JPH0510583B2 - - Google Patents

Info

Publication number
JPH0510583B2
JPH0510583B2 JP17506986A JP17506986A JPH0510583B2 JP H0510583 B2 JPH0510583 B2 JP H0510583B2 JP 17506986 A JP17506986 A JP 17506986A JP 17506986 A JP17506986 A JP 17506986A JP H0510583 B2 JPH0510583 B2 JP H0510583B2
Authority
JP
Japan
Prior art keywords
cooling water
expansion tank
water
tank
supply device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP17506986A
Other languages
Japanese (ja)
Other versions
JPS6332275A (en
Inventor
Kazunari Tomimatsu
Ko Yamaguchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Priority to JP17506986A priority Critical patent/JPS6332275A/en
Publication of JPS6332275A publication Critical patent/JPS6332275A/en
Publication of JPH0510583B2 publication Critical patent/JPH0510583B2/ja
Granted legal-status Critical Current

Links

Description

【発明の詳細な説明】 〔発明の属する技術分野〕 この発明は純水を用いて半導体素子や電子装置
等の冷却を行なう冷却水供給装置の膨張タンクに
係り、特に膨張タンク内に貯留されている冷却水
に不活性ガスを注入し、冷却水と大気との直接接
触を防いで冷却水の水質を維持できるようにした
冷却水供給装置の膨張タンクに関する。
[Detailed description of the invention] [Technical field to which the invention pertains] The present invention relates to an expansion tank for a cooling water supply device that cools semiconductor elements, electronic devices, etc. using pure water, and particularly relates to an expansion tank for a cooling water supply device that uses pure water to cool semiconductor devices, electronic devices, etc. This invention relates to an expansion tank for a cooling water supply device that maintains the quality of the cooling water by injecting an inert gas into the cooling water to prevent direct contact between the cooling water and the atmosphere.

〔従来技術とその問題点〕[Prior art and its problems]

半導体素子や電子装置などの被冷却体を冷却保
冷する冷却水供給装置として第3図に示すような
冷却水循環装置が知られている。図において冷却
水循環装置1は冷媒としての冷却水を循環流させ
る回路2を有し、この回路2中には冷却水を矢視
方向に循環送水するポンプ3、冷却水の熱を放熱
させて冷却水に再び吸熱能力を与える放熱器4、
被冷却体5に対して伝熱的に組込まれ、内部を冷
却水が通流する冷却器6および冷却水の膨張収縮
を吸収する膨張タンク7とが順次組込まれてい
る。上述した冷却水循環回路によれば、放熱器4
によつて冷却された冷却水は冷却器6に循環供給
され、冷却水が被冷却体5を冷却する。ところで
この冷却システムにおいて、冷却媒体として水道
水を使用した場合には種々のトラブルが生ずる。
すなわち通常の水道水の導電率は150〜300μs/cm
であつて塩素イオン等の腐食因子を数多く溶解さ
せている。そのため水道水を冷却水として使用し
た場合には金属の腐食が早く進行しやすく電子機
器等に要求される高度の信頼性と長寿命を確保す
ることができない。このような事情から冷却媒体
として純水が使用される。ところが反面これらの
純水は大気に触れる場合空気中のO2とCO2を純水
の表面から溶解させやすいという性質をもつてお
り、この溶存したO2とCO2は金属に対して極めて
腐食性が高いということが知られている。これら
の問題を解決するために膨張タンクを密閉型にし
て大気としや断することが考えられるが、冷却水
循環回路内の冷却水は系統内の温度変化によつて
膨張収縮するしまた冷却系内の冷却水も水温の変
化や自然蒸発等により減少するから膨張タンク7
内の水位レベルが変動しそれによつて膨張タンク
7内の自由表面上の空間の圧力が変化するから膨
張タンクを密閉構造にすることは不都合である。
さらに第4図に示すように膨張タンク7内の冷却
水の自由表面上に嫌気板8を置いて冷却水が直接
大気と接触しないようにしたものも知られてい
る。しかしこの場合も、冷却水と大気とを完全に
しや断することはできないからO2やCO2の気体や
微小粒子が冷却水に溶解し冷却水循環回路の金属
部材の腐食を誘発したり、スケールを発生させる
という現象は避けられない。
2. Description of the Related Art A cooling water circulation device as shown in FIG. 3 is known as a cooling water supply device for cooling and keeping cool objects such as semiconductor elements and electronic devices. In the figure, a cooling water circulation system 1 has a circuit 2 that circulates cooling water as a refrigerant, and this circuit 2 includes a pump 3 that circulates the cooling water in the direction of the arrow, and cools the cooling water by dissipating the heat of the cooling water. a radiator 4 that gives the water heat absorption capacity again;
A cooler 6, which is heat-transferably incorporated into the object to be cooled 5, through which cooling water flows, and an expansion tank 7, which absorbs expansion and contraction of the cooling water, are successively installed. According to the cooling water circulation circuit described above, the radiator 4
The cooling water cooled by the cooling water is circulated and supplied to the cooler 6, and the cooling water cools the object 5 to be cooled. However, in this cooling system, when tap water is used as a cooling medium, various troubles occur.
In other words, the conductivity of normal tap water is 150 to 300 μs/cm.
It dissolves many corrosive factors such as chlorine ions. Therefore, when tap water is used as cooling water, metal corrosion tends to progress rapidly and it is not possible to ensure the high reliability and long life required for electronic devices and the like. Under these circumstances, pure water is used as a cooling medium. However, on the other hand, these pure waters have the property of easily dissolving O 2 and CO 2 in the air from the surface of the pure water when they come into contact with the atmosphere, and this dissolved O 2 and CO 2 is extremely corrosive to metals. It is known to be highly sensitive. In order to solve these problems, it may be possible to make the expansion tank a closed type and cut it off from the atmosphere, but the cooling water in the cooling water circulation circuit expands and contracts due to temperature changes within the system. The cooling water in the expansion tank 7 also decreases due to changes in water temperature and natural evaporation.
It is disadvantageous for the expansion tank to be of closed construction since the water level within the expansion tank 7 fluctuates and thereby the pressure in the space above the free surface within the expansion tank 7 changes.
Furthermore, as shown in FIG. 4, an anaerobic plate 8 is placed on the free surface of the cooling water in the expansion tank 7 to prevent the cooling water from coming into direct contact with the atmosphere. However, in this case as well, since it is impossible to completely separate the cooling water from the atmosphere, O 2 and CO 2 gases and microparticles can dissolve in the cooling water, causing corrosion of the metal parts of the cooling water circulation circuit, and causing scaling. It is unavoidable that this phenomenon occurs.

〔発明の目的〕[Purpose of the invention]

この発明の目的は上記の点に鑑み、膨張タンク
内に貯留された冷却水と大気とが直接接触するの
を避けるとともに膨張タンク内の液面が基準水位
以下に低下したら自動的に純水を補給し液面上の
圧力をほぼ大気圧に維持できるようにした冷却水
供給装置の膨張タンクを提供することを目的とす
る。
In view of the above points, the purpose of this invention is to avoid direct contact between the cooling water stored in the expansion tank and the atmosphere, and to automatically supply pure water when the liquid level in the expansion tank drops below the standard water level. It is an object of the present invention to provide an expansion tank for a cooling water supply device that can be replenished and maintain the pressure on the liquid surface at approximately atmospheric pressure.

〔発明の要点〕[Key points of the invention]

この発明は上記目的を、冷却水循環回路内にポ
ンプと放熱器と冷却器とを順次組込み、さらにポ
ンプの吸込側に冷却水を内部に貯留しかつ上方空
間を残した膨張タンクを組込んだ冷却水供給装置
において、前記膨張タンク内に貯留された冷却水
の自由表面上の上部空間を常時供給可能に不活性
ガスで満たすとともに、前記自由表面が基準水位
より低下時純水を補給する補助タンクと、前記不
活性ガスを膨張タンク外へ排気可能な逆止弁とを
設けたことを特徴とする冷却水供給装置の膨張タ
ンクによつて達成しようとするものである。そし
て補助タンクは膨張タンクの頂部に一体的に設け
られ純水を重力で補給可能に構成するとよく、さ
らに不活性ガスは窒素ガスを用いるとよい。
This invention has achieved the above object by sequentially incorporating a pump, a radiator, and a cooler into a cooling water circulation circuit, and further incorporating an expansion tank on the suction side of the pump that stores cooling water inside and leaves an upper space. In the water supply device, an auxiliary tank that fills the space above the free surface of the cooling water stored in the expansion tank with an inert gas so as to be constantly supplied, and that supplies pure water when the free surface falls below a reference water level. and a check valve capable of discharging the inert gas to the outside of the expansion tank. The auxiliary tank is preferably provided integrally at the top of the expansion tank so that pure water can be replenished by gravity, and nitrogen gas is preferably used as the inert gas.

〔発明の実施例〕[Embodiments of the invention]

以下この発明の実施例をその実施例を示す第1
図および第2図を参照して説明する。図におい
て、窒素ガス12はガスボンベ18、調節器19
を通りフイルタ20により微小異物が取り除かれ
フローコントーラ17へ送られる。フロートコン
トローラ17により膨張タンク10内の純水11
中に常時一定量の窒素ガス12が供給され膨張タ
ンク10内の純水自由表面は窒素ガス12で満た
される。このことにより膨張タンク10内の純水
11は直接大気と接触することが避けられ純水の
水質が維持される。なお、一定圧力で膨張タンク
10内に供給された窒素ガスは規定圧力になるま
で逆止弁16を介して大気に排出される。一方膨
張タンク10の頂部にはパツキン15を介して補
助タンク13が膨張タンク10と一体的に設けら
れている。したがつて膨張タンク10内の水位が
水温の変化や自然蒸発等で接続パイプ14で定ま
る基準水位より低下した場合膨張タンク10内の
自由表面上方空間の窒素ガス12が接続パイプ1
4を通つて補助タンク13に侵入する。このこと
により補助タンク13より純水11が膨張タンク
10内に補給され所定の水量が維持される。
Hereinafter, the first embodiment of the present invention will be described.
This will be explained with reference to the figures and FIG. In the figure, nitrogen gas 12 is supplied from a gas cylinder 18 and a regulator 19.
The microscopic foreign matter is removed by the filter 20 and sent to the flow controller 17. The pure water 11 in the expansion tank 10 is controlled by the float controller 17.
A constant amount of nitrogen gas 12 is always supplied inside the expansion tank 10, and the free surface of pure water inside the expansion tank 10 is filled with nitrogen gas 12. This prevents the pure water 11 in the expansion tank 10 from coming into direct contact with the atmosphere, and maintains the quality of the pure water. Note that the nitrogen gas supplied into the expansion tank 10 at a constant pressure is discharged to the atmosphere via the check valve 16 until it reaches a specified pressure. On the other hand, an auxiliary tank 13 is provided integrally with the expansion tank 10 at the top of the expansion tank 10 via a packing 15. Therefore, if the water level in the expansion tank 10 falls below the reference water level determined by the connecting pipe 14 due to a change in water temperature or natural evaporation, the nitrogen gas 12 in the space above the free surface in the expansion tank 10 will flow to the connecting pipe 1.
4 into the auxiliary tank 13. As a result, pure water 11 is replenished from the auxiliary tank 13 into the expansion tank 10, and a predetermined amount of water is maintained.

〔発明の効果〕〔Effect of the invention〕

この発明によれば冷却水供給装置の膨張タンク
の構造を無圧密閉化構造としてタンク内に貯留し
ている冷却水の自由表面上の上部空間に常時不活
性ガスを供給するようにしたので冷却水が大気と
直接接触することがなく冷却水の水質が保たれ冷
却水循環回路を構成する配管金属材料の腐食や障
害物質の混入が防げるのみならず膨張タンクの上
部に純水補給のための補助タンクを一体的に設け
てあるので膨張タンク内の冷却水の減少を自動的
に補うことができる。
According to this invention, the structure of the expansion tank of the cooling water supply device is a pressureless sealed structure so that an inert gas is constantly supplied to the upper space above the free surface of the cooling water stored in the tank. Since the water does not come into direct contact with the atmosphere, the water quality of the cooling water is maintained, which not only prevents corrosion of the metal pipes that make up the cooling water circulation circuit and the contamination of harmful substances, but also assists in replenishing pure water at the top of the expansion tank. Since the tank is integrally provided, the decrease in cooling water in the expansion tank can be automatically compensated for.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図および第2図はこの発明の実施例を示す
もので、第1図は水位が基準水位より上の状態で
示す説明図、第2図は水位が基準水位より下の状
態で示す説明図、第3図は従来の膨張タンクを用
いた冷却水の循環回路図、第4図は異なる従来例
を示す説明図である。 1……冷却水循環装置、2……回路、3……ポ
ンプ、4……放熱器、5……被冷却体、6……冷
却器、7……膨張タンク、8……嫌気板、10…
…膨張タンク、11……純水、12……窒素ガ
ス、13……補助タンク、14……接続パイプ、
15……パツキン、16……逆止弁、17……フ
ロートコントローラ、18……ガスボンベ、19
……調節器、20……フイルタ。
Figures 1 and 2 show examples of the present invention; Figure 1 is an explanatory diagram showing the water level above the standard water level, and Figure 2 is an explanatory diagram showing the water level below the standard water level. 3 is a conventional cooling water circulation circuit diagram using an expansion tank, and FIG. 4 is an explanatory diagram showing a different conventional example. DESCRIPTION OF SYMBOLS 1... Cooling water circulation device, 2... Circuit, 3... Pump, 4... Heat radiator, 5... Cooled object, 6... Cooler, 7... Expansion tank, 8... Anaerobic plate, 10...
... Expansion tank, 11 ... Pure water, 12 ... Nitrogen gas, 13 ... Auxiliary tank, 14 ... Connection pipe,
15...Packing, 16...Check valve, 17...Float controller, 18...Gas cylinder, 19
...Adjuster, 20...Filter.

Claims (1)

【特許請求の範囲】 1 冷却水循環回路内にポンプと放熱器と冷却器
とを順次組込み、さらにポンプの吸込側に冷却水
を内部に貯留しかつ上方空間を残した膨張タンク
を組込んだ冷却水供給装置において、前記膨張タ
ンク内に貯留された冷却水の自由表面上の上部空
間を常時供給可能に不活性ガスで満たすととも
に、前記自由表面が基準水位より低下時純水を補
給する補助タンクと、前記不活性ガスを膨張タン
ク外へ排気可能な逆止弁とを設けたことを特徴と
する冷却水供給装置の膨張タンク。 2 特許請求の範囲第1項記載のものにおいて、
補助タンクは膨張タンクの頂部に一体的に設けら
れ純水を重力で補給可能に構成されていることを
特徴とする冷却水供給装置の膨張タンク。 3 特許請求の範囲第1項または第2項記載のも
のにおいて、不活性ガスは窒素ガスからなること
を特徴とする冷却水供給装置の膨張タンク。
[Claims] 1. A cooling system that sequentially incorporates a pump, a radiator, and a cooler in a cooling water circulation circuit, and further incorporates an expansion tank on the suction side of the pump that stores cooling water inside and leaves an upper space. In the water supply device, an auxiliary tank that fills the space above the free surface of the cooling water stored in the expansion tank with an inert gas so as to be constantly supplied, and that supplies pure water when the free surface falls below a reference water level. and a check valve capable of exhausting the inert gas to the outside of the expansion tank. 2. In what is stated in claim 1,
An expansion tank for a cooling water supply device, characterized in that the auxiliary tank is integrally provided at the top of the expansion tank and is configured to be able to replenish pure water by gravity. 3. The expansion tank of the cooling water supply device according to claim 1 or 2, wherein the inert gas is nitrogen gas.
JP17506986A 1986-07-25 1986-07-25 Expansion tank for cooling water feeder Granted JPS6332275A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17506986A JPS6332275A (en) 1986-07-25 1986-07-25 Expansion tank for cooling water feeder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17506986A JPS6332275A (en) 1986-07-25 1986-07-25 Expansion tank for cooling water feeder

Publications (2)

Publication Number Publication Date
JPS6332275A JPS6332275A (en) 1988-02-10
JPH0510583B2 true JPH0510583B2 (en) 1993-02-10

Family

ID=15989685

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17506986A Granted JPS6332275A (en) 1986-07-25 1986-07-25 Expansion tank for cooling water feeder

Country Status (1)

Country Link
JP (1) JPS6332275A (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5161467B2 (en) * 2007-02-19 2013-03-13 三菱重工プラスチックテクノロジー株式会社 Water supply system for injection mold
CN104567172B (en) * 2014-12-30 2017-10-17 徐州中矿大传动与自动化有限公司 A kind of intelligent water-cooled system with self-regulation ability
JP7126279B2 (en) * 2018-11-13 2022-08-26 国立大学法人大阪大学 Electronic device with bubble release device

Also Published As

Publication number Publication date
JPS6332275A (en) 1988-02-10

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