It is transmitted from the unit 17 to the communication control unit 21 via the communication line 101. Thereby, the bar code 1 for identifying the semi-finished product storage case 102b
03b information and corresponding semi-finished product storage case 10
The information on the product type of the semi-finished products stored in 2b is stored in the information section 22.
【００１５】このような半導体製造装置であると、一つ
の中央制御装置２０により複数の製造装置１０を管理す
ることができる。半製品は各製造装置１０間を半製品収
納ケ−ス１０２にて移動し、各半製品収納ケ−ス１０２
には各々重複しない固有のバ−コ−ド１０３が添付され
ている。また、各製造装置１０は加工前に半製品供給部
１１にある半製品収納ケ−ス１０２ａを識別すると共
に、加工後に半製品収納部１６にある半製品収納ケ−ス
１０２ｂに添付されたバ−コ−ド１０３ｂの情報と収納
された半製品の品種情報とを対応させ中央制御装置２０
の情報部２２に記憶させる。With such a semiconductor manufacturing apparatus, a single central control unit 20 can manage a plurality of manufacturing apparatuses 10. The semi-finished product is moved between the manufacturing apparatuses 10 by the semi-finished product storage case 102, and the semi-finished product storage case 102 is moved.
Each has a unique bar code 103 attached thereto. Further, each manufacturing apparatus 10 identifies the semi-finished product storage case 102a in the semi-finished product supply unit 11 before processing, and the bar attached to the semi-finished product storage case 102b in the semi-finished product storage unit 16 after processing. The central controller 20 correlates the information of the code 103b with the product type information of the stored semi-finished products.
It is stored in the information unit 22 of.
【００１６】従って、予め、一番目の製造装置１０に供
給される半製品を収納する半製品収納ケ−ス１０２ａに
添付されたバ−コ−ド１０３ａの情報と，その半製品の
品種情報との対応を中央制御装置２０の情報部２２に入
力することにより、各製造装置１０において作業者が介
在する事なく順次加工を行うことができる。言い換えれ
ば、一番目の製造装置１０における加工後の半製品収納
ケ−ス１０３ｂが二番目の製造装置１０における加工前
の半製品収納ケ−ス１０２ａとなり、上記加工前の半製
品収納ケ−ス１０２ａに添付されたバ−コ−ド１０３ａ
の情報に対応するその収納された半製品の品種情報は情
報部２２が保持しているため、作業者を介在させる事な
く順次加工が実施される。Therefore, in advance, information on the bar code 103a attached to the semi-finished product storage case 102a for storing the semi-finished product supplied to the first manufacturing apparatus 10 and the product type information of the semi-finished product. By inputting the correspondence of No. 1 to the information unit 22 of the central control device 20, it is possible to sequentially perform processing in each manufacturing device 10 without the intervention of an operator. In other words, the processed semi-finished product storage case 103b in the first manufacturing apparatus 10 becomes the unprocessed semi-finished product storage case 102a in the second manufacturing apparatus 10, and the pre-processed semi-finished product storage case 102a. Bar code 103a attached to 102a
Since the information section 22 holds the product type information of the stored semi-finished products corresponding to the information of (1), the processing is sequentially performed without the intervention of the operator.
【００１７】本発明による他の実施例を図２より説明す
る。但し、図１と異なる部分のみ説明する。本実施例で
は、半製品収納ケ−ス１０２にはバ−コ−ドは添付され
ておらず、ロット毎に１枚存在するトラベルシ−ト１０
５に品種により重複しないようなバ−コ−ド１０３が添
付されている。半製品収納ケ−ス１０２ａに収納された
半製品を加工する前に、バ−コ−ドリ−ダ１２によりト
ラベルシ−ト１０５のバ−コ−ド１０３を読み取り、そ
のバ−コ−ド情報をもとに製造加工条件が設定される。
半製品は、加工ステ−ジ１４にて加工され半製品収納ケ
−ス１０２ｂに収納される。Another embodiment according to the present invention will be described with reference to FIG. However, only the parts different from FIG. 1 will be described. In this embodiment, a bar code is not attached to the semi-finished product storage case 102, and there is one travel sheet 10 for each lot.
5 is attached with a bar code 103 which does not overlap depending on the type. Before processing the semi-finished products stored in the semi-finished product storage case 102a, the bar code reader 12 reads the bar code 103 of the travel sheet 105, and the bar code information is read. The manufacturing and processing conditions are set based on
The semi-finished product is processed in the processing stage 14 and stored in the semi-finished product storage case 102b.
【００１８】[0018]
【発明の効果】本発明によれば、製造装置入口で読み取
ったバ−コ−ド情報を中央制御装置に送信し、中央制御
装置の判断に従い半製品は加工される。従って、作業者
のミスによる品種切換えの忘れ及び間違いがなくなり、
人為的ミスによる不良品の製造を防止でき、歩留まりの
向上及び品質の安定化を図ることができる。According to the present invention, the bar code information read at the entrance of the manufacturing apparatus is transmitted to the central control unit, and the semi-finished product is processed according to the judgment of the central control unit. Therefore, there will be no forgetting or mistakes in product type switching due to operator error.
It is possible to prevent the production of defective products due to human error, improve the yield, and stabilize the quality.
【図１】本発明による一実施例を示す半導体製造装置の
ブロック図である。FIG. 1 is a block diagram of a semiconductor manufacturing apparatus showing an embodiment according to the present invention.
【図２】本発明による他の実施例を示す半導体製造装置
のブロック図である。FIG. 2 is a block diagram of a semiconductor manufacturing apparatus showing another embodiment according to the present invention.
【図３】従来の半導体製造装置を示すブロック図であ
る。FIG. 3 is a block diagram showing a conventional semiconductor manufacturing apparatus.
１０…製造装置、１２…バ−コ−ドリ−ダ １３…バ−コ−ド読み取り制御部、１４…加工ステ−ジ １５…加工制御部、１６…半製品収納部、１７…通信制
御部 ２０…中央制御装置、２１…通信制御部、２２…情報
部、２３…判断部 １０１…通信回線、１０２…半製品収納ケ−ス、１０３
…バ−コ−ド １０４…端末、１０５…トラベルシ−トDESCRIPTION OF SYMBOLS 10 ... Manufacturing apparatus, 12 ... Bar code reader 13 ... Bar code reading control section, 14 ... Processing stage 15 ... Processing control section, 16 ... Semi-finished product storage section, 17 ... Communication control section 20 ... Central control device, 21 ... Communication control part, 22 ... Information part, 23 ... Judgment part 101 ... Communication line, 102 ... Semi-finished product storage case, 103
... bar code 104 ... terminal, 105 ... travel sheet
Claims (1)
置と、上記製造装置に通信回線を介して接続し上記製造
装置を管理する中央制御装置とを具備し、 上記製造装置は、加工前の半製品が収納される第一半製
品収納ケ−スに添付された第一識別表示を読み取る第一
読み取り手段と、上記中央制御装置とデ−タ送受を行う
下位通信手段と、上記中央制御装置に設定される製造加
工条件により上記半製品を加工する加工手段と、加工後
の半製品が収納される第二半製品収納ケ−スに添付され
た第二識別表示を読み取る第二読み取り手段とを有する
共に、 上記中央制御装置は、上記製造装置とデ−タ送受を行う
上位通信手段と、上記第一及び第二識別表示に対応する
半製品の品種情報を保持する情報保持手段と、上記製造
装置より送信された上記識別表示に基づき上記製造装置
の製造加工条件を判断する判断手段とを有することを特
徴とする半導体製造装置。1. A manufacturing apparatus for processing a semi-finished semiconductor device, and a central control unit for controlling the manufacturing apparatus by connecting to the manufacturing apparatus via a communication line. First reading means for reading the first identification mark attached to the first semi-finished product storage case for storing the semi-finished products, the lower-level communication means for transmitting and receiving data to and from the central control device, and the central control Processing means for processing the semi-finished product according to the manufacturing and processing conditions set in the device, and second reading means for reading the second identification mark attached to the second semi-finished product storage case in which the processed semi-finished product is stored. In addition to the above, the central control unit has a higher-order communication unit for transmitting and receiving data to and from the manufacturing apparatus, and an information holding unit for holding semi-finished product type information corresponding to the first and second identification displays, The above transmitted from the above manufacturing equipment Having a determination means for determining a manufacturing processing conditions of the manufacturing apparatus based on another display semiconductor manufacturing apparatus according to claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01059593A JP3388794B2 (en) | 1993-01-26 | 1993-01-26 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP01059593A JP3388794B2 (en) | 1993-01-26 | 1993-01-26 | Semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06224096A true JPH06224096A (en) | 1994-08-12 |
| JP3388794B2 JP3388794B2 (en) | 2003-03-24 |
Family
ID=11754600
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP01059593A Expired - Fee Related JP3388794B2 (en) | 1993-01-26 | 1993-01-26 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3388794B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004234237A (en) * | 2003-01-29 | 2004-08-19 | Sumitomo Metal Mining Co Ltd | Working system |
| JP2004342905A (en) * | 2003-05-16 | 2004-12-02 | Toshiba Corp | Production system of semiconductor device |
| JP2011180733A (en) * | 2010-02-26 | 2011-09-15 | Nikon-Essilor Co Ltd | Lens manufacturing system, lens manufacturing method, computer program, lens design data use management system, lens design data use management device, lens machining management device, lens machining management method, lens machining management system, lens design data use management program, and lens machining management program |
| JP7402576B1 (en) * | 2023-05-30 | 2023-12-21 | 有限会社キューズテック | Automatic assembly system, automatic assembly method, management server and automatic assembly management program |
-
1993
- 1993-01-26 JP JP01059593A patent/JP3388794B2/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004234237A (en) * | 2003-01-29 | 2004-08-19 | Sumitomo Metal Mining Co Ltd | Working system |
| JP2004342905A (en) * | 2003-05-16 | 2004-12-02 | Toshiba Corp | Production system of semiconductor device |
| JP4564241B2 (en) * | 2003-05-16 | 2010-10-20 | 株式会社東芝 | Semiconductor device production system |
| JP2011180733A (en) * | 2010-02-26 | 2011-09-15 | Nikon-Essilor Co Ltd | Lens manufacturing system, lens manufacturing method, computer program, lens design data use management system, lens design data use management device, lens machining management device, lens machining management method, lens machining management system, lens design data use management program, and lens machining management program |
| US9886027B2 (en) | 2010-02-26 | 2018-02-06 | Nikon-Essilor Co., Ltd. | Lens manufacturing system, lens manufacturing method, computer program, lens design data use management system, lens design data use management device, lens processing management device, lens processing management method, lens processing management system, lens design data use management program, and lens processing management program |
| JP7402576B1 (en) * | 2023-05-30 | 2023-12-21 | 有限会社キューズテック | Automatic assembly system, automatic assembly method, management server and automatic assembly management program |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3388794B2 (en) | 2003-03-24 |
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