JPH0320452U - - Google Patents
Info
- Publication number
- JPH0320452U JPH0320452U JP7924289U JP7924289U JPH0320452U JP H0320452 U JPH0320452 U JP H0320452U JP 7924289 U JP7924289 U JP 7924289U JP 7924289 U JP7924289 U JP 7924289U JP H0320452 U JPH0320452 U JP H0320452U
- Authority
- JP
- Japan
- Prior art keywords
- layer
- insulating film
- metal film
- fuse element
- layer metal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000010410 layer Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 7
- 238000009966 trimming Methods 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000011229 interlayer Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 3
Landscapes
- Semiconductor Integrated Circuits (AREA)
Description
第１図は本考案の一実施例を示す半導体装置の
フユーズ素子を含むトリミング抵抗部の平面図、
第２図は第１図のＢ−Ｂ部分の断面図、第３図は
溶断電流と金属膜配線との関係を示す図、第４図
は従来の半導体装置のフユーズ素子を含むトリミ
ング抵抗部の平面図、第５図は第４図のＡ−Ａ部
分の断面図、第６図は同じくそのトリミング回路
を示す図である。
１０……半導体基板、１１……トリミング抵抗
、１２……フユーズ素子、１３……一層目金属膜
配線、１４……溶断部、１５……二層目金属膜配
線、１６……層間絶縁膜、１７……有機絶縁膜層
、１８……無機絶縁膜層。
FIG. 1 is a plan view of a trimming resistor section including a fuse element of a semiconductor device showing an embodiment of the present invention;
Figure 2 is a cross-sectional view of the BB section in Figure 1, Figure 3 is a diagram showing the relationship between the fusing current and metal film wiring, and Figure 4 is a diagram of the trimming resistor section including the fuse element of a conventional semiconductor device. A plan view, FIG. 5 is a sectional view taken along the line A--A in FIG. 4, and FIG. 6 is a diagram showing the trimming circuit. 10... Semiconductor substrate, 11... Trimming resistor, 12... Fuse element, 13... First layer metal film wiring, 14... Fusing part, 15... Second layer metal film wiring, 16... Interlayer insulating film, 17...Organic insulating film layer, 18...Inorganic insulating film layer.
Claims (1)
、トリミング時に溶断されるフユーズ素子とを備
えた半導体装置において、前記トリミング抵抗と
フユーズ素子とが一層目金属膜配線で結線され、
前記フユーズ素子の溶断部が二層目金属膜配線で
形成され、該二層目金属膜配線と一層目金属膜配
線との間には、これらの層間絶縁を図るための層
間絶縁膜が形成され、該層間絶縁膜は、上層の有
機絶縁膜層と、下層の無機絶縁膜層とからなる二
層構造とされたことを特徴とする半導体装置。 In a semiconductor device including a trimming resistor built into a semiconductor substrate and a fuse element that is blown out during trimming, the trimming resistor and the fuse element are connected by a first layer metal film wiring,
The fusing portion of the fuse element is formed of a second-layer metal film wiring, and an interlayer insulating film is formed between the second-layer metal film wiring and the first-layer metal film wiring for insulation between these layers. . A semiconductor device, wherein the interlayer insulating film has a two-layer structure consisting of an upper organic insulating film layer and a lower inorganic insulating film layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924289U JPH0723967Y2 (en) | 1989-07-04 | 1989-07-04 | Semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7924289U JPH0723967Y2 (en) | 1989-07-04 | 1989-07-04 | Semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0320452U true JPH0320452U (en) | 1991-02-28 |
| JPH0723967Y2 JPH0723967Y2 (en) | 1995-05-31 |
Family
ID=31623226
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7924289U Expired - Lifetime JPH0723967Y2 (en) | 1989-07-04 | 1989-07-04 | Semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0723967Y2 (en) |
-
1989
- 1989-07-04 JP JP7924289U patent/JPH0723967Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0723967Y2 (en) | 1995-05-31 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |