JPH03199059A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH03199059A JPH03199059A JP34264789A JP34264789A JPH03199059A JP H03199059 A JPH03199059 A JP H03199059A JP 34264789 A JP34264789 A JP 34264789A JP 34264789 A JP34264789 A JP 34264789A JP H03199059 A JPH03199059 A JP H03199059A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- wear
- electrode
- resistant layer
- resistor layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 239000000470 constituent Substances 0.000 claims 2
- 238000007639 printing Methods 0.000 abstract description 20
- 238000004544 sputter deposition Methods 0.000 abstract description 6
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 3
- 238000005530 etching Methods 0.000 abstract 2
- 238000005299 abrasion Methods 0.000 description 10
- 239000010408 film Substances 0.000 description 8
- 238000000034 method Methods 0.000 description 8
- 238000000206 photolithography Methods 0.000 description 7
- 239000010409 thin film Substances 0.000 description 5
- 239000005388 borosilicate glass Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 150000002902 organometallic compounds Chemical class 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000001856 Ethyl cellulose Substances 0.000 description 1
- ZZSNKZQZMQGXPY-UHFFFAOYSA-N Ethyl cellulose Chemical compound CCOCC1OC(OC)C(OCC)C(OCC)C1OC1C(O)C(O)C(OC)C(CO)O1 ZZSNKZQZMQGXPY-UHFFFAOYSA-N 0.000 description 1
- 101000874049 Magnolia grandiflora Beta-cubebene synthase Proteins 0.000 description 1
- WUOACPNHFRMFPN-UHFFFAOYSA-N alpha-terpineol Chemical compound CC1=CCC(C(C)(C)O)CC1 WUOACPNHFRMFPN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- SQIFACVGCPWBQZ-UHFFFAOYSA-N delta-terpineol Natural products CC(C)(O)C1CCC(=C)CC1 SQIFACVGCPWBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920001249 ethyl cellulose Polymers 0.000 description 1
- 235000019325 ethyl cellulose Nutrition 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- -1 gold organometallic compound Chemical class 0.000 description 1
- 239000005355 lead glass Substances 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229910001925 ruthenium oxide Inorganic materials 0.000 description 1
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 229940116411 terpineol Drugs 0.000 description 1
- 229910052845 zircon Inorganic materials 0.000 description 1
Landscapes
- Electronic Switches (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明はファクシミリ、フルカラープリン久ワープロな
どの記録装置に関すん
従来の技術
熱転黒感熱印字方式プリンタなどの印字装置に用いられ
るサーマルヘッド（主 従来 次の二つの種類のものか
あも 第一のもの（友 第５図に示すように グレーズ
層（ｌｌａ）を被覆したアルミナような絶縁基板（１１
）の上に 蒸着、スパッタリングのような真空薄膜形成
プロセスにより得たＴａ−３ｉのような抵抗体層（１２
）、Ｎｉ、 Ｃｒのような電極層（１３゜１４）、Ｓｉ
Ｃのような耐磨耗層（１５）をホトリソエツチング法を
もちいてパターン形成したもので、いわゆる薄膜型と呼
ばれるものであも 第二のものは第６図に示すように
グレーズ層（２１ａ）を被覆した絶縁性基板（２１）の
上に 電極層（２３，２４）、抵抗体層（２２）、耐摩
耗層（２５）、それぞれをペーストの印刷焼成により形
成するものでいわゆる厚膜型と呼ばれるものであも
発明が解決しようとする課題
しかしなか板 上記従来技術においては発熱部の熱は等
方向に周辺部に広がり、発色部の形状はその熱の広がり
によって定まってしまう。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to recording devices such as facsimiles and full-color printing word processors. The following two types of substrates are used: The first type (component) is an insulating substrate (11
) on which a resistor layer (12
), electrode layers such as Ni, Cr (13°14), Si
The second type is a so-called thin film type, in which a wear-resistant layer (15) like C is patterned using photolithography.The second type is as shown in Figure 6.
On the insulating substrate (21) covered with the glaze layer (21a), electrode layers (23, 24), resistor layer (22), and wear-resistant layer (25) are formed by printing and baking a paste. Problems to be Solved by the Invention in the So-called Thick Film Type However, in the above-mentioned conventional technology, the heat of the heat generating part spreads to the peripheral part in the same direction, and the shape of the coloring part is determined by the spread of the heat. Put it away.
本発明は その熱の広がり方を制御して印字効率と印字
品質に優れたサーマルヘッドを提供することを目的とす
も
課題を解決するための手段
本発明（友 表面が絶縁性である基板上に一方の電極群
の間に他の電極群の各電極を配して電極列を形成し 前
記画電極と接している抵抗体層を設け、前記電極と前記
抵抗体層上に耐摩耗層を形成し 前記耐摩耗層はその幅
方向に熱伝導率の異なる部分を設けたことを特徴とする
サーマルヘッドである。The purpose of the present invention is to provide a thermal head with excellent printing efficiency and print quality by controlling the way the heat spreads. each electrode of another electrode group is arranged between one electrode group to form an electrode array, a resistor layer is provided in contact with the picture electrode, and a wear-resistant layer is provided on the electrode and the resistor layer. The thermal head is characterized in that the wear-resistant layer has portions having different thermal conductivities in its width direction.
作用
本発明は 抵抗体層上にライン状に熱伝導率の異なる部
分を有する耐摩耗層を有するサーマルヘッドであり、抵
抗体層で発生した無が耐摩耗層のライン状の熱伝導率が
高い部分を通って優先的にインクリボン・用紙の方に伝
わり、印字効率と印字品質の優れたサーマルヘッドが得
られも実施例
（実施例１）
本発明の一実施例を第１図を用いて説明すも第１図（よ
本発明を適用した対向型のサーマルヘッドであも 第
１図において、 １ａはグレーズ凰ｌは基板、 ２は抵
抗体層 ３は共通型￥ｉ！、４は個別電極 ５と６は本
発明の耐磨耗層玄 ５は６に比べて熱伝導率の低い耐摩
耗Ｍ、６はライン状玄５に比べて熱伝導率の高い耐摩耗
層であもこのとき、抵抗体層（２）は共通電極（３）と
個別電極（４）の上であっても下であってもよへ 抵抗
体層（２）で発生した熱が選択的に ライン状の熱伝導
率の比較的高い耐摩耗層（６〉の部分を通り、ヘッドの
表面に伝われる事が好ましく、耐摩耗層のライン状の部
分（６）が 耐摩耗層のそれ以外の部分（５）に比べて
熱伝導率が高ければよ賎 また 耐摩耗層の熱伝導率の
高い部分（６）のラインの幅ｔｉｔ、 抵抗体層（２
）の発熱部分の幅より大きいことが望ましｔｌな抵 本
発明は基本的に電極パターンによら武例えば 第２図に
示すように千鳥型にも適用することが可能である。第２
図において、 １ａはグレズ恩 １は基板 ２は抵抗体
層 ３は共通電極４は個別電極 ５と６は本発明の耐磨
耗層玄 ５は６に比べて熱伝導率の低い耐摩耗ｙｆＬ６
はライン状で、 ５に比べて熱伝導率の高い耐摩耗層で
ある。また 厚膜形成法や薄膜形成法のようにサーマル
ヘッドの製造方法にもよらな賎
（実施例２）
本発明のサーマルヘッドの製造方法の一実施例について
、第３図を用いて説明すも 第３図において、 ｌａは
グレーズ凰 １は基Ｋ ２は抵抗体＃ ３、４は電極
５と６は本発明の耐磨耗層で、５は６に比べて熱伝導率
の低い耐摩耗層 ６はライン状で、 ５に比べて熱伝導
率の高い耐摩耗層であも 厚さ０．８ｍｍのグレーズア
ルミナ基板１，１ａの上にスパッタリングでＴａＳｉの
抵抗体層２を形威しん その上に スパッタリングとホ
トリソエツチングによってＡｕの電極層３．４を形成し
ｔうそれかべ その上にスパッタリングでＳｉＣの被膜
を形成後、ホトリソエツチングでライン状のパターンを
除去して、熱伝導率の低い耐摩耗層５を形威した そし
て最後に ダイアモンドライクカーボンを蒸着、ホトリ
ソエツチングして、ライン状の耐摩耗層６を形成しｔら
（実施例３）
本発明のサーマルヘッドの製造方法の１実施例について
、第４図を用いて説明すも 第４図において、 １ａは
グレーズＢｔは基板 ２は抵抗体層 ３、４は電極 ５
と６は本発明の耐磨耗層玄５は６に比べて熱伝導率の低
い耐摩耗＃ ６はライン状で、 ５に比べて熱伝導率の
高い耐摩耗層であも 厚さ０．８ｍｍのグレーズアルミ
ナ基板１，１ａの上にＡｕの有機金属化合物ペーストの
印刷焼点ホトリソエツチングによって電極層３，４を形
成した それか転 その基板上にＲｕｄｅ−ガラスフリ
ット系ペーストの印刷焼成法によりライン状の抵抗体層
２を形威しｔも その上にＭｇの有機金属化合物ペー
ストをスクリーン印刷してライン状の被膜を形成り、
８００℃で加熱処理することにより、ライン状の熱伝
導率の比較的高い耐摩耗層６を形成し さらにホウケイ
酸鉛系ガラスペーストの印刷焼成により熱伝導率の低い
耐磨耗層５を形成した。Function The present invention is a thermal head having an abrasion resistant layer having linear portions with different thermal conductivities on a resistor layer, where the voids generated in the resistor layer have high linear thermal conductivity in the abrasion resistant layer. Example (Example 1) An example of the present invention will be described using FIG. 1. The explanation is as shown in Fig. 1 (see below).In Fig. 1, 1a is the glaze layer, 1 is the substrate, 2 is the resistor layer, 3 is the common type, and 4 is the individual type. Electrodes 5 and 6 are wear-resistant layers of the present invention. 5 is a wear-resistant M with a lower thermal conductivity than 6, and 6 is a wear-resistant layer with a higher thermal conductivity than the linear layer 5. , the resistor layer (2) can be placed above or below the common electrode (3) and individual electrodes (4).The heat generated in the resistor layer (2) selectively forms a line-shaped heat. It is preferable that the conductivity is transmitted to the surface of the head through the abrasion resistant layer (6) with relatively high conductivity, and the line-shaped part (6) of the abrasion resistant layer is the other part (5) of the abrasion resistant layer. The width of the line of the high thermal conductivity part (6) of the wear-resistant layer, the resistance layer (2)
) is desirably larger than the width of the heat-generating portion.The present invention can basically be applied to a staggered pattern, for example, as shown in FIG. 2, depending on the electrode pattern. Second
In the figure, 1a is a glass layer, 1 is a substrate, 2 is a resistor layer, 3 is a common electrode, 4 is an individual electrode, 5 and 6 are a wear-resistant layer of the present invention, and 5 is a wear-resistant layer with a lower thermal conductivity than 6.
is a line-shaped wear-resistant layer with higher thermal conductivity than 5. In addition, depending on the method of manufacturing the thermal head, such as the thick film forming method or the thin film forming method (Example 2), an example of the method of manufacturing the thermal head of the present invention will be explained with reference to FIG. In Figure 3, la is the glaze, 1 is the base K, 2 is the resistor #3 and 4 are the electrodes.
5 and 6 are abrasion resistant layers of the present invention, 5 is an abrasion resistant layer with a lower thermal conductivity than 6, and 6 is a linear abrasion resistant layer with a higher thermal conductivity than 5. A TaSi resistor layer 2 is formed on a 0.8 mm glazed alumina substrate 1, 1a by sputtering, and an Au electrode layer 3, 4 is formed thereon by sputtering and photolithography. After forming a SiC film on top by sputtering, the line-shaped pattern was removed by photolithography to form a wear-resistant layer 5 with low thermal conductivity.Finally, diamond-like carbon was vapor-deposited and photolithographically etched. (Embodiment 3) An embodiment of the method for manufacturing a thermal head of the present invention will be described with reference to FIG. 4. In FIG. 4, 1a is a glaze. Bt is the substrate 2 is the resistor layer 3 and 4 are the electrodes 5
and 6 are wear-resistant layers of the present invention, and wear-resistant layer 5 has a lower thermal conductivity than layer 6. Wear-resistant layer #6 has a line shape and has a higher thermal conductivity than layer 5, but has a thickness of 0. Electrode layers 3 and 4 were formed on 8 mm glazed alumina substrates 1 and 1a by printing and baking point photolithography of an organic metal compound paste of Au. A line-shaped resistor layer 2 is formed by screen-printing Mg organometallic compound paste on top of the line-shaped resistor layer 2 to form a line-shaped film.
A linear wear-resistant layer 6 with relatively high thermal conductivity was formed by heat treatment at 800°C, and a wear-resistant layer 5 with low thermal conductivity was further formed by printing and firing a lead borosilicate glass paste. .
な叙 耐摩耗層の形成方法としてスクリーン印刷法を用
いた例を示した力交 デイツプ汰 スピンナー法 ロー
ルコート法やスプレー法のような厚膜形成法とホトリソ
エツチングを用いて、耐摩耗層を形成してもよＬｌ
（実施例４）
抵抗体層上に Ｍｇの有機金属化合物ペーストをデイツ
プコーティングして被膜を形成ＬＡ８゜０℃で加熱処理
後、ホトリソエツチングして、ライン状の熱伝導率の比
較的高い耐摩耗層を形成獣さらにホウケイ酸鉛系ガラス
ペーストの印刷焼成により熱伝導率の低い耐磨耗層を形
成した 他は実施例２に同眺
（実施例５）
熱伝導率の低い耐摩耗層５として、５ｉＣ１ＳｉａＮ４
、 Ｓｉ ○２、 ＺｒＯ２、Ａｌｅ○掌、Ｈｆ ○２
、 ＴｉＯ２、Ｔａ２０５、 Ｍｇ５ｉＯ雪、Ｍｇ２５
ｉＱ４、 ＺｒＳｉＯ４、ＣａＯ−Ｚｒｏｇ、３Ａ１２
０ｓ・２Ｓｉ○２、そしてライン状の耐摩耗層６として
、Ｃ（ダイアモンド）を選ん氾 他は実施例２に同眺
第１表に作成したサーマルヘッドの印字熱効率を示も
な耘 印字熱効率（上 感熱記録紙へ反射濃度１．０の
記録を与えるに要した電気エネルギーを特定の大きさの
ドツト当りの値で表した
（実施例６）
熱伝導率の低い耐摩耗層５として、Ｍｇ５ｉＯ雪、そし
てライン状の耐摩耗層６として、Ｃ（ダイアモンド）、
ダイアモンドライクカーボン、Ｂ Ｎ。This article shows an example of using screen printing as a method for forming an abrasion resistant layer. Spinner method The abrasion resistant layer can be formed using a thick film forming method such as a roll coating method or a spray method and photolithography. (Example 4) Form a film by deep coating Mg organometallic compound paste on the resistor layer.After heat treatment at LA8°0C, photolithography is performed to form a line-shaped heat treatment. A wear-resistant layer with a relatively high conductivity was formed. Furthermore, a wear-resistant layer with a low thermal conductivity was formed by printing and firing a lead borosilicate glass paste. The rest was the same as Example 2 (Example 5). Heat conduction 5iC1SiaN4 as the wear-resistant layer 5 with a low
, Si ○2, ZrO2, Ale○ palm, Hf ○2
, TiO2, Ta205, Mg5iO snow, Mg25
iQ4, ZrSiO4, CaO-Zrog, 3A12
0s・2Si○2, and C (diamond) was selected as the line-shaped wear-resistant layer 6.The rest is the same as Example 2.
Table 1 shows the printing thermal efficiency of the created thermal head.
Printing thermal efficiency (Part 1) The electrical energy required to record a reflection density of 1.0 on thermal recording paper is expressed as the value per dot of a specific size (Example 6) Wear-resistant layer with low thermal conductivity 5 is Mg5iO snow, and the line-shaped wear-resistant layer 6 is C (diamond).
Diamond-like carbon, BN.
Ｂｅｄ、ＡＩＮ、ＳｉＣを選ん氾 他は実施４？Ｉ１２
に同ａ 第２表に作成したサーマルヘッドの印字熱効率
を示す。な叙 印字熱効率（友 感熱記録紙へ反射濃度
１．０の記録を与えるに要した電気エネルギーを特定の
大きさのドツト当りの値で表し九第１表
第２表
（比較例１）
厚さ０．８ｍｍのグレーズアルミナ基板の上に金の有機
金属化合物ペーストの印刷焼成 ホトリソエツチングに
よって電極層を形成した それかべ その基板上に 酸
化ルテニウム粉末とホウケイ酸ガラスフリットとエチル
セルローズとターピネオールとの混合抵抗ペーストを用
１．） 印刷焼成法によりライン状の抵抗体層を形成
した 最後にホウケイ酸鉛系ガラスペーストの印刷焼成
により耐磨耗層を形成し丸
（比較例２）
薄膜形成法により作製しｔラ 他は比較例１に同じ。Bed, AIN, SiC are selected, others are implementation 4? I12
Table 2 shows the printing thermal efficiency of the prepared thermal head. Printing thermal efficiency (comparison) The electrical energy required to record a reflection density of 1.0 on thermal recording paper is expressed as the value per dot of a specific size. Table 1 Table 2 (Comparative Example 1) Thickness An electrode layer was formed by printing and baking a gold organometallic compound paste on a 0.8 mm glazed alumina substrate and photolithography.On that substrate, ruthenium oxide powder, borosilicate glass frit, ethyl cellulose, and terpineol were applied. Using a mixed resistance paste 1.) A line-shaped resistor layer was formed by printing and baking.Finally, a wear-resistant layer was formed by printing and baking a borosilicate lead glass paste (Comparative Example 2).Thin film formation method was used. The preparation was the same as in Comparative Example 1.
第３表に本発明の実施例によるサーマルヘッドの特性を
示す。な抵 印字熱効率（友 感熱記録紙へ反射濃度１
．Ｏの記録を与えるに要した電気エネルギーを特定の大
きさのドツト当りの値で表した
発明の効果
以上記載のように 本発明によれば 抵抗体層で発生し
た熱力交 耐摩耗層のライン状の熱伝導率が高い部分を
通って優先的にインクリボン・用紙の方に伝わり、印字
効率と印字品質の優れたサーマルヘッドが得られも
第３表Table 3 shows the characteristics of the thermal head according to the embodiment of the present invention. Printing thermal efficiency (reflection density 1 on thermal recording paper)
．． Effect of the invention in which the electrical energy required to give a record of O is expressed as a value per dot of a specific size.As described above, according to the present invention, thermal force exchange generated in the resistor layer Line shape of the wear-resistant layer Thermal conductivity is preferentially transferred to the ink ribbon/paper through the parts with high heat conductivity, resulting in a thermal head with excellent printing efficiency and printing quality, as shown in Table 3.
第１図および第２図はそれぞれ本発明を適用した対向型
と千鳥型のサーマルヘッドの構成猛 第３図および第４
図はそれぞれ本発明を適用した薄膜型と厚膜型のサーマ
ルヘッドの構成は 第５図および第６図はそれぞれ従来
の薄膜型および厚膜型のサーマルヘッドの構成図であもFigures 1 and 2 show the configurations of opposing type and staggered type thermal heads to which the present invention is applied, respectively.
The figures show the configurations of a thin film type and thick film type thermal head to which the present invention is applied, respectively. Figures 5 and 6 show the configurations of a conventional thin film type and thick film type thermal head, respectively.
Claims (3)
れた複数の端部を有する共通電極と、前記共通電極の端
部相互間に配した複数の個別電極と、前記共通電極の端
部と個別電極からなる電極列に接して配した抵抗体層と
、前記電極および前記抵抗体層上に形成した耐摩耗層を
構成要素とし、前記耐摩耗層は前記抵抗体層上の前記電
極列方向に直交する方向において、熱伝導率の異なる部
分を有することを特徴とするサーマルヘッド。(1) A substrate with an insulating surface, a common electrode formed on the substrate and having a plurality of ends, a plurality of individual electrodes arranged between the ends of the common electrode, and a common electrode formed on the substrate. The constituent elements include a resistor layer disposed in contact with an electrode array consisting of an end portion and an individual electrode, and a wear-resistant layer formed on the electrode and the resistor layer, and the wear-resistant layer is formed on the resistor layer. A thermal head characterized by having portions having different thermal conductivities in a direction perpendicular to an electrode row direction.
り大きいことを特徴とする請求項１記載のサーマルヘッ
ド。(2) The thermal head according to claim 1, wherein the thermal conductivity of the center portion of the wear-resistant layer is higher than that of the end portions.
ｒ、Ｈｆ、Ｔｉ、Ｍｇ、Ｃａ、Ｓｒ、Ｔａの群から選ば
れた元素を含むことを特徴とする請求項１記載のサーマ
ルヘッド。(3) C, Si, Al, Z as constituent components of the wear-resistant layer
The thermal head according to claim 1, characterized in that it contains an element selected from the group consisting of r, Hf, Ti, Mg, Ca, Sr, and Ta.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34264789A JPH03199059A (en) | 1989-12-28 | 1989-12-28 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP34264789A JPH03199059A (en) | 1989-12-28 | 1989-12-28 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03199059A true JPH03199059A (en) | 1991-08-30 |
Family
ID=18355398
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP34264789A Pending JPH03199059A (en) | 1989-12-28 | 1989-12-28 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03199059A (en) |
-
1989
- 1989-12-28 JP JP34264789A patent/JPH03199059A/en active Pending
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