JPH03202798A - Thin film moisture sensitive element - Google Patents
Thin film moisture sensitive elementInfo
- Publication number
- JPH03202798A JPH03202798A JP16073790A JP16073790A JPH03202798A JP H03202798 A JPH03202798 A JP H03202798A JP 16073790 A JP16073790 A JP 16073790A JP 16073790 A JP16073790 A JP 16073790A JP H03202798 A JPH03202798 A JP H03202798A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- metal
- sensitive element
- moisture
- moisture sensitive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims abstract description 47
- 239000004642 Polyimide Substances 0.000 claims abstract description 17
- 229920001721 polyimide Polymers 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 16
- 239000000126 substance Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 16
- 125000004432 carbon atom Chemical group C* 0.000 claims 4
- 125000003668 acetyloxy group Chemical group [H]C([H])([H])C(=O)O[*] 0.000 claims 1
- 125000001931 aliphatic group Chemical group 0.000 claims 1
- 125000003277 amino group Chemical group 0.000 claims 1
- 125000003118 aryl group Chemical group 0.000 claims 1
- 125000004093 cyano group Chemical group *C#N 0.000 claims 1
- 125000005843 halogen group Chemical group 0.000 claims 1
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims 1
- 125000005462 imide group Chemical group 0.000 claims 1
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 claims 1
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 17
- 239000002184 metal Substances 0.000 abstract description 17
- 239000010408 film Substances 0.000 abstract description 13
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 230000035945 sensitivity Effects 0.000 abstract description 6
- 238000006243 chemical reaction Methods 0.000 abstract description 2
- 238000001074 Langmuir--Blodgett assembly Methods 0.000 abstract 1
- 229940079593 drug Drugs 0.000 abstract 1
- 239000003814 drug Substances 0.000 abstract 1
- 150000003949 imides Chemical class 0.000 abstract 1
- 238000000926 separation method Methods 0.000 abstract 1
- 238000000151 deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 4
- 239000010931 gold Substances 0.000 description 4
- 229910052737 gold Inorganic materials 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 230000004044 response Effects 0.000 description 4
- 230000004043 responsiveness Effects 0.000 description 4
- 239000003990 capacitor Substances 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910044991 metal oxide Inorganic materials 0.000 description 3
- 150000004706 metal oxides Chemical class 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 239000012528 membrane Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 150000003839 salts Chemical class 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- -1 On top of that Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000001153 fluoro group Chemical group F* 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000004753 textile Substances 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
Landscapes
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Description
【発明の詳細な説明】
童粟ミ見■且立昼
本発明は、薄膜感湿素子に関する。更に詳しくは、温度
、薬品等への耐性がすぐれ、高感度で高速応答性を有す
る薄膜感湿素子に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a thin film moisture sensitive element. More specifically, the present invention relates to a thin film moisture-sensitive element having excellent resistance to temperature, chemicals, etc., high sensitivity, and high-speed response.
瑳来坐技歪
空気中の相対湿度の制御は、精密工業、食品工業、繊維
工業、ビル管理上等で大変重要であり、それを検知する
感湿素子としては、従来次のような材料を用いたものが
知られている。Controlling the relative humidity in the air is very important in the precision industry, food industry, textile industry, building management, etc., and the moisture sensing elements that detect it have traditionally been made of the following materials. The one used is known.
(1) Se、 Ge、 Si等の金属あるいは半導体
(2) Sn、 Fe、 Ti等の金属の酸化物(3)
A 1 z O3等の多孔質金属酸化物(4) LiC
1等の電解質塩
(5)有機または無機材料からなる高分子厚膜しかしな
がら、これらの各種材料を用いた感湿素子は、いずれも
保守が大変であったり、あるいは信頼性や応答性に問題
がある等、満足される状態にはない。(1) Metals or semiconductors such as Se, Ge, Si, etc. (2) Metal oxides such as Sn, Fe, Ti, etc. (3)
Porous metal oxides such as A 1 z O3 (4) LiC
1st Class Electrolyte Salt (5) Thick Polymer Film Made of Organic or Inorganic MaterialsHowever, moisture sensing elements using these various materials are difficult to maintain, or have problems with reliability and responsiveness. However, we are not in a satisfactory state.
例えば、上記(2)の金属酸化物を用いる場合には、そ
れの成形にプレスや焼結が行われるが、均質なプレスが
問題であったりあるいは焼結時の割れなどの問題がみら
れる。また、工程上では問題なく成形されても、耐久性
、換言すれば信頼性にも問題がある。For example, when using the metal oxide of (2) above, pressing and sintering are performed to shape it, but there are problems with homogeneous pressing or cracking during sintering. Further, even if the molding is performed without any problem in the process, there is also a problem in durability, in other words, in reliability.
また、上記(5)の高分子厚膜を用いた場合には、材料
面では廉価であるものの、溶剤等の薬品による劣化や信
頼性の低下等の問題点がみられる。更に、吸湿部分の体
積が大きいため、高速化及び高感度化にも限界があり、
キャパシタを構成して、容量または電気伝導度を測定す
る場合に、その値が小さいことにより、検出系の安定度
が重要な課題となっている。ここで、高分子厚膜とは、
スピンコード等の方法により得られる厚みが数千Å以上
の高分子膜のことである。Further, when the thick polymer film of (5) above is used, although it is inexpensive in terms of material, there are problems such as deterioration due to chemicals such as solvents and a decrease in reliability. Furthermore, because the volume of the moisture-absorbing part is large, there are limits to increasing speed and sensitivity.
When measuring capacitance or electrical conductivity by configuring a capacitor, the stability of the detection system is an important issue because the value is small. Here, what is a polymer thick film?
A polymer film with a thickness of several thousand angstroms or more obtained by methods such as spin coding.
が しよ゛と る 占
ラングミュア・プロジェット法を利用して得られたポリ
イミド薄膜は、その規則的な構造のため水分の脱着速度
が速く、また、微量の水分の存在に−り誘電率、あるい
は電気伝導度が大きく変化する。更には、薄膜であるた
め、素子を構成した場合の容量および電気伝導度が比較
的大きく、検出系の低コスト化にもつながる。Polyimide thin films obtained using the Langmuir-Prodgett method have a regular structure that allows them to desorb water quickly, and the presence of a small amount of water increases the dielectric constant and Or the electrical conductivity changes significantly. Furthermore, since it is a thin film, the capacitance and electrical conductivity of the device are relatively large, which leads to a reduction in the cost of the detection system.
本発明者等は、こうしたラングミュア・プロジェット法
を利用して得られたポリイミド薄膜に注目し、非常に膜
が緻密で、ピンホールが極めて少ないため、良好な絶縁
性を有し、更に応答性向上のためにフッ素原子を骨格に
導入したポリイミド薄膜を感湿膜として、保守、信頼性
、応答性等に問題のみられる従来の感湿素子のかわりに
、感度および応答性のいずれの点においてもすぐれ、ま
た、耐熱性、耐薬品性にすぐれた薄膜感湿素子を提供す
ることを目的とする。The present inventors focused on the polyimide thin film obtained using the Langmuir-Prodgett method, and found that the film is very dense and has very few pinholes, so it has good insulation properties and has excellent responsiveness. By using a polyimide thin film with fluorine atoms introduced into its skeleton as a moisture-sensitive membrane, we have developed a new technology that improves both sensitivity and responsiveness, instead of conventional moisture-sensitive elements that have problems with maintenance, reliability, and responsiveness. It is an object of the present invention to provide a thin film moisture-sensitive element having excellent heat resistance and chemical resistance.
占 ”るための
本発明は、下式で表わされる繰返し単位を有する両親媒
性高分子物質を、
(式中、R”はいづれも炭素原子数12〜30の1価の
脂肪族の基である。〉
例えば、ラングミュア・プロジェット法により種々基板
上に積層し、それに続くイもド化反応によって作られた
ポリイミド薄膜を利用して、薄膜感湿素子を作製するこ
とによってなされたものである。ポリイミド薄膜の厚さ
は、薄膜全体にわたる水分の脱着が容易に起こるように
、1000Å以下、好ましくは500Å以下、更に好ま
しく番よ300Å以下の厚さが良い。In the present invention, an amphiphilic polymer substance having a repeating unit represented by the following formula is used. For example, a thin film moisture-sensitive element was created by using a polyimide thin film that was laminated on various substrates using the Langmuir-Prodgett method and then subjected to a chemical reaction. The thickness of the polyimide thin film is preferably 1000 Å or less, preferably 500 Å or less, and most preferably 300 Å or less so that moisture can be easily desorbed over the entire thin film.
LB法以外の方法でこのような厚みのピンホールの少な
い薄膜を得ることは困難である。It is difficult to obtain such a thin film with few pinholes by any method other than the LB method.
金属/感湿膜/金属(以下MIMという)構造の薄膜感
湿素子の模式図を、第1〜2図に示す。Schematic diagrams of a thin film moisture sensitive element having a metal/moisture sensitive membrane/metal (hereinafter referred to as MIM) structure are shown in FIGS. 1 and 2.
絶縁基板(Is)あるいは半導体基板(SS)を用い、
その上に金属、感湿膜、金属の順に形成される。用いる
金属および半導体は、酸化被膜を形成するものtも良い
。また、上部電極となる金属は、水分の出入りを容易と
するため、多孔質で、なお且つ金属的な電気伝導度を有
する程度の厚みでなくてはならない。Using an insulating substrate (Is) or a semiconductor substrate (SS),
On top of that, metal, moisture sensitive film, and metal are formed in this order. The metal and semiconductor used may also be those that form an oxide film. Further, the metal serving as the upper electrode must be porous and thick enough to have metal-like electrical conductivity in order to facilitate the entry and exit of moisture.
金属/感湿膜/半導体(以下MISという)構造の薄膜
感湿素子の模式図を、第3〜4図に示す。Schematic diagrams of a thin film moisture sensitive element having a metal/moisture sensitive film/semiconductor (hereinafter referred to as MIS) structure are shown in FIGS. 3 and 4.
半導体基板(SS)あるいは電極(M)を持つ絶縁基板
(Is)上に形成された半導体膜(S)を用い、その上
に、感湿膜、金属の順に形成される。A semiconductor film (S) formed on a semiconductor substrate (SS) or an insulating substrate (Is) having an electrode (M) is used, and a moisture sensitive film and a metal are formed thereon in this order.
用いる金属および半導体は、酸化被膜を形成するもので
も良い。また、上部電極となる金属は、水分の出入りを
容易とするため、多孔質で、なお且つ金属的な電気伝導
度を有する程度の厚みでなくてはならない。The metal and semiconductor used may be those that form an oxide film. Further, the metal serving as the upper electrode must be porous and thick enough to have metal-like electrical conductivity in order to facilitate the entry and exit of moisture.
これらのMIM、及びMIS型の素子は、ラングミュア
・プロジェット法で得られたポリイミド薄膜が、数人の
厚さでも良好な電気絶縁性を持ち、一般に使用される薬
品におかされないことより、耐薬品性に優れたキャパシ
ター、つまり薄膜感湿素子となる。また、ポリイミドが
高耐熱性であることより、通常感湿素子を使用する温度
では、全く劣化しないキャパシター、つまり薄膜感湿素
子となる。These MIM and MIS type devices are highly resistant because the polyimide thin film obtained by the Langmuir-Prodgett method has good electrical insulation properties even at a thickness of several people and is not affected by commonly used chemicals. It becomes a capacitor with excellent chemical properties, that is, a thin film moisture-sensitive element. Furthermore, since polyimide has high heat resistance, it becomes a capacitor, that is, a thin film moisture sensitive element, which does not deteriorate at all at the temperatures at which humidity sensitive elements are normally used.
発IセM幕肱果
本発明により、温度、薬品等への耐性がすぐれ、高感度
で高速応答性の感湿薄膜素子の提供が可能となった。ま
た、素子を構成した場合の容量および電気伝導度が比較
的大きく、検出系の低コスト化も達成できる。The present invention has made it possible to provide a moisture-sensitive thin film element with excellent resistance to temperature, chemicals, etc., high sensitivity, and high-speed response. Furthermore, the capacitance and electrical conductivity of the device are relatively large, and the cost of the detection system can be reduced.
尖施班 次に実施例によって、本発明を説明する。Sharp treatment group Next, the present invention will be explained by examples.
実施例1
ガラス基板上に、アルミニウムを蒸着して電極を形成し
た基板の上に、下図の繰返し単位を持つ両親媒性高分子
物質をラングミュア・プロジェット法により41層累積
した。その後、400″Cで1時間熱処理を施しイミド
化を完結させた。得られたポリイミド薄膜は、200Å
である。形成されたポリイミド薄膜の上に、電極幅10
0μm、電極間隔500μmの櫛形の金を500人の厚
さに抵抗加熱法で蒸着して、MIM型の薄膜感湿素子を
作製した。Example 1 On a glass substrate on which electrodes were formed by vapor-depositing aluminum, 41 layers of an amphiphilic polymer material having repeating units shown in the figure below were accumulated by the Langmuir-Prodgett method. Thereafter, heat treatment was performed at 400"C for 1 hour to complete imidization. The obtained polyimide thin film had a thickness of 200 Å
It is. On the formed polyimide thin film, an electrode width of 10
A MIM-type thin film moisture-sensitive element was fabricated by depositing comb-shaped gold with a thickness of 0 μm and an electrode spacing of 500 μm using a resistance heating method.
この程度の厚さの金は、多孔質で、なお且つ金属的な電
気伝導度を有し、水分の出入りが容易である。Gold of this thickness is porous and has metallic electrical conductivity, allowing moisture to easily enter and exit.
このようにして構成された薄膜感湿素子を、湿度試験層
に取りつけ、YHP4192Aインピーダンスアナライ
ザーに接続した後、周波数を一定(IKHz)に保ちな
がら、11〜92%の相対湿度に対応するキャパシタン
スの変化を20℃の温度で測定した。得られた結果を、
第5図のグラフに示す。この結果から、キャパシタンス
により相対湿度を高感度で測定することができる感湿素
子としての有効性が確かめられた。もちろん、電気伝導
度によっても、対応湿度を測定することができる。After attaching the thin film moisture sensitive element thus constructed to the humidity test layer and connecting it to a YHP4192A impedance analyzer, the change in capacitance corresponding to relative humidity from 11 to 92% was measured while keeping the frequency constant (IKHz). was measured at a temperature of 20°C. The obtained results,
This is shown in the graph of FIG. This result confirmed its effectiveness as a humidity sensing element that can measure relative humidity with high sensitivity using capacitance. Of course, the corresponding humidity can also be determined by electrical conductivity.
相対湿度の変化に対する、キャパシタンス、電気伝導度
の変化は、5秒以内に完結し、この薄膜感湿素子が高速
応答性を有することも確かめられた。Changes in capacitance and electrical conductivity in response to changes in relative humidity were completed within 5 seconds, confirming that this thin film moisture-sensitive element had high-speed response.
実施例2
金でオーミック接触をとり、裏面電極を形成したシリコ
ン基板に、実施例1と同様の方法でポリイミド薄膜を形
成した。形成されたポリイミド薄膜の上に、電極幅10
0μm、電極間隔500μmの櫛形の金を500人の厚
さに抵抗加熱法で蒸着して、MIS型の薄膜感湿素子を
作製した。Example 2 A polyimide thin film was formed in the same manner as in Example 1 on a silicon substrate on which ohmic contact was made with gold and a back electrode was formed. On the formed polyimide thin film, an electrode width of 10
A MIS-type thin film moisture-sensitive element was fabricated by depositing comb-shaped gold with a thickness of 0 μm and an electrode spacing of 500 μm using a resistance heating method.
このようにして構成された薄膜感湿素子も、実施例1O
MIM型の薄膜感湿素子と同様の性質を有し、薄膜感湿
素子としての有効性が確かめられた。The thin film moisture sensitive element constructed in this manner also has the structure of Example 1O.
It has properties similar to MIM type thin film moisture sensitive elements, and its effectiveness as a thin film moisture sensitive element has been confirmed.
尚、本実施例において、感湿膜の形成法としてラングミ
ュア・プロジェット法として垂直浸漬法を用いたが、一
般的に知られている回転円筒法や水平付着法を用いても
良い。In this example, a vertical immersion method as a Langmuir-Prodgett method was used as a method for forming the moisture-sensitive film, but a generally known rotating cylinder method or horizontal deposition method may also be used.
実施例3
下図の繰り返し単位を持つ両親媒性高分子物質を用いて
、実施例1と同様の方法でMIM型の薄膜感湿素子を作
製した。Example 3 A MIM type thin film moisture sensitive element was produced in the same manner as in Example 1 using an amphiphilic polymer substance having the repeating units shown in the figure below.
この様にして作製された薄膜感湿素子も、実施例1と同
様の性質を有し、薄膜感湿素子としてのこの様にして作
製された薄膜感湿素子も、実施例1と同様の性質を有し
、薄膜感湿素子としての有効性が確かめられた。The thin film moisture sensitive element produced in this way also has the same properties as Example 1, and the thin film moisture sensitive element produced in this way as a thin film humidity sensitive element also has the same properties as Example 1. , and its effectiveness as a thin film moisture-sensitive element was confirmed.
第1図〜第2図は、MIM型の薄膜感湿素子の模式図で
あり、第3図〜第4図は、MIS型の薄膜感湿素子の模
式図である。第5図は、実施例1に記載したM I M
型の薄膜感湿素子の、相対湿度に対するキャパシタンス
の変化を示すグラフである。
(符号の説明)
M・・・・・電極
I・・・・感湿膜
S・・・・半導体
Is・・・絶縁性基板
SS・・・半導体基板
有効性が確かめられた。
実施例4
下図の繰り返し単位を持つ両親媒性高分子物質を用いて
、熱処理温度を300度とすることを除いて、実施例1
と同様の方法でMIM型の薄膜感湿素子を作製した。
第1図
第2図
@3図
第4図1 to 2 are schematic diagrams of an MIM type thin film moisture sensitive element, and FIGS. 3 to 4 are schematic diagrams of an MIS type thin film moisture sensitive element. FIG. 5 shows the M I M described in Example 1.
2 is a graph showing changes in capacitance with respect to relative humidity of a type of thin film moisture sensitive element. (Explanation of symbols) M...Electrode I...Moisture sensitive film S...Semiconductor Is...Insulating substrate SS...Semiconductor substrate The effectiveness was confirmed. Example 4 Example 1 except that an amphiphilic polymer material having the repeating unit shown in the figure below was used and the heat treatment temperature was 300 degrees.
An MIM-type thin film moisture-sensitive element was produced in the same manner as described above. Figure 1 Figure 2 @ Figure 3 Figure 4
Claims (2)
▲数式、化学式、表等があります▼(1) (式中、R^1は少なくとも2個の炭素原子を含有する
4価の基)厚みが1000Å以下のポリイミド薄膜を含
む薄膜感湿素子。(1) Mainly has a repeating unit structure of the following formula (1),
▲There are mathematical formulas, chemical formulas, tables, etc.▼ (1) (In the formula, R^1 is a tetravalent group containing at least two carbon atoms) A thin film moisture-sensitive element containing a polyimide thin film with a thickness of 1000 Å or less.
▲数式、化学式、表等があります▼(2) 〔式中、R^1は少なくとも2個の炭素原子を含有する
4価の基、R^2は ▲数式、化学式、表等があります▼ R^3、R^4、R^5およびR^6は、脂肪族、環状
脂肪族あるいは芳香族(これらが相互に組合わさっても
良い)の炭素数1〜30の1価の基(これらの基がハロ
ゲン原子、ニトロ基、アミノ基、シアノ基、メトキシ基
、アセトキシ基で置換されていても良い)または水素原
子であり、R^3、R^4、R^5およびR^6の少な
くとも1個は炭素数12〜30の基である。〕 両性ポリイミド前駆体を、ラングミュア・ブロジェット
法により基板上に積層し、200℃〜450℃の温度で
、部分的あるいは完全にイミド環に変換した、厚さが1
000Å以下のポリイミド薄膜を含む薄膜感湿素子。(2) Mainly has a repeating unit structure of the following formula (2),
▲There are mathematical formulas, chemical formulas, tables, etc.▼ (2) [In the formula, R^1 is a tetravalent group containing at least two carbon atoms, and R^2 is ▲There are mathematical formulas, chemical formulas, tables, etc.▼ R ^3, R^4, R^5 and R^6 are aliphatic, cycloaliphatic or aromatic (these may be combined with each other) monovalent groups having 1 to 30 carbon atoms (these The group may be substituted with a halogen atom, a nitro group, an amino group, a cyano group, a methoxy group, an acetoxy group) or a hydrogen atom, and at least R^3, R^4, R^5 and R^6 One is a group having 12 to 30 carbon atoms. ] An amphoteric polyimide precursor was laminated on a substrate by the Langmuir-Blodgett method, and at a temperature of 200°C to 450°C, it was partially or completely converted into an imide ring, and a thickness of 1.
A thin film moisture sensitive element containing a polyimide thin film with a thickness of 000 Å or less.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16073790A JPH03202798A (en) | 1989-10-05 | 1990-06-19 | Thin film moisture sensitive element |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26094589 | 1989-10-05 | ||
JP1-260945 | 1989-10-05 | ||
JP16073790A JPH03202798A (en) | 1989-10-05 | 1990-06-19 | Thin film moisture sensitive element |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH03202798A true JPH03202798A (en) | 1991-09-04 |
Family
ID=26487145
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16073790A Pending JPH03202798A (en) | 1989-10-05 | 1990-06-19 | Thin film moisture sensitive element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH03202798A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102432878A (en) * | 2011-09-05 | 2012-05-02 | 东华大学 | Humidity-sensitive polyimide, preparation and applications thereof |
WO2018181037A1 (en) * | 2017-03-29 | 2018-10-04 | 三菱瓦斯化学株式会社 | Polyimide, polyimide solution, and polyimide film |
-
1990
- 1990-06-19 JP JP16073790A patent/JPH03202798A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102432878A (en) * | 2011-09-05 | 2012-05-02 | 东华大学 | Humidity-sensitive polyimide, preparation and applications thereof |
WO2018181037A1 (en) * | 2017-03-29 | 2018-10-04 | 三菱瓦斯化学株式会社 | Polyimide, polyimide solution, and polyimide film |
JPWO2018181037A1 (en) * | 2017-03-29 | 2019-12-12 | 三菱瓦斯化学株式会社 | Polyimide, polyimide solution and polyimide film |
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