JPH0320432U - - Google Patents
Info
- Publication number
- JPH0320432U JPH0320432U JP7876589U JP7876589U JPH0320432U JP H0320432 U JPH0320432 U JP H0320432U JP 7876589 U JP7876589 U JP 7876589U JP 7876589 U JP7876589 U JP 7876589U JP H0320432 U JPH0320432 U JP H0320432U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- intake
- sucking
- exposure processing
- periphery
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000012634 fragment Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
Description
第１図は本考案の実施例を示すウエハ露光装置
の断面図、第２図は本考案のウエハ露光装置の吸
気装置の斜視図、第３図は本考案のウエハ露光処
理工程を示す図、第４図は従来のウエハの平面図
、第５図は従来のフレーク状のホトレジスト膜の
破片が発生する状態を示す図である。
１……ウエハ、２……ウエハステージ、３……
ベース部、４……吸気ノズル、５……吸気フード
、６……配管、７……支持アーム、７′……支持
アームシリンダ。
FIG. 1 is a cross-sectional view of a wafer exposure apparatus showing an embodiment of the present invention, FIG. 2 is a perspective view of a suction device of the wafer exposure apparatus of the present invention, and FIG. 3 is a diagram showing the wafer exposure processing process of the present invention. FIG. 4 is a plan view of a conventional wafer, and FIG. 5 is a diagram showing a state in which conventional flaky photoresist film fragments are generated. 1...Wafer, 2...Wafer stage, 3...
Base portion, 4...Intake nozzle, 5...Intake hood, 6...Piping, 7...Support arm, 7'...Support arm cylinder.
Claims (1)
口を有するリング状の吸気ノズルを有し、該吸気
ノズルの内部を吸気する吸気手段を設け、露光処
理と同時に、ウエハエツヂ部及びウエハ周辺部付
近の雰囲気をウエハの外部方向に吸気することを
特徴とするウエハ露光装置。 It has a ring-shaped intake nozzle having an intake port on the circumference of the wafer periphery that has been subjected to exposure processing, and is provided with an air intake means for sucking air into the inside of the intake nozzle, and at the same time as the exposure processing, the wafer edge part and the wafer periphery are removed. A wafer exposure apparatus characterized by sucking the surrounding atmosphere toward the outside of the wafer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7876589U JPH0320432U (en) | 1989-07-05 | 1989-07-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7876589U JPH0320432U (en) | 1989-07-05 | 1989-07-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0320432U true JPH0320432U (en) | 1991-02-28 |
Family
ID=31622326
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7876589U Pending JPH0320432U (en) | 1989-07-05 | 1989-07-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0320432U (en) |
-
1989
- 1989-07-05 JP JP7876589U patent/JPH0320432U/ja active Pending