JPH02224397A - Structure for cooling immersed power source - Google Patents

Abstract

PURPOSE:To improve a cooling structure of this design in cooling capacity by a method wherein a cooling plate of a hermetically sealed case is cooled to cool down coolant. CONSTITUTION:A cooling structure of this design is provided with a hermetically sealed case 1 where a DC-DC converter module 2 is housed and liquid-cooled, a cooling plate 8 which is formed at an upper inner face of the sealed case 1 protruding from it to cool a coolant 3, and a cold plate 4, provided to the top of the sealed case 1, of metal such as brass or the like which is excellent in thermal conductivity and provided with a coolant flow path inside it. That is, a multi-converter current system DC-DC converter module 2, composed of a general rectifier section of an electronic computer, a DC-DC converter module, and a power control circuit section, is immersed in the coolant 3. By this setup, the cooling structure can be improved in cooling capacity.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for a submerged power supply, and particularly to a cooling structure for a submerged power supply used in a computer.

[Prior Art] Conventional power supplies are generally cooled by forced air cooling using a fan provided at the bottom of the power supply.

However, as electronic circuits have become more highly integrated in recent years, power consumption has increased, and power supplies with large capacity and small size have become necessary. On the other hand, if forced air cooling is attempted to solve this problem, the heat sink becomes large and downsizing cannot be expected, and if the air volume of the fan is increased, noise regulations cannot be satisfied.

For this reason, a soundproof structure must be provided, and the forced air cooling described above was not sufficient, and as a result, instead of forced air cooling,
A liquid cooling system was required.

Conventionally, this type of cooling structure using liquid cooling has been as shown in FIG. That is, a circuit board 22 is attached to a connector 26 provided on the inner bottom surface of a storage container 21, and a heat exchanger 24 is provided as a condenser in the space above the refrigerant liquid 23 and the storage container 21. , were designed to be cooled by water or other refrigerants.

As the refrigerant liquid 23, various types of fluorocarbons and the like, which are non-corrosive and non-dissociative solutions, are used.

[Problems to be Solved by the Invention] In the conventional liquid cooling cooling structure described above, non-condensable gas such as air enters through the storage container 21, and non-condensable gas occurs from parts inside the storage container 21. There is a drawback that the liquefied gas is concentrated around the heat exchanger 24, preventing liquefaction, and the cooling capacity decreases over time.

The above-mentioned disadvantage is that when the heat exchanger 24 is installed in the refrigerant liquid 23, it is not dependent on the impurity content in the refrigerant liquid.
Although the cooling capacity is stable and solved, there is a drawback that the cooling capacity is inferior to the case where the heat exchanger 24 is installed in the space above the refrigerant liquid.

Further, since the storage container 21 and the heat exchanger 24 are integrated, there is a drawback that the refrigerant liquid flowing into the heat exchanger 24 must be stopped during maintenance.

[Means for Solving the Problems] The present invention has been made to solve the above problems. A cooling structure for an immersion power source that is immersed in cooling includes: a sealed container for accommodating and liquid cooling a DC-DC converter module; and a projection formed on at least the upper inner surface of the upper and side portions of the sealed container; A cooling plate for a refrigerant liquid with improved heat transfer, and a metal cold plate with excellent thermal conductivity, which is provided on an external surface of the sealed container corresponding to the cooling plate and has a flow path for flowing the refrigerant inside. It is structured as follows.

[Example] An embodiment of the present invention will be described below based on the drawings.

FIGS. 1 and 2 are diagrams showing one embodiment of the present invention.

The cooling structure of this immersion power supply is based on a multi-converter current system DC-- which is composed of a bulk rectifier section of electronic meter B, a DC-DC converter module, and a power supply control circuit section.
The DC converter module 2 is cooled by immersing it in a refrigerant liquid 3.

That is, the cooling structure of this immersion power supply includes a sealed container l that accommodates the DC-DC converter module 2 and is liquid-cooled, a cooling plate 8 for the refrigerant liquid 3 that is formed protruding from the upper inner surface of the sealed container l,
A cold plate 4 made of a metal material such as brass having excellent thermal conductivity is provided on the external upper surface of the sealed container 1 and has a flow path 5 through which a refrigerant flows inside.

JL (4) The DC-DC converter module 2 is installed and housed in the connector 6 at the bottom of the sealed container l containing the refrigerant liquid 3.
- It has a cooling plate 8 that cools the refrigerant liquid 3 to which heat has been transferred from the DC converter module 2, and is immersed in the refrigerant liquid 3. A cold plate 4 made of a material such as brass, which is a metal with excellent thermal conductivity, and having a flow path 5 through which a refrigerant such as water flows is attached to the external upper surface of the sealed container l with screws 7. . The cooling plate 8 of the sealed container 1 is cooled by the flow of a refrigerant such as water through the flow path 5, thereby cooling the refrigerant liquid 3.

FIG. 3 is a side sectional view showing another embodiment of the present invention.

In this embodiment, when increasing the capacity of the power supply, the cooling area of the cold plate and the cooling area of the cooling plate may be insufficient, so by adopting a horizontal immersion power supply cooling structure, the cold plate 10 and cooling plate 9
The area is increased to improve cooling capacity.

Specifically, the sealed container 11 is thin and wide enough to accommodate the DC-DC converter module 2 horizontally, the connector 6 is provided on the inner surface, and the DC-DC converter module 2 is connected to the connector 6. It is installed and stored horizontally.

In addition, a cooling plate 9 is provided on the inner surface of the upper part of the sealed container 11, which has become wider.
In addition to increasing the area of the cooling plate 9, a cold play plate 10 having a wide external upper surface is provided.

FIG. 4 is a front sectional view showing still another embodiment of the present invention.

In this embodiment, the DC-DC converter module 2 is installed and housed in a connector 6 at the bottom of a sealed container 1 containing a refrigerant liquid 3. A cooling plate 18 is provided on the upper and side inner surfaces of the sealed container l for cooling the refrigerant liquid 3 to which heat has been transferred from the DC-DC converter module 2, and is immersed in the refrigerant liquid 3. On the external top and side surfaces of the sealed container l, there are two cold plates 14 made of a material such as brass, which is a metal with excellent thermal conductivity, and each having a passage 5 through which a refrigerant such as water flows. It is installed with. In addition, two cold plates 14 are connected by a hose 19, and a refrigerant such as water flows serially through the flow path 5, thereby cooling the cooling plates 18 of the sealed container 1, respectively, and discharging the refrigerant liquid 3. It has a structure that improves cooling capacity by cooling.

[Effects of the Invention] As explained above, the cooling structure of the immersion power supply of the present invention has D
A sealed container that accommodates and liquid-cools a C-DC converter module; a cooling plate for refrigerant liquid to which heat is transferred from the DC-DC converter module that is formed protruding from at least the upper inner surface of the upper and side portions of the sealed container; Since the container is equipped with a metal cold plate with excellent thermal conductivity, which is provided on the outer surface of the container that corresponds to the cooling plate and has a flow path through which the refrigerant flows inside, the cooling plate is installed inside the refrigerant liquid. By exchanging heat, the cooling capacity can be stabilized, and the contact area of the cooling plate with the refrigerant liquid can be easily increased or decreased to an appropriate area that matches the cooling capacity, based on thermal analysis calculations from the power supply capacity. This has the effect of creating an efficient immersion power source.

Furthermore, since the sealed container containing the DC-DC converter module and the cold plate are separated, maintenance can be easily performed.

[Brief explanation of the drawing]

FIG. 1 is a side sectional view of one embodiment of the present invention, FIG. 2 is a front sectional view of this embodiment of the present invention, FIG. 3 is a side sectional view showing another embodiment, and FIG. FIG. 5 is a front sectional view showing still another embodiment of the present invention, and FIG. 5 is a side sectional view showing a conventional cooling structure using liquid cooling. ll: Sealed container DC-DC converter module refrigerant liquid 10.14: Cold plate flow path 9.18: Cooling plate

Claims (1)

[Claims] A cooling structure for an immersion power supply in which a DC-DC converter module of a multi-converter power supply system is cooled by immersing it in a refrigerant liquid, comprising: a sealed container for accommodating and liquid-cooling the DC-DC converter module; and an upper part of the sealed container. and a cooling plate for the refrigerant liquid to which heat is transferred from the DC-DC converter module, which is formed protrudingly on at least the upper inner surface of the side part, and a flow provided on the external surface of the sealed container corresponding to the cooling plate and for flowing the refrigerant into the inside. A cooling structure for an immersion power supply characterized by comprising a metal cold plate having excellent thermal conductivity and having a conductive channel.