JPH03203358A - Electronic parts mounting board - Google Patents
Electronic parts mounting boardInfo
- Publication number
- JPH03203358A JPH03203358A JP1343324A JP34332489A JPH03203358A JP H03203358 A JPH03203358 A JP H03203358A JP 1343324 A JP1343324 A JP 1343324A JP 34332489 A JP34332489 A JP 34332489A JP H03203358 A JPH03203358 A JP H03203358A
- Authority
- JP
- Japan
- Prior art keywords
- metal coating
- conductor circuit
- coating film
- electronic component
- dam frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims abstract description 56
- 229910052751 metal Inorganic materials 0.000 claims abstract description 47
- 239000002184 metal Substances 0.000 claims abstract description 47
- 239000011248 coating agent Substances 0.000 claims abstract description 42
- 238000000576 coating method Methods 0.000 claims abstract description 42
- 239000000758 substrate Substances 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 abstract description 7
- 230000035939 shock Effects 0.000 abstract description 7
- 238000009751 slip forming Methods 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 24
- 239000010410 layer Substances 0.000 description 20
- 239000010931 gold Substances 0.000 description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 239000003822 epoxy resin Substances 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 238000005530 etching Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- 229910000570 Cupronickel Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、導体回路の細線化に対応することができる電
子部品搭載用基板に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a substrate for mounting electronic components that can cope with the thinning of conductor circuits.
従来、第４図及び第５図に示すごとく、電子部品搭載用
基板９は、絶縁基板９０の凹所９５内に形成した電子部
品搭載部８と、＃ｓ電子部品搭載部８の周囲に基端部を
有すると共に絶縁基板９０上に延在形成した複数の導体
回路９１と、該導体回路９１の先端部に設けたスルーホ
ール９７とを有する。また、上記電子部品搭載部８の周
囲においては、導体回路９１の表面に電子部品接続端子
用の金属被膜９３を設けている。そして、該金属被膜９
３よりも外側の導体回路９１の表面には、絶縁膜９６を
介して、封止樹脂流出防止用のダム枠８２を接着してい
る。Conventionally, as shown in FIGS. 4 and 5, the electronic component mounting board 9 has an electronic component mounting portion 8 formed in a recess 95 of an insulating substrate 90 and a base around the #s electronic component mounting portion 8. It has a plurality of conductor circuits 91 having end portions and extending on an insulating substrate 90, and a through hole 97 provided at the tip of the conductor circuits 91. Further, around the electronic component mounting portion 8, a metal coating 93 for an electronic component connection terminal is provided on the surface of the conductor circuit 91. Then, the metal coating 9
A dam frame 82 for preventing sealing resin from flowing out is adhered to the surface of the conductor circuit 91 outside of the conductor circuit 3 through an insulating film 96.
即ち、上記電子部品搭載部８においては、上記凹所９５
の内壁に、耐湿性向上のために導体回路用のメツキと同
時形成した銅メツキ層９１１．またその上には上記金属
被膜９３用のメツキと同時形成したＮ １−Ａｕメツキ
層９２が形成されている。そして、該Ｎｉ−Ａｕメツキ
層９２の表面には、電子部品８０を接着剤８４により接
合する。That is, in the electronic component mounting portion 8, the recess 95
A copper plating layer 911. was formed on the inner wall of the 911. Furthermore, an N1-Au plating layer 92 is formed on top of the N1-Au plating layer 92, which was formed simultaneously with the plating for the metal coating 93. Then, the electronic component 80 is bonded to the surface of the Ni--Au plating layer 92 using an adhesive 84.
また、該電子部品８０と前記接続端子用の金属被膜９３
との間は、金線、アルミニウム線等のボンディングワイ
ヤ８１を接続する。Further, the electronic component 80 and the metal coating 93 for the connection terminal
A bonding wire 81 such as a gold wire or an aluminum wire is connected between.
また、上記ダム枠８２によって囲まれる電子部品搭載部
８の内部は、上記電子部品８０の周囲に。Further, the inside of the electronic component mounting section 8 surrounded by the dam frame 82 is surrounded by the electronic component 80 .
エポキシ樹脂、シリコン樹脂等の封止樹脂８６を充填す
る。また、ダム枠８２と絶縁膜９６との間は、接着剤８
３により接着する。該ダム枠８２は絶縁基板９０と同材
質のプラスチック、１いはセラミック材、金属材よりな
る。また、スルーホール９７内には、導体回路９１と同
時形成したメツキ層９１７．その表面に形成したＮ １
−Ａｕメツキ層９４が設けである。A sealing resin 86 such as epoxy resin or silicone resin is filled. Furthermore, an adhesive 8 is used between the dam frame 82 and the insulating film 96.
Glue according to step 3. The dam frame 82 is made of the same plastic material as the insulating substrate 90, ceramic material, or metal material. Also, inside the through hole 97, a plating layer 917. N 1 formed on the surface
-Au plating layer 94 is provided.
ところで、近年、電子部品の高集積化、高機能化に伴っ
て、その出力端子は増加し、また導体ビンを挿入するス
ルーホールの数も増加している。Incidentally, in recent years, as electronic components have become highly integrated and highly functional, the number of their output terminals has increased, and the number of through holes into which conductor bottles are inserted has also increased.
そのため、絶縁基板に延在形成する導体回路９１の数が
増大する。それ故、小さい表面積の絶縁基板に形成する
導体回路９１の幅は、益々小さいものが要求され、導体
回路の細線化、導体回路配線の高密度化が要求されてい
る。Therefore, the number of conductor circuits 91 formed extending on the insulating substrate increases. Therefore, the width of the conductor circuit 91 formed on an insulating substrate with a small surface area is required to be smaller and smaller, and the conductor circuit is required to be made thinner and the conductor circuit wiring is required to have a higher density.
しかしながら、上記従来の電子部品搭載用基板は、熱衝
撃等の急激な温度変化により、絶縁基板９０、封止樹脂
８６．ダム枠８２．接着剤８３等の構成材が、膨張、収
縮を繰り返す。そして、各材料はそれぞれ特有の熱膨張
率１反りを有するため、各構成材の接合部分に応力集中
を受ける。However, the above-mentioned conventional electronic component mounting board has the insulating substrate 90, the sealing resin 86. Dam frame 82. Constituent materials such as the adhesive 83 repeatedly expand and contract. Since each material has its own unique coefficient of thermal expansion 1, stress is concentrated at the bonded portion of each component.
そして、特に問題となるのは、ダム枠８２を設けた導体
回路９１の部分である。即ち、この部分は銅の導体回路
９１の上に絶縁膜９６を介してダム枠８２が設けられて
おり、これらはそれぞれ異種の材料により作られている
。そして、ダム枠８２は、電子部品搭載部８の周囲にお
いて、導体回路９１の全ての表面上に枠状に接着されて
いる。Particularly problematic is the part of the conductor circuit 91 where the dam frame 82 is provided. That is, in this part, a dam frame 82 is provided on a copper conductor circuit 91 with an insulating film 96 interposed therebetween, and these are made of different materials. The dam frame 82 is adhered to the entire surface of the conductor circuit 91 in a frame shape around the electronic component mounting section 8 .
そのため、これらの異種材料に基づく熱膨張熱収縮、こ
れに伴うストレスの発生により、導体回路９１の各金属
線（＆Ｆ］層）には大きな金属疲労が蓄積される。それ
故、該導体回路９１にはクラックが発生し、断線を生ず
る。Therefore, due to the thermal expansion and thermal contraction caused by these different materials and the generation of stress associated with this, large metal fatigue is accumulated in each metal wire (&F layer) of the conductor circuit 91. Therefore, cracks occur in the conductor circuit 91, resulting in disconnection.
このことは、導体回路９１の細線化、配線の高密度化に
伴って益々大きな問題となっている。This has become an increasingly serious problem as the conductor circuit 91 becomes thinner and the wiring density becomes higher.
本発明は、かかる従来の問題点に鑑み、導体回路の細線
化、配線高密度化に対応することができ。In view of these conventional problems, the present invention can respond to thinner conductor circuits and higher wiring density.
耐熱衝撃性に優れた電子部品搭載用基板を提供しようと
するものである。The present invention aims to provide a substrate for mounting electronic components that has excellent thermal shock resistance.
［課題の解決手段〕
本発明は、絶縁基板に形成した電子部品搭載部と、該電
子部品搭載部の周囲に基端部を有すると共に絶縁基板上
に延在形成した複数の導体回路と該導体回路の先端部に
設けたスルーホールと、上記基端部における導体回路の
表面に設けた電子部品接続端子用の金属被膜と５該金属
被膜よりも外側の導体回路表面に設けた封止樹脂流出防
止用のダム枠とを有する電子部品搭載用基板において上
記ダム枠と導体回路との間には、該導体回路上に上記接
続端子用の金属被膜を延在して形成した中間金属被膜を
設けたことを特徴とする電子部品搭載用基板にある。[Means for Solving the Problems] The present invention provides an electronic component mounting portion formed on an insulating substrate, a plurality of conductor circuits having a base end around the electronic component mounting portion and extending and formed on the insulating substrate, and the conductor. Through holes provided at the tip of the circuit, metal coating for electronic component connection terminals provided on the surface of the conductor circuit at the base end, and leakage of sealing resin provided on the surface of the conductor circuit outside of the metal coating. In the electronic component mounting board having a dam frame for prevention, an intermediate metal coating formed by extending the metal coating for the connection terminal on the conductor circuit is provided between the dam frame and the conductor circuit. A substrate for mounting electronic components is provided.
本発明において最も注目すべきことは、ダム枠と導体回
路との間に、該導体回路の表面に上記中間金属被膜を設
けたことにある。The most noteworthy feature of the present invention is that the intermediate metal coating is provided between the dam frame and the conductor circuit on the surface of the conductor circuit.
該中間金属被膜は、接続端子用の金属被膜を形成する際
に同時に形成することが好ましい、そして、該中間金属
被膜は、Ｎｉ−Ａｕメツキ、Ｎｉメツキなど上記接続端
子用の金属被膜と同材質で形成する。The intermediate metal coating is preferably formed at the same time as forming the metal coating for the connection terminal, and the intermediate metal coating is made of the same material as the metal coating for the connection terminal, such as Ni-Au plating or Ni plating. to form.
［作用及び効果〕
本発明の電子部品搭載用基板においては、ダム枠を配設
する導体回路の表面に、接続端子用の金属被膜を延在し
て形成した中間金属被膜を設けている。そのため、導体
回路の表面は中間金属被膜によって補強された状態にあ
る。[Operations and Effects] In the electronic component mounting board of the present invention, an intermediate metal coating formed by extending a metal coating for connection terminals is provided on the surface of the conductor circuit on which the dam frame is disposed. Therefore, the surface of the conductor circuit is reinforced by the intermediate metal coating.
また、該導体回路は、熱膨張係数が比較的類似している
金属の中間金属被膜により覆われている。The conductor circuit is also covered by an intermediate metal coating of metals having relatively similar coefficients of thermal expansion.
それ故、該中間金属被膜が１導体回路とダム枠との間の
熱衝撃収縮に対して、一種の緩衝層としての役割をする
。Therefore, the intermediate metal coating acts as a kind of buffer layer against thermal shock shrinkage between the one-conductor circuit and the dam frame.
それ故、導体回路が細線化されても、熱衝撃による応力
集中が生ぜず、断線を生ずるおそれがない。Therefore, even if the conductor circuit is thinned, stress concentration due to thermal shock does not occur, and there is no risk of wire breakage.
したがって９本発明によれば、細線化、配線高密度化に
対応することができ、耐熱衝撃性に優れた電子部品搭載
用基板を提供することができる。Therefore, according to the present invention, it is possible to provide a substrate for mounting electronic components that can cope with thinning of wires and higher wiring density and has excellent thermal shock resistance.
本発明の実施例にかかる電子部品搭載用基板につき、第
１図〜第３Ｆ図を用いて説明する。An electronic component mounting board according to an embodiment of the present invention will be described with reference to FIGS. 1 to 3F.
本例の電子部品搭載用基板は、第１図及び第２図に示す
ごとく、絶縁基板９０に形成した電子部品搭載部８と、
該電子部品搭載部８の周囲から絶縁基板上に延在形成し
た複数の導体回路９１と。As shown in FIGS. 1 and 2, the electronic component mounting board of this example includes an electronic component mounting portion 8 formed on an insulating substrate 90,
A plurality of conductor circuits 91 are formed extending from the periphery of the electronic component mounting portion 8 on an insulating substrate.
該導体回路９１の先端部に設けたスルーホール９７とよ
りなる。また、電子部品搭載部８の周囲における導体回
路９１の基端部の表面には電子部品接続端子用の金属被
Ｍ１０を有する。It consists of a through hole 97 provided at the tip of the conductor circuit 91. Further, the surface of the base end portion of the conductive circuit 91 around the electronic component mounting portion 8 has a metal cover M10 for an electronic component connection terminal.
モして３ ここに注目すべきことは、該金属被膜１０は
、ダム枠８２の接合部分よりも若干外方まで、スルーホ
ールの方向に向けて連続形成されダム枠８２との対向部
分において中間金属被膜１０１を形成していることであ
る。上記金属被！１１０、中間金属被１１１０１は、Ｎ
ｉメツキ及びＡｕメツキにより形成したＮｉ−Ａｕメツ
キよりなる。What should be noted here is that the metal coating 10 is continuously formed in the direction of the through-hole slightly outward from the joint part of the dam frame 82, and the metal coating 10 is formed continuously in the direction of the through hole in the part opposite to the dam frame 82. This is because a metal coating 101 is formed. Metal covering above! 110, the intermediate metal covering 11101 is N
It consists of Ni-Au plating formed by i plating and Au plating.
また、該中間金属被膜１０１の上には、第２絶縁１１１
２１及び接着剤８３を介してダム枠８２が接合しである
。また、中間金属被膜１０１とスルーホール９７のＮｉ
−Ａｕメツキ層１４との間には第１絶縁膜９６が設けで
ある。また、スルーホール９７の内壁と上記Ｎｉ−Ａｕ
メツキ層との間には、導体回路９１に連通ずる銅メツキ
層９１７が被覆しである。また、絶縁基板９０の上面に
は。Further, on the intermediate metal coating 101, a second insulating layer 111 is provided.
21 and a dam frame 82 are joined via an adhesive 83. In addition, the Ni of the intermediate metal coating 101 and the through hole 97
- A first insulating film 96 is provided between the Au plating layer 14 and the Au plating layer 14 . Moreover, the inner wall of the through hole 97 and the Ni-Au
A copper plating layer 917 communicating with the conductor circuit 91 is coated between the plating layer and the plating layer. Further, on the upper surface of the insulating substrate 90.
導体回路９１．第１絶縁膜９６が形成しである。Conductor circuit 91. A first insulating film 96 is then formed.
その他は、前記従来例の電子部品搭載用基板と同様であ
る。The rest is the same as the electronic component mounting board of the prior art example.
次に、上記電子部品搭載用基板の製造法につき第３Ａ図
〜第３Ｆ図に示す。まず、第３Ａ図に示すごとく、ガラ
スエポキシ樹脂の絶縁基板９０にスルーホール９７を穿
設すると共に、′ｇ１子部品搭載部用の凹所９５をザグ
リ加工する。Next, a method of manufacturing the electronic component mounting board is shown in FIGS. 3A to 3F. First, as shown in FIG. 3A, a through hole 97 is bored in an insulating substrate 90 made of glass epoxy resin, and a recess 95 for a 'g1 child component mounting portion is counterbored.
次に、第３Ｂ図に示すごとく、絶縁基板９０の全表面、
即ちスルーホール９７．凹所９５及び上。Next, as shown in FIG. 3B, the entire surface of the insulating substrate 90,
That is, through hole 97. Recess 95 and above.
下表面に銅メツキ９１０を被覆する。その後第３Ｃ図に
示すごと（、パターン形成のためのエツチングを行い、
導体回路９１．スルーホール内の銅メツキ層９１７を形
成する。The lower surface is coated with copper plating 910. After that, as shown in Fig. 3C, etching for pattern formation is carried out.
Conductor circuit 91. A copper plating layer 917 is formed inside the through hole.
次に、第３Ｄ図に示すごとく、上記エツチングによって
銅メツキ９１０が除去された部分、つまり導体回路９１
．スルーホール白銅メツキ層９１７以外の部分に第１絶
縁膜９６を被覆する。第１絶縁膜としては９通常、ソル
ダーレジストマスクと呼ばれるエポキシ樹脂又はトリア
ジン樹脂を用いた。Next, as shown in FIG. 3D, the portion where the copper plating 910 has been removed by the above etching, that is, the conductive circuit 91
．． A portion other than the through-hole cupronickel plating layer 917 is covered with a first insulating film 96. As the first insulating film, epoxy resin or triazine resin, which is usually called a solder resist mask, was used.
次に第３Ｅ図に示すごとく、導体回路９１及び銅メンキ
層９１７の表面に、Ｎｉメツキ及びＡｕメツキを順次行
って、Ｎｉ−Ａｕメツキ層を形成する。これにより、電
子部品搭載部に面している導体回路９１の内周部分、即
ち基端部に接続端子用の金属被膜１０が形成される。ま
た、これと同時に、該金属被膜１０が延長されたごとく
、導体回路の表面にＮ １−Ａｕメツキ層からなる中間
金属被膜１０１が形成される。即ち、導体回路９１にお
けるダム枠接合部分に、中間金属被膜１０１が同時形成
される。Next, as shown in FIG. 3E, the surfaces of the conductor circuit 91 and the copper coating layer 917 are sequentially plated with Ni and Au to form a Ni--Au plating layer. As a result, the metal coating 10 for the connection terminal is formed on the inner peripheral portion, that is, the base end portion, of the conductor circuit 91 facing the electronic component mounting portion. At the same time, an intermediate metal coating 101 consisting of an N1-Au plating layer is formed on the surface of the conductive circuit, as if the metal coating 10 were extended. That is, the intermediate metal coating 101 is simultaneously formed on the dam frame joining portion of the conductor circuit 91.
次に、第３Ｆ図に示すごとく、中間金属被ｌ１１０１上
のダム枠接合部分に、第１絶縁膜と同様の第２絶縁膜２
１を被覆する。そして、該第２絶縁膜２１上には、接着
剤８３を介して、ダム枠８２を接合する。その後は、第
１図、第２図に示すごとく、常法により電子部品搭載部
８に電子部品８０を搭載する。Next, as shown in FIG. 3F, a second insulating film 2 similar to the first insulating film is applied to the dam frame joint portion on the intermediate metal covering 1101.
1. Then, a dam frame 82 is bonded onto the second insulating film 21 via an adhesive 83. Thereafter, as shown in FIGS. 1 and 2, the electronic component 80 is mounted on the electronic component mounting section 8 by a conventional method.
上記のごとく１本例の電子部品搭載用基板においては、
導体回路９１の表面に中間金属被膜１０１、絶縁膜２１
．接着剤３を介してダム枠８２を接合している。それ故
、導体回路９１の表面は。As mentioned above, in one example of a board for mounting electronic components,
An intermediate metal coating 101 and an insulating film 21 are provided on the surface of the conductor circuit 91.
．． The dam frame 82 is joined via the adhesive 3. Therefore, the surface of the conductor circuit 91 is.
中間金属被［１０１によって被覆され、導体回路９１の
強度が向上する。The conductor circuit 91 is coated with the intermediate metal cover 101, and the strength of the conductor circuit 91 is improved.
また、該導体回路９１は、熱膨張係数が比較的類似して
いるＮｉ−Ａｕメツキ層により覆われている。その為、
該中間金属被膜１０１が、導体回１９１とダム枠８２と
の間の熱衝ｌｌに対して、−種の緩衝層としての役割を
する。Further, the conductor circuit 91 is covered with a Ni--Au plating layer having relatively similar coefficients of thermal expansion. For that reason,
The intermediate metal coating 101 serves as a buffer layer against thermal shock between the conductor circuit 191 and the dam frame 82.
それ故、導体回路が細線化されても熱衝撃による応力集
中、ストレス発生が生ぜず、断線を生ずることがない。Therefore, even if the conductor circuit is thinned, stress concentration and stress generation due to thermal shock will not occur, and wire breakage will not occur.
第１図〜第３Ｆ図は実施例の電子部品搭載用基板を示し
、第１図はその要部断面回、第２図は全体断面図、第３
Ａ図〜第３Ｆ図は製造工程説明図。
第４図及び第５図は従来の電子部品搭載用基板を示し、
第４図はその要部平面図、第５図は要部断面図である。
１０、、、接１ｊＥｆｌＩ子用の金属被膜１０１、、、
中間金属被膜。
２１、、、第２絶縁膜。
８００．電子部品搭載部
８０、、、電子部品、８２．、、ダム枠。
９０、、、絶縁基板、９１．、、導体回路。
第、￥ｋＬイ１
第２
男３０しFigures 1 to 3F show the electronic component mounting board of the embodiment, with Figure 1 being a cross-sectional view of its main parts, Figure 2 being a cross-sectional view of the whole, and Figure 3 being a cross-sectional view of the main part.
Figures A to 3F are manufacturing process explanatory diagrams. Figures 4 and 5 show conventional electronic component mounting boards,
FIG. 4 is a plan view of the main part, and FIG. 5 is a sectional view of the main part. 10, Metal coating 101 for contact 1jEflI element, .
Intermediate metal coating. 21, second insulating film. 800. Electronic component mounting section 80, electronic component, 82. ,,dam frame. 90, , insulating substrate, 91. ,,conductor circuit. 1st, ¥kL 1, 2nd man 30s
Claims (1)
部の周囲に基端部を有すると共に絶縁基板上に延在形成
した複数の導体回路と、該導体回路の先端部に設けたス
ルーホールと、 上記基端部における導体回路の表面に設けた電子部品接
続端子用の金属被膜と、該金属被膜よりも外側の導体回
路表面に設けた封止樹脂流出防止用のダム枠とを有する
電子部品搭載用基板において、 上記ダム枠と導体回路との間には、該導体回路上に上記
接続端子用の金属被膜を延在して形成した中間金属被膜
を設けたことを特徴とする電子部品搭載用基板。[Scope of Claims] An electronic component mounting portion formed on an insulating substrate, a plurality of conductor circuits having a base end around the electronic component mounting portion and extending on the insulating substrate, and a tip end of the conductor circuit. a through hole provided in the base end, a metal coating for an electronic component connection terminal provided on the surface of the conductor circuit at the base end, and a sealing resin provided on the surface of the conductor circuit outside the metal coating to prevent leakage of the sealing resin. In the electronic component mounting board having a dam frame, an intermediate metal coating formed by extending the metal coating for the connection terminal on the conductor circuit is provided between the dam frame and the conductor circuit. A board for mounting electronic components characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34332489A JP2739366B2 (en) | 1989-12-29 | 1989-12-29 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34332489A JP2739366B2 (en) | 1989-12-29 | 1989-12-29 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03203358A true JPH03203358A (en) | 1991-09-05 |
| JP2739366B2 JP2739366B2 (en) | 1998-04-15 |
Family
ID=18360645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34332489A Expired - Lifetime JP2739366B2 (en) | 1989-12-29 | 1989-12-29 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2739366B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101209306B1 (en) * | 2010-06-23 | 2012-12-06 | 엘지이노텍 주식회사 | Ceramic board, method manufacturing thereof, image censor package and method of manufacturing the same |
-
1989
- 1989-12-29 JP JP34332489A patent/JP2739366B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2739366B2 (en) | 1998-04-15 |
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