JPH03191544A - Liquid-cooled bt device - Google Patents
Liquid-cooled bt deviceInfo
- Publication number
- JPH03191544A JPH03191544A JP1332060A JP33206089A JPH03191544A JP H03191544 A JPH03191544 A JP H03191544A JP 1332060 A JP1332060 A JP 1332060A JP 33206089 A JP33206089 A JP 33206089A JP H03191544 A JPH03191544 A JP H03191544A
- Authority
- JP
- Japan
- Prior art keywords
- liquid
- tank
- cooled
- refrigerant liquid
- shape memory
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007788 liquid Substances 0.000 claims abstract description 30
- 239000003507 refrigerant Substances 0.000 claims abstract description 17
- 229910001285 shape-memory alloy Inorganic materials 0.000 claims abstract description 6
- 239000004065 semiconductor Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 230000008602 contraction Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- RVZRBWKZFJCCIB-UHFFFAOYSA-N perfluorotributylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F RVZRBWKZFJCCIB-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は液冷ＢＴ装置に関し、特に循環式液冷Ｂ Ｔ装
置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a liquid-cooled BT device, and particularly to a circulating liquid-cooled BT device.
１］従来の技術〕
従来、半導体集積回路の初期不良品を取り除く目的で行
なわれるバーンイン（Ｂｕｒｎｌｎ）に使用されるこの
種の液冷ＢＴ装置は、冷媒液を循環させるポンプ、パイ
プ、外装フレーム、ＢＴ板シラツクからなっていた。1] Prior art] Conventionally, this type of liquid-cooled BT device used for burn-in, which is performed for the purpose of removing initial defective products of semiconductor integrated circuits, consists of a pump for circulating a refrigerant liquid, a pipe, an exterior frame, It consisted of BT board Shiratsuku.
上述した従来の液冷ＢＴ装置は、パイプ、タンク等の容
積が不変であるなめ、試料の出し入れ時（低液温：約５
０℃）とＢｕｒｎ−Ｉｎ時（高液温：約１５０℃）とで
は、冷媒液の膨張、収縮により液量が異なり、低液温の
時、液不足となったり高液温時には液かあ一３＼れると
いう欠点がある。使用冷媒液は、商標名フロリナート
ＦＣ−５３１１（０，０７５％℃）、ガルデンＤＯ５（
０，１１％℃）等であるが、２５０１！／台で使用する
時、上記温度差で１９〜２７Ｉ！の液量差となる。オー
バーフロータンクの開孔面積を３０ｃｍＸ１００ｃｍと
すれば６〜９ｃｍの液面差を生じてしまう。In the conventional liquid-cooled BT device described above, the volumes of pipes, tanks, etc. remain unchanged, so when loading and unloading samples (low liquid temperature: approx.
0℃) and during Burn-In (high liquid temperature: approx. 150℃), the liquid volume differs due to the expansion and contraction of the refrigerant liquid, and when the liquid temperature is low, there may be a shortage of liquid, and when the liquid temperature is high, there may be a liquid volume. There is a drawback that it costs 13 \. The refrigerant liquid used is the trade name Fluorinert.
FC-5311 (0,075%℃), Galden DO5 (
0.11%℃) etc., but 2501! /When using the machine, the above temperature difference is 19 to 27 I! There will be a difference in liquid volume. If the opening area of the overflow tank is 30 cm x 100 cm, a liquid level difference of 6 to 9 cm will occur.
本発明は、半導体集積回路のバーンインに使用される液
冷ＢＴ装置におて、冷媒液の循環経路内あるいはタンク
内の一部に、形状記憶合金を用いた冷媒液容量調整器を
取り付けた液冷ＢＴ装置である。The present invention provides a liquid-cooled BT device used for burn-in of semiconductor integrated circuits, in which a refrigerant liquid capacity regulator using a shape memory alloy is installed in the refrigerant liquid circulation path or in a part of the tank. It is a cold BT device.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図は本発明の第１の実施例の構成図である。FIG. 1 is a block diagram of a first embodiment of the present invention.
Ｆ（Ｔ板４は、外部タンク蓋兼バイアス源１に吊り下げ
られ、電源供給を受け、オーバーフロータンク３に満た
された冷媒液２の中に浸っている。冷媒液６は、オイル
ポンプ８で加圧され、オーバーフロータンク３の下方よ
り、ＢＴ板４を冷却しながらオーバーフロータンク３か
らこぼれ落ちる。F (T plate 4 is suspended from external tank lid/bias source 1, receives power supply, and is immersed in refrigerant liquid 2 filled in overflow tank 3. Refrigerant liquid 6 is pumped by oil pump 8. It is pressurized and falls from the bottom of the overflow tank 3 while cooling the BT plate 4.
本実施例では、外部タンク５の底の冷媒液６の中に形状
記憶合金く本実施例では、高温時に体積が小さくなる〉
を用いた容量調整器７が設けである。反対に、低温時に
は体積（容量調整器７内の空間）が増す。In this embodiment, there is a shape memory alloy in the refrigerant liquid 6 at the bottom of the external tank 5. In this embodiment, the volume becomes smaller at high temperatures.
A capacity regulator 7 is provided. On the contrary, the volume (space inside the capacity regulator 7) increases at low temperatures.
第２図は本発明の第２の実施例の構成図である。本実施
例では、オーバーフロータンク３の側面に高温時に伸び
る形状記憶合金を用いた容量調整器７を取り付けたもの
で、その内部に冷媒液を出し入れすることによって液量
を調整するものである。本実施例のほうが、装置内のデ
ッドスペースを有効に活用できる。FIG. 2 is a block diagram of a second embodiment of the present invention. In this embodiment, a capacity adjuster 7 made of a shape memory alloy that expands at high temperatures is attached to the side surface of the overflow tank 3, and the amount of liquid is adjusted by taking the refrigerant liquid into and out of the capacity adjuster 7. In this embodiment, the dead space within the device can be used more effectively.
以上説明したように本発明は、液冷ＢＴ装置に冷媒液の
容量調整器を持つことにより、液冷ＢＴ装置の安定な運
転が確保できるという効果がある。As explained above, the present invention has the effect that stable operation of the liquid-cooled BT device can be ensured by providing the liquid-cooled BT device with a refrigerant liquid capacity regulator.
第１図は本発明の第１の実施例の構成図、第２図は本発
明の第２の実施例の構成図である。
１・・・外部タンク蓋兼バイアス源、２．６・・・冷媒
液、３・・・オーバーフロータンク、４・・・ＢＴ板、
５・・・外部タンク、７・・・容量調整器、８・・・オ
イルボン乙FIG. 1 is a block diagram of a first embodiment of the present invention, and FIG. 2 is a block diagram of a second embodiment of the present invention. 1... External tank lid and bias source, 2.6... Refrigerant liquid, 3... Overflow tank, 4... BT plate,
5...External tank, 7...Capacity regulator, 8...Oil cylinder O
Claims (1)
におて、冷媒液の循環経路内あるいはタンク内の一部に
、形状記憶合金を用いた冷媒液容量調整器を取り付けた
ことを特徴とする液冷ＢＴ装置。A liquid-cooled BT device used for burn-in of semiconductor integrated circuits, characterized in that a refrigerant liquid capacity regulator using a shape memory alloy is installed in the refrigerant liquid circulation path or in a part of the tank. Liquid-cooled BT device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332060A JPH03191544A (en) | 1989-12-20 | 1989-12-20 | Liquid-cooled bt device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1332060A JPH03191544A (en) | 1989-12-20 | 1989-12-20 | Liquid-cooled bt device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03191544A true JPH03191544A (en) | 1991-08-21 |
Family
ID=18250695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1332060A Pending JPH03191544A (en) | 1989-12-20 | 1989-12-20 | Liquid-cooled bt device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03191544A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112731154A (en) * | 2019-10-28 | 2021-04-30 | 比亚迪股份有限公司 | Method and device for predicting battery life of vehicle |
-
1989
- 1989-12-20 JP JP1332060A patent/JPH03191544A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112731154A (en) * | 2019-10-28 | 2021-04-30 | 比亚迪股份有限公司 | Method and device for predicting battery life of vehicle |
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