JPH0319275Y2 - - Google Patents

Info

Publication number
JPH0319275Y2
JPH0319275Y2 JP1984016496U JP1649684U JPH0319275Y2 JP H0319275 Y2 JPH0319275 Y2 JP H0319275Y2 JP 1984016496 U JP1984016496 U JP 1984016496U JP 1649684 U JP1649684 U JP 1649684U JP H0319275 Y2 JPH0319275 Y2 JP H0319275Y2
Authority
JP
Japan
Prior art keywords
container
refrigerant
board
liquid cooling
liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1984016496U
Other languages
English (en)
Japanese (ja)
Other versions
JPS60129195U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1649684U priority Critical patent/JPS60129195U/ja
Publication of JPS60129195U publication Critical patent/JPS60129195U/ja
Application granted granted Critical
Publication of JPH0319275Y2 publication Critical patent/JPH0319275Y2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1649684U 1984-02-08 1984-02-08 実装基板の液冷容器 Granted JPS60129195U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1649684U JPS60129195U (ja) 1984-02-08 1984-02-08 実装基板の液冷容器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1649684U JPS60129195U (ja) 1984-02-08 1984-02-08 実装基板の液冷容器

Publications (2)

Publication Number Publication Date
JPS60129195U JPS60129195U (ja) 1985-08-30
JPH0319275Y2 true JPH0319275Y2 (enrdf_load_stackoverflow) 1991-04-23

Family

ID=30503320

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1649684U Granted JPS60129195U (ja) 1984-02-08 1984-02-08 実装基板の液冷容器

Country Status (1)

Country Link
JP (1) JPS60129195U (enrdf_load_stackoverflow)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5511833A (en) * 1978-07-11 1980-01-28 Hitachi Chemical Co Ltd Laminated prepreg mica sheet body and making method thereof
JPS6011833B2 (ja) * 1978-12-28 1985-03-28 三菱電機株式会社 冷却装置
JPS5648973A (en) * 1979-09-25 1981-05-02 Nippon Dekishi Kk Composite vessel
JPS5650415A (en) * 1979-09-28 1981-05-07 Meidensha Electric Mfg Co Ltd Voltage fluctuation suppressing device
JPS5911515Y2 (ja) * 1979-10-30 1984-04-09 富士通株式会社 液体含有冷却器

Also Published As

Publication number Publication date
JPS60129195U (ja) 1985-08-30

Similar Documents

Publication Publication Date Title
US4704658A (en) Evaporation cooling module for semiconductor devices
US12050061B2 (en) Shrouded powder patch
US6043986A (en) Printed circuit board having a plurality of via-holes
EP0159722B1 (en) Heat transfer apparatus
US4839774A (en) Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board
US20070082183A1 (en) Circuit board
US20100132982A1 (en) Package substrate including solder resist layer having pattern parts and method of fabricating the same
JPH0319275Y2 (enrdf_load_stackoverflow)
JPH02114597A (ja) 電子素子の冷却方法
US20040104467A1 (en) Thermal design for minimizing interface in a multi-site thermal contact condition
JP2747156B2 (ja) 浸漬噴流冷却用ヒートシンク
JP2874100B2 (ja) 電子装置の冷却装置
JPH0317222B2 (enrdf_load_stackoverflow)
JPS63181454A (ja) 半導体回路パツケージ
JP2828996B2 (ja) 半導体の冷却装置
JPH037960Y2 (enrdf_load_stackoverflow)
JPH0320070B2 (enrdf_load_stackoverflow)
JPH0258296A (ja) 冷却装置
JPH0442931Y2 (enrdf_load_stackoverflow)
JPS61128598A (ja) 冷却装置
JPH0533015Y2 (enrdf_load_stackoverflow)
JPH0342511B2 (enrdf_load_stackoverflow)
JPH038587B2 (enrdf_load_stackoverflow)
JPH037959Y2 (enrdf_load_stackoverflow)
JPH0719157Y2 (ja) 浸漬冷却用半導体パッケージ