JPH0285437U - - Google Patents
Info
- Publication number
- JPH0285437U JPH0285437U JP16505588U JP16505588U JPH0285437U JP H0285437 U JPH0285437 U JP H0285437U JP 16505588 U JP16505588 U JP 16505588U JP 16505588 U JP16505588 U JP 16505588U JP H0285437 U JPH0285437 U JP H0285437U
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- photocurable resin
- lamp
- adsorbing
- irradiates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Heating, Cooling, Or Curing Plastics Or The Like In General (AREA)
Description
第１図はこの考案の光硬化型樹脂硬化装置にお
ける一実施例の概略構成を示す図で、第１図ａは
処理ステージの移動方向と直角な方向からみた側
断面図、同図ｂは処理ステージの移動方向からみ
た側断面図である。
図中、１：ランプ、８：光透過板、９：ステー
ジ、１７：処理室側壁、２３，２４：冷却風流入
孔、２５，２６：冷却風流出孔、３４：パイプ、
３４ａ：真空吸着孔、３５：水冷管。
Fig. 1 is a diagram showing a schematic configuration of an embodiment of the photocurable resin curing apparatus of this invention, Fig. 1a is a side sectional view seen from a direction perpendicular to the moving direction of the processing stage, and Fig. FIG. 3 is a side sectional view seen from the direction of movement of the stage. In the figure, 1: lamp, 8: light transmitting plate, 9: stage, 17: processing chamber side wall, 23, 24: cooling air inflow hole, 25, 26: cooling air outlet hole, 34: pipe,
34a: Vacuum adsorption hole, 35: Water cooling pipe.
Claims (1)
るランプと、被処理物吸着用の真空吸着孔及び冷
却パイプを備えた処理ステージと、光照射を受け
る被処理物を強制空冷する空冷機構とを具備した
ことを特徴とする光硬化型樹脂硬化装置。 A lamp that irradiates the photocurable resin formed on the workpiece, a processing stage equipped with a vacuum suction hole and a cooling pipe for adsorbing the workpiece, and an air cooling mechanism that forcibly cools the workpiece that is irradiated with light. A photocurable resin curing device comprising:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16505588U JPH0285437U (en) | 1988-12-22 | 1988-12-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16505588U JPH0285437U (en) | 1988-12-22 | 1988-12-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0285437U true JPH0285437U (en) | 1990-07-04 |
Family
ID=31451198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16505588U Pending JPH0285437U (en) | 1988-12-22 | 1988-12-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0285437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016724A1 (en) * | 1990-04-23 | 1991-10-31 | Tadahiro Ohmi | Resist processing device, resist processing method and resist pattern |
-
1988
- 1988-12-22 JP JP16505588U patent/JPH0285437U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1991016724A1 (en) * | 1990-04-23 | 1991-10-31 | Tadahiro Ohmi | Resist processing device, resist processing method and resist pattern |