JPH03204906A - Chip type variable resistor - Google Patents

Chip type variable resistor

Info

Publication number
JPH03204906A
JPH03204906A JP28245290A JP28245290A JPH03204906A JP H03204906 A JPH03204906 A JP H03204906A JP 28245290 A JP28245290 A JP 28245290A JP 28245290 A JP28245290 A JP 28245290A JP H03204906 A JPH03204906 A JP H03204906A
Authority
JP
Japan
Prior art keywords
electrode terminal
base
collector electrode
ceramic resistance
resistance
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP28245290A
Other languages
Japanese (ja)
Inventor
Yoshiyuki Nakatsu
仲津 義行
Hiroyuki Watanabe
博之 渡辺
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPH03204906A publication Critical patent/JPH03204906A/en
Pending legal-status Critical Current

Links

Landscapes

  • Adjustable Resistors (AREA)

Abstract

PURPOSE:To reduce the thickness of a ceramic resistance base, and to conrive reduction in cost by a method wherein the ceramic resistance base, on which a resistance pattern is formed on the surface, and a resin base are combined, they are integrally formed using a clipping piece, and an electrode terminal and a collector electrode terminal are buried in the resin base. CONSTITUTION:A mounting part 6, having the prescribed depth to mount a ceramic resistance base 1, is formed on a resin base 2, and a pair of electrode terminal 7 and a collector electrode terminal 8 are buried in the resin base 2. The inner end part 7a of the electrode terminal 7 is exposed to the upper surface of one end part 2a of the ceramic resistance base 1 on which a resistance pattern 5 is formed, and the inner end part 7a is electrically connected to the edge part 5a of the resistance pattern 5 using a conductive bonding agent 9 and the like. The ceramic resistance base 11, which is attached to the mounting part 6 by a clipping piece 8a which is extended along the other edge part of the resin base 2 and bent toward the inside of the mounting part 6, is fixed by applying pressure to the midway part of the collector electrode terminal 8. The inner end part 8b of the collector electrode terminal 8, which is buried in the resin base 2, is made to pass through the through hole 4 of the ceramic resistance base 1 and projected from the surface of the base 1, and a sliding piece 3 is supported by the inner end part 8b.

Description

【発明の詳細な説明】 〈産業上の利用分野〉 本発明は、チップ型可変抵抗器(以下、可変抵抗器とい
う)に関する。
DETAILED DESCRIPTION OF THE INVENTION <Industrial Application Field> The present invention relates to a chip type variable resistor (hereinafter referred to as a variable resistor).

〈従来の技術〉 従来から、この種の可変抵抗器としては、第3図及び第
4図で示すように、厚みの厚い1枚板状のアルミナなど
からなるセラミック抵抗基板20を備えたものがあり、
その表面上にはサーメットからなる略円弧状の抵抗パタ
ーン21が形成されている。そして、このセラミック抵
抗基板20の一方側端面(図では、左側)には銀・パラ
ジウム合金のメツキ処理によって形成された一対の端子
電極22が並列配置されており、これらは抵抗パターン
21の端縁部それぞれと電気的に接続されている。
<Prior Art> Conventionally, as shown in FIGS. 3 and 4, this type of variable resistor has been equipped with a ceramic resistance substrate 20 made of a thick single plate of alumina or the like. can be,
A substantially arc-shaped resistance pattern 21 made of cermet is formed on the surface thereof. A pair of terminal electrodes 22 formed by plating a silver-palladium alloy are arranged in parallel on one side end surface (the left side in the figure) of this ceramic resistance substrate 20, and these terminal electrodes 22 are connected to the edge of the resistance pattern 21. Each part is electrically connected.

また、このセラミック抵抗基板20には金属板を加工し
て形成されたコレクタ電極端子23が取り付けられてお
り、セラミック抵抗基板20の略中央位置を厚み方向に
沿って貫通して表面上に突出したコレクタ電極端子23
の内端部23aには抵抗パターン21上を摺動する摺動
子24がカシメ付けなどによって回動自在に支持されて
いる。
Further, a collector electrode terminal 23 formed by processing a metal plate is attached to this ceramic resistance substrate 20, and extends through the approximately central position of the ceramic resistance substrate 20 along the thickness direction and protrudes above the surface. Collector electrode terminal 23
A slider 24 that slides on the resistance pattern 21 is rotatably supported at the inner end 23a by caulking or the like.

そして、このコレクタ電極端子23の外端部23bは、
セラミック抵抗基板20の下面から他方側端面(図では
、右側)に沿って屈曲されている。
The outer end 23b of the collector electrode terminal 23 is
It is bent from the lower surface of the ceramic resistance substrate 20 along the other end surface (right side in the figure).

〈発明が解決しようとする課題〉 ところで、前記従来構成の可変抵抗器においては、つぎ
のような不都合が生じていた。まず、この可変抵抗器で
は、厚みの厚いセラミック抵抗基板20を用いなければ
ならず、また、このセラミック抵抗基板20に対してコ
レクタ電極端子23を取り付けるための複雑な孔明は加
工などを施す必要があることから、材料コストや加工コ
ストの上昇を招くことになる。さらに、半田付は時に発
生し易い「銀くわれ」といわれる現象を防止すべく銀・
パラジウム合金を用いて端子電極22を形成するのであ
るが、この合金そのものが高価であるとともに、その形
成にあたってはメツキ処理などの特別な処理を採用する
必要があるため、より一層のコストアップを招いてしま
う。
<Problems to be Solved by the Invention> By the way, the following disadvantages have occurred in the variable resistor of the conventional configuration. First, in this variable resistor, it is necessary to use a thick ceramic resistance substrate 20, and it is also necessary to process complicated holes to attach the collector electrode terminal 23 to the ceramic resistance substrate 20. This results in an increase in material costs and processing costs. Furthermore, in order to prevent the phenomenon called "silver cracking" that often occurs when soldering, silver
The terminal electrode 22 is formed using a palladium alloy, but this alloy itself is expensive and requires special processing such as plating to form it, which further increases costs. I'll be there.

本発明はかかる従来の不都合に鑑みて創案されたもので
あって、高価な銀・パラジウム合金を用いず、また、セ
ラミック抵抗基板にコレクタ電極端子を取り付ける必要
もなく、結果として材料コストや加工コストの大幅な低
減を図ることが可能な構成とされた可変抵抗器を提供す
ることを目的としている。
The present invention was devised in view of such conventional disadvantages, and does not use an expensive silver/palladium alloy, nor does it require attaching a collector electrode terminal to a ceramic resistance substrate, resulting in material costs and processing costs. It is an object of the present invention to provide a variable resistor having a configuration that allows for a significant reduction in .

〈課題を解決するための手段〉 本発明にかかる可変抵抗器は、このような目的を達成す
るために、略円弧状の抵抗パターンが表面上に形成され
たセラミック抵抗基板と、これを取り付ける取付部が上
面側に形成された樹脂基板と、抵抗パターン上を摺動す
る摺動子とを備えてなり、樹脂基板内には一対の電極端
子及びコレクタ電極端子が埋設され、かつ、このコレク
タ電極端子の中途部にはセラミック抵抗基板を取付部に
押圧固定するクリップ片が分岐して形成される一方、樹
脂基板の上面に露出した各電極端子の内端部と抵抗パタ
ーンの端縁部とがそれぞれ電気的に接続されるとともに
、セラミック抵抗基板を貫通して突出したコレクタ電極
端子の内端部には摺動子が回動自在に支持されており、
この樹脂基板の側面から延出された各電極端子及びコレ
クタ電極端子それぞれの外端部が樹脂基板の側面から下
面に沿って屈曲されていることを特徴とするものである
<Means for Solving the Problems> In order to achieve the above object, the variable resistor according to the present invention includes a ceramic resistance substrate on which a substantially arc-shaped resistance pattern is formed, and a mounting device for attaching the ceramic resistance substrate. It is equipped with a resin substrate having a portion formed on the upper surface side and a slider that slides on a resistor pattern, and a pair of electrode terminals and a collector electrode terminal are embedded in the resin substrate, and the collector electrode A clip piece that presses and fixes the ceramic resistance board to the mounting part is branched in the middle of the terminal, while the inner end of each electrode terminal exposed on the top surface of the resin board and the edge of the resistance pattern are formed in the middle part of the terminal. A slider is rotatably supported at the inner end of the collector electrode terminal which is electrically connected to each other and protrudes through the ceramic resistance substrate.
The outer end of each electrode terminal and collector electrode terminal extending from the side surface of the resin substrate is bent along the lower surface from the side surface of the resin substrate.

〈作用〉 上記手段によれば、セラミック抵抗基板と樹脂基板とを
組み合わせることによって可変抵抗器の一体化された基
板を構成するとともに、この樹脂基板内に電極端子及び
コレクタ電極端子を埋設しているので、セラミック抵抗
基板の厚みは薄りチ済むことになり、このセラミック抵
抗基板に対してコレクタ電極端子を取り付けるための孔
加工などを施す必要もな(なり、さらには、銀・パラジ
ウム合金などを用いて端子電極を形成する必要もない。
<Operation> According to the above means, the integrated substrate of the variable resistor is constructed by combining the ceramic resistance substrate and the resin substrate, and the electrode terminal and the collector electrode terminal are embedded in the resin substrate. Therefore, the thickness of the ceramic resistance board can be reduced, and there is no need to make holes for attaching collector electrode terminals to this ceramic resistance board (in addition, it is not necessary to make holes for attaching collector electrode terminals to the ceramic resistance board). There is no need to form terminal electrodes using the same.

〈実施例〉 以下、本発明の実施例を図面に基づいて説明する。<Example> Embodiments of the present invention will be described below based on the drawings.

第1図は可変抵抗器の全体構成を示す分解斜視図であり
、第2図はその縦断側面図である。
FIG. 1 is an exploded perspective view showing the overall configuration of the variable resistor, and FIG. 2 is a longitudinal sectional side view thereof.

本実施例にかかる可変抵抗器は、厚みの薄い1枚板状の
アルミナなどからなるセラミック抵抗基板1と、PPS
樹脂のような樹脂材料からなる樹脂基板2と、金属板を
所要形状に加工してなる摺動子3とを備えている。そし
て、このセラミック抵抗基板1の略中央位置には貫通孔
4が形成される一方、その表面上にはカーボンやサーメ
ットなどを焼き付けてなる略円弧状の抵抗パターン5が
形成されており、この抵抗パターン5の端縁部5aそれ
ぞれはセラミック抵抗基板1の一端部まで引き出された
うえで並列配置されている。
The variable resistor according to this embodiment includes a ceramic resistance substrate 1 made of a thin single plate of alumina or the like, and a PPS.
It includes a resin substrate 2 made of a resin material such as resin, and a slider 3 formed by processing a metal plate into a desired shape. A through hole 4 is formed approximately at the center of the ceramic resistance substrate 1, while a generally arcuate resistance pattern 5 made of carbon, cermet, etc. is formed on the surface of the ceramic resistance substrate 1. Each edge portion 5a of the pattern 5 is drawn out to one end of the ceramic resistance substrate 1 and is arranged in parallel.

また、樹脂基板2の上面側にはセラミック抵抗基板1を
取り付けるべき所定深さの取付部6が形成されており、
この樹脂基板2の内部には一対の電極端子7及びコレク
タ電極端子8がインサートモールドによって埋設されて
いる。そして、金属板などを屈曲加工してなる電極端子
7それぞれの内情部7aは、セラミック抵抗基板1の一
端部(図では、左側)2aの上面に露出したうえ、導電
性接着剤9などを介して抵抗パターン5の端縁部5aと
電気的に接続されている。
Further, a mounting portion 6 having a predetermined depth to which the ceramic resistance board 1 is to be mounted is formed on the upper surface side of the resin board 2.
A pair of electrode terminals 7 and a collector electrode terminal 8 are buried inside this resin substrate 2 by insert molding. The internal information portion 7a of each electrode terminal 7 formed by bending a metal plate or the like is exposed on the upper surface of one end (left side in the figure) 2a of the ceramic resistance substrate 1, and is The resistive pattern 5 is electrically connected to the edge portion 5a of the resistive pattern 5.

一方、このコレクタ電極端子8の中途部には、樹脂基板
2の他端面に沿って延出され、かつ、取付部6の内方に
向かって屈曲成形されたクリップ片8aが分岐して形成
されている。そこで、セラミック抵抗基板1の取付部6
に取り付けられたセラミック抵抗基板1は、クリップ片
8aの有する弾性力によって押圧固定されていることに
なる。
On the other hand, in the middle of the collector electrode terminal 8, a branched clip piece 8a is formed which extends along the other end surface of the resin substrate 2 and is bent inward of the mounting portion 6. ing. Therefore, the mounting portion 6 of the ceramic resistance board 1
The ceramic resistance board 1 attached to the clip piece 8a is pressed and fixed by the elastic force of the clip piece 8a.

さらに、この樹脂基板2に埋設されたコレクタ電極端子
8の内端部8bはセラミック抵抗基板1の貫通孔4を挿
通してその表面上に突出されており、この内端部8bに
は抵抗パターン5上を摺動する摺動子3がカシメ付けな
どによって回動自在に支持されている。さらにまた、こ
の樹脂基板2の側面からは電極端子7及びコレクタ電極
端子8の外端部7b、8cがそれぞれ延出されており、
これらの外端部7b、8cのそれぞれは樹脂基板2の側
面から下面に沿って屈曲された状態で配設されている。
Furthermore, the inner end 8b of the collector electrode terminal 8 embedded in the resin substrate 2 is inserted through the through hole 4 of the ceramic resistance substrate 1 and protrudes onto the surface thereof, and the inner end 8b has a resistor pattern. A slider 3 sliding on the slider 5 is rotatably supported by caulking or the like. Furthermore, outer ends 7b and 8c of the electrode terminal 7 and the collector electrode terminal 8 extend from the side surface of the resin substrate 2, respectively.
Each of these outer end portions 7b and 8c is bent from the side surface of the resin substrate 2 along the lower surface thereof.

ところで、本実施例における摺動子3は、その抵抗パタ
ーン5との接触部3aを除く全周囲が絶縁性樹脂材料な
どをモールドしてなる回動カバー10によって囲まれて
おり、この回動カバー10とこれが対面するセラミック
抵抗基板1の表面との間にはシリコーンゴムなどからな
る防塵用パツキン11が介装されている。そこで、本実
施例にかかる可変抵抗器は、いわゆる密閉型として構成
されていることになる。その結果、従来例にかかる可変
抵抗器ではセラミック抵抗基板20の表面上に形成され
た抵抗パターン21が外部に露出していることからプリ
ント配線基板(図示していない)などに対して半田付は
実装する際のフラックス残渣によって抵抗接触障害が発
生する恐れがあったにも拘わらず、本実施例にかかる可
変抵抗器においてはこのような恐れが生じることはない
という利点が得られる。
By the way, the entire periphery of the slider 3 in this embodiment except for the contact portion 3a with the resistance pattern 5 is surrounded by a rotating cover 10 formed by molding an insulating resin material or the like. A dust-proof packing 11 made of silicone rubber or the like is interposed between the ceramic resistance substrate 10 and the surface of the ceramic resistance substrate 1 that it faces. Therefore, the variable resistor according to this embodiment is configured as a so-called sealed type. As a result, in the conventional variable resistor, the resistance pattern 21 formed on the surface of the ceramic resistance board 20 is exposed to the outside, so it is difficult to solder it to a printed wiring board (not shown) or the like. Although there is a risk that resistance contact failure may occur due to flux residue during mounting, the advantage of the variable resistor according to this embodiment is that such a risk does not occur.

〈発明の効果〉 以上説明したように、本発明にかかる可変抵抗器によれ
ば、セラミック抵抗基板と樹脂基板とを重ね合わせるこ
とによって可変抵抗器の一体化された基板を構成するの
で、セラミック抵抗基板の厚みは従来例よりも大幅に薄
くて済むことになる。
<Effects of the Invention> As explained above, according to the variable resistor according to the present invention, the integrated substrate of the variable resistor is constructed by overlapping the ceramic resistance substrate and the resin substrate. The thickness of the substrate can be significantly thinner than in the conventional example.

また、この樹脂基板内に電極端子及びコレクタ電極端子
を埋設し、かつ、このコレクタ電極端子の中途部に分岐
形成したクリップ片によってセラミック抵抗基板を取り
付けているので、このセラミック抵抗基板に対してコレ
クタ電極端子を取り付けるための孔加工などを施す必要
がなくなると同時に、高価な銀・パラジウム合金などを
用いた特別の処理によって端子電極を形成する必要がな
くなる。その結果、材料コストや加工コストの大幅な低
減を図ることができるという優れた効果が得られる。
In addition, since the electrode terminal and the collector electrode terminal are embedded in this resin substrate, and the ceramic resistance board is attached by a clip piece formed in the middle of this collector electrode terminal, the collector electrode terminal is embedded in this resin board. There is no need to perform hole processing for attaching electrode terminals, and at the same time, there is no need to form terminal electrodes through special processing using expensive silver-palladium alloys. As a result, an excellent effect can be obtained in that material costs and processing costs can be significantly reduced.

【図面の簡単な説明】[Brief explanation of drawings]

第1図及び第2図は本発明の実施例にかかり、第1図は
可変抵抗器の全体構成を示す分解斜視図、第2図はその
縦断面図である。また、第3図及び第4図は従来例にか
かり、第3図は可変抵抗器の全体構成を示す分解斜視図
、第4図はその縦断面図である。 図における符号1はセラミック抵抗基板、2は樹脂基板
、3は摺動子、5は抵抗パターン、5aはその端縁部、
6は取付部、7は電極端子、7aはその内端部、7bは
その外端部、8はコレクタ電極端子、8aはクリップ片
、8bはその内端部、8cは外端部である。 なお、図中の同一符号は、互いに同一もしくは相当する
部品、部分を示している。
1 and 2 show an embodiment of the present invention, with FIG. 1 being an exploded perspective view showing the overall configuration of a variable resistor, and FIG. 2 being a longitudinal sectional view thereof. Further, FIGS. 3 and 4 show a conventional example, with FIG. 3 being an exploded perspective view showing the overall configuration of the variable resistor, and FIG. 4 being a longitudinal sectional view thereof. In the figure, 1 is a ceramic resistance substrate, 2 is a resin substrate, 3 is a slider, 5 is a resistance pattern, 5a is an edge thereof,
6 is a mounting part, 7 is an electrode terminal, 7a is an inner end thereof, 7b is an outer end thereof, 8 is a collector electrode terminal, 8a is a clip piece, 8b is an inner end thereof, and 8c is an outer end thereof. Note that the same reference numerals in the drawings indicate parts and portions that are the same or correspond to each other.

Claims (1)

【特許請求の範囲】[Claims] (1)略円弧状の抵抗パターン(5)が表面上に形成さ
れたセラミック抵抗基板(1)と、これを取り付ける取
付部(6)が上面側に形成された樹脂基板(2)と、抵
抗パターン(5)上を摺動する摺動子(3)とを備えて
なり、 樹脂基板(2)内には一対の電極端子(7)及びコレク
タ電極端子(8)が埋設され、かつ、このコレクタ電極
端子(8)の中途部にはセラミック抵抗基板(1)を取
付部(6)に押圧固定するクリップ片(8a)が分岐し
て形成される一方、樹脂基板(2)の上面に露出した各
電極端子(7)の内端部(7a)と抵抗パターン(5)
の端縁部(5a)とがそれぞれ電気的に接続されるとと
もに、セラミック抵抗基板(1)を貫通して突出したコ
レクタ電極端子(8)の内端部(8b)には摺動子(3
)が回動自在に支持されており、この樹脂基板(2)の
側面から延出された各電極端子(7)及びコレクタ電極
端子(8)それぞれの外端部(7b,8c)が樹脂基板
(2)の側面から下面に沿って屈曲されていることを特
徴とするチップ型可変抵抗器。
(1) A ceramic resistance substrate (1) on which a substantially arc-shaped resistance pattern (5) is formed; a resin substrate (2) on which a mounting portion (6) for attaching the ceramic resistance pattern is formed; A slider (3) that slides on the pattern (5), a pair of electrode terminals (7) and a collector electrode terminal (8) are embedded in the resin substrate (2), and this A clip piece (8a) that presses and fixes the ceramic resistance board (1) to the mounting part (6) is branched in the middle of the collector electrode terminal (8), and is exposed on the top surface of the resin board (2). The inner end (7a) of each electrode terminal (7) and the resistance pattern (5)
The slider (3
) is rotatably supported, and the outer ends (7b, 8c) of each electrode terminal (7) and collector electrode terminal (8) extending from the side surface of the resin substrate (2) are connected to the resin substrate (2). (2) A chip type variable resistor characterized in that it is bent from the side surface to the bottom surface.
JP28245290A 1989-10-20 1990-10-19 Chip type variable resistor Pending JPH03204906A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP1-274360 1989-10-20
JP27436089 1989-10-20

Publications (1)

Publication Number Publication Date
JPH03204906A true JPH03204906A (en) 1991-09-06

Family

ID=17540574

Family Applications (6)

Application Number Title Priority Date Filing Date
JP28245190A Pending JPH03204905A (en) 1989-10-20 1990-10-19 Chip type variable resistor
JP28245290A Pending JPH03204906A (en) 1989-10-20 1990-10-19 Chip type variable resistor
JP28245690A Pending JPH03204904A (en) 1989-10-20 1990-10-19 Variable resistor
JP2282454A Expired - Fee Related JP2531012B2 (en) 1989-10-20 1990-10-19 Variable resistor
JP28245590A Pending JPH03204903A (en) 1989-10-20 1990-10-19 Variable resistor
JP28245390A Pending JPH03204901A (en) 1989-10-20 1990-10-19 Variable resistor

Family Applications Before (1)

Application Number Title Priority Date Filing Date
JP28245190A Pending JPH03204905A (en) 1989-10-20 1990-10-19 Chip type variable resistor

Family Applications After (4)

Application Number Title Priority Date Filing Date
JP28245690A Pending JPH03204904A (en) 1989-10-20 1990-10-19 Variable resistor
JP2282454A Expired - Fee Related JP2531012B2 (en) 1989-10-20 1990-10-19 Variable resistor
JP28245590A Pending JPH03204903A (en) 1989-10-20 1990-10-19 Variable resistor
JP28245390A Pending JPH03204901A (en) 1989-10-20 1990-10-19 Variable resistor

Country Status (1)

Country Link
JP (6) JPH03204905A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2538472B2 (en) * 1991-12-27 1996-09-25 愛知電機株式会社 Method for manufacturing smooth wiring circuit board
JP6482883B2 (en) * 2015-01-23 2019-03-13 アルプスアルパイン株式会社 RESISTANCE BOARD INTEGRATED SUPPORT, ROTARY VARIABLE RESISTOR USING THE RESISTANCE BOARD INTEGRATED SUPPORT, AND METHOD FOR PRODUCING THE RESISTANCE BOARD INTEGRATED SUPPORT

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58210603A (en) * 1982-06-01 1983-12-07 北陸電気工業株式会社 Method of producing substrate for variable resistor
JPS62104020A (en) * 1985-10-30 1987-05-14 株式会社村田製作所 Electronic structural parts
JPS62104405U (en) * 1985-12-23 1987-07-03

Also Published As

Publication number Publication date
JPH03204905A (en) 1991-09-06
JPH03204903A (en) 1991-09-06
JPH03204904A (en) 1991-09-06
JP2531012B2 (en) 1996-09-04
JPH03204902A (en) 1991-09-06
JPH03204901A (en) 1991-09-06

Similar Documents

Publication Publication Date Title
JPH03204906A (en) Chip type variable resistor
JPS60217601A (en) Substrate
US5095298A (en) Surface mount variable resistor with insert-molded slider
JP3983392B2 (en) Chip type parts
JP2786921B2 (en) Variable resistor
JP2539607Y2 (en) Variable resistor
JP3663309B2 (en) Variable resistor
JPH039271Y2 (en)
JP2572664Y2 (en) Semi-fixed resistor
JP3575973B2 (en) Variable resistor
JPS6210966Y2 (en)
KR970003317A (en) Switch
JPH0523367U (en) Push switch
JP2572660Y2 (en) Semi-fixed resistor for backside adjustment
JP3644555B2 (en) Lead frame and semiconductor device
JPS61279052A (en) Thin circuit
JPS6394602A (en) Variable resistor
JPH0414934Y2 (en)
JPS63296203A (en) Variable resistor
JPH02273725A (en) Connecting structure for liquid crystal display element
JPH0537540Y2 (en)
JPH03129801A (en) Chip variable resistor
JP2000132923A (en) Magnetic head apparatus
JPS592034U (en) Sealed limit switch
JPH04307902A (en) Variable resistor