JPH0319223Y2 - - Google Patents

Info

Publication number
JPH0319223Y2
JPH0319223Y2 JP1982115595U JP11559582U JPH0319223Y2 JP H0319223 Y2 JPH0319223 Y2 JP H0319223Y2 JP 1982115595 U JP1982115595 U JP 1982115595U JP 11559582 U JP11559582 U JP 11559582U JP H0319223 Y2 JPH0319223 Y2 JP H0319223Y2
Authority
JP
Japan
Prior art keywords
lead frame
bonding
cover
heating body
guide groove
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982115595U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5923734U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982115595U priority Critical patent/JPS5923734U/ja
Publication of JPS5923734U publication Critical patent/JPS5923734U/ja
Application granted granted Critical
Publication of JPH0319223Y2 publication Critical patent/JPH0319223Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)
JP1982115595U 1982-07-31 1982-07-31 加熱装置 Granted JPS5923734U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Publications (2)

Publication Number Publication Date
JPS5923734U JPS5923734U (ja) 1984-02-14
JPH0319223Y2 true JPH0319223Y2 (enrdf_load_html_response) 1991-04-23

Family

ID=30266783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982115595U Granted JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Country Status (1)

Country Link
JP (1) JPS5923734U (enrdf_load_html_response)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (enrdf_load_html_response) * 1973-04-04 1974-12-03
JPS5742175Y2 (enrdf_load_html_response) * 1977-05-25 1982-09-17
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS6033302B2 (ja) * 1979-03-26 1985-08-02 株式会社東芝 半導体の組立装置

Also Published As

Publication number Publication date
JPS5923734U (ja) 1984-02-14

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