JPS5923734U - 加熱装置 - Google Patents

加熱装置

Info

Publication number
JPS5923734U
JPS5923734U JP1982115595U JP11559582U JPS5923734U JP S5923734 U JPS5923734 U JP S5923734U JP 1982115595 U JP1982115595 U JP 1982115595U JP 11559582 U JP11559582 U JP 11559582U JP S5923734 U JPS5923734 U JP S5923734U
Authority
JP
Japan
Prior art keywords
cover
guide groove
heating body
lead frame
heating device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1982115595U
Other languages
English (en)
Other versions
JPH0319223Y2 (ja
Inventor
博 丑木
折田　浩一
門沢　元昭
十三男 小林
Original Assignee
株式会社新川
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社新川 filed Critical 株式会社新川
Priority to JP1982115595U priority Critical patent/JPS5923734U/ja
Publication of JPS5923734U publication Critical patent/JPS5923734U/ja
Application granted granted Critical
Publication of JPH0319223Y2 publication Critical patent/JPH0319223Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【図面の簡単な説明】
第１図は従来の加熱装置の平面図、第２図は第１図の２
−２線断面を示し、ａはリードフレーム開放状態図、ｂ
はリードフレームクランプ状態図、第３図は本考案にな
る加熱装置の一実施例を示す平面図、第４図は第３図の
４−４線断面を示し、ａはリードフレーム開放状態図、
ｂはリードフレームクランプ状態図である。 １０・・・リードフレーム、３１・・・加熱体、３１ａ
・・・ガイド溝、３１ｂ・・・ガス孔、３１ｃ・・・細
い孔、３３・・・カバー、３３ａ・・・開口部、３４・
・・押え板、３４ａ・・・押え部、３４ｂ・・・ボンデ
ィング作業窓。 第２図 第４図

Claims (1)

    【実用新案登録請求の範囲】
  1. 上面にリードフレームをガイドするガイド溝が形成され
    、かつ前記ガイド溝に不活性ガス等を供給する孔が形成
    された加熱体と、前記ガイド溝を覆うように前記加熱体
    に固定され、ボンディング作業部に開口部を有するカバ
    ーと、このカバーの上方に上下動可能に配設され、前記
    カバーの開口部に挿入されて前記リードフレームを押え
    る押え部を有し、かつこの押え部の内側にホンディング
    作業に必要なホンディング作業窓を有する押え板とから
    なる加熱装置。
JP1982115595U 1982-07-31 1982-07-31 加熱装置 Granted JPS5923734U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982115595U JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Publications (2)

Publication Number Publication Date
JPS5923734U true JPS5923734U (ja) 1984-02-14
JPH0319223Y2 JPH0319223Y2 (ja) 1991-04-23

Family

ID=30266783

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982115595U Granted JPS5923734U (ja) 1982-07-31 1982-07-31 加熱装置

Country Status (1)

Country Link
JP (1) JPS5923734U (ja)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (ja) * 1973-04-04 1974-12-03
JPS53162659U (ja) * 1977-05-25 1978-12-20
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49126265A (ja) * 1973-04-04 1974-12-03
JPS53162659U (ja) * 1977-05-25 1978-12-20
JPS54113252A (en) * 1978-02-24 1979-09-04 Hitachi Ltd Pellet bonding unit
JPS55127030A (en) * 1979-03-26 1980-10-01 Toshiba Corp Assembling apparatus for semiconductor

Also Published As

Publication number Publication date
JPH0319223Y2 (ja) 1991-04-23

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