JPH03183198A - Cooling structure for immersed power supply - Google Patents

Cooling structure for immersed power supply

Info

Publication number
JPH03183198A
JPH03183198A JP29796689A JP29796689A JPH03183198A JP H03183198 A JPH03183198 A JP H03183198A JP 29796689 A JP29796689 A JP 29796689A JP 29796689 A JP29796689 A JP 29796689A JP H03183198 A JPH03183198 A JP H03183198A
Authority
JP
Japan
Prior art keywords
container
refrigerant liquid
cooling
converter
power supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29796689A
Other languages
Japanese (ja)
Inventor
Goro Sekiguchi
関口 五郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Computertechno Ltd
Original Assignee
NEC Computertechno Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Computertechno Ltd filed Critical NEC Computertechno Ltd
Priority to JP29796689A priority Critical patent/JPH03183198A/en
Publication of JPH03183198A publication Critical patent/JPH03183198A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE:To provide a high-efficiency power supply with stabilized cooling capacity by immersing a DC-DC converter in coolant. CONSTITUTION:A DC-DC converter module 2 is housed in a container 1 and inserted into a connector 6 provided on the inner wall of the container. The container holds coolant 3, which may be water or fluorocarbon. The container includes, in its upper portion, a cooling plate 8 for cooling the coolant 3 carrying heat from the DC-DC converter module 2, and a cold plate 4 having coolant channels 5 in it. The cold plate cools the coolant through the cooling plate, thereby cooling the DC-DC converter efficiently.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は、電子計算機に用いられる浸漬電源の冷却構造
に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a cooling structure for a submerged power supply used in an electronic computer.

[従来の技術〕 従来、電源の冷却は、その電源の下部に設けられたファ
ンにより強制空冷する方法が一般的であった。
[Prior Art] Conventionally, power supplies have generally been cooled by forced air cooling using a fan provided at the bottom of the power supply.

ところが、近年、電子回路の高集積化が進むにつれて消
費電力が増大したため、電源も大容量であって、しかも
小型のものが使用されるようになってきた。この場合は
、上述した従来の強制空冷ではヒートシンクが大きくな
って小型化が望めず、またファンの風量を増加させると
騒音規制を満足できず、防音対策を施さなければならな
い等の理由から、最近は上記の強制空冷に代わって、液
冷方式が採用されいる。
However, in recent years, as electronic circuits have become more highly integrated, power consumption has increased, and power supplies with larger capacities and smaller sizes have come to be used. In this case, with the conventional forced air cooling mentioned above, the heat sink becomes large and downsizing cannot be expected, and if the air volume of the fan is increased, noise regulations cannot be met, so soundproofing measures must be taken. Instead of the forced air cooling mentioned above, a liquid cooling system is used.

この種の冷却構造は、第3図に示すように、金属等の収
納容器lの内部底面に設けられたコネクタロに回路基板
2が挿着され、冷媒液3と容器上部の空間には、熱交換
器4が凝縮器として備えられており、水またはその他の
冷媒により冷却される構造となっていた。
In this type of cooling structure, as shown in Fig. 3, a circuit board 2 is inserted into a connector provided on the inside bottom of a storage container l made of metal, etc., and a space above the refrigerant liquid 3 and the container is filled with heat. An exchanger 4 was provided as a condenser and was designed to be cooled by water or other refrigerant.

なお、冷媒液3は、通常は非腐食性でかつ非解離性の溶
液である各種のフルオロカーボン等が用いられている。
Note that, as the refrigerant liquid 3, various fluorocarbons and the like, which are usually non-corrosive and non-dissociative solutions, are used.

[発明が解決しようとする課題] しかし、上述した従来の液冷方式の冷却構造は、収納容
器lを辿じて侵入する空気、または収納容器l内部の部
品等から発生する他の非凝縮性ガスが、熱交換器4の周
囲に濃縮されて液化を妨げ、時間の経過とともに、冷却
能力が低下するという欠点がある。
[Problems to be Solved by the Invention] However, the conventional liquid cooling type cooling structure described above does not allow air to enter through the storage container l or other non-condensable air generated from parts inside the storage container l. The disadvantage is that the gas is concentrated around the heat exchanger 4, preventing liquefaction and reducing the cooling capacity over time.

かかる欠点は、熱交換器4を冷媒液3中に設置すると、
冷媒液3中の不純物含有量に依存せず、冷却能力を安定
させることはできるが、冷却能力自体は、熱交換器4を
冷媒液上部の空間に設置した場合に比べて劣るという問
題があった。
Such a drawback is that when the heat exchanger 4 is installed in the refrigerant liquid 3,
Although the cooling capacity can be stabilized without depending on the impurity content in the refrigerant liquid 3, there is a problem that the cooling capacity itself is inferior to that when the heat exchanger 4 is installed in the space above the refrigerant liquid. Ta.

また従来の構造では、収納容器lと熱交換器4が一体型
となっているため保守性が悪く、その信頼性を高めなけ
れば組立後の後戻り工数が多くなることも指摘されてい
た。
Furthermore, it has been pointed out that in the conventional structure, since the storage container l and the heat exchanger 4 are integrated, maintainability is poor, and unless the reliability is improved, the number of man-hours required for backtracking after assembly will increase.

本発明は上記のような事情に鑑みてされたものであり、
その課題は冷却能力が安定し、かつ効率の良い浸漬電源
の冷却構造を提供することである。
The present invention was made in view of the above circumstances, and
The challenge is to provide a cooling structure for an immersed power supply that has stable cooling capacity and is efficient.

[課題を解決するための手段] 本発明は上記の課題の解決のため以下のような構成とし
ている。即ち、電子計算機の一括整流部と、I) C−
D Cコンバータと、電源制御回路部とから構成される
マルチコンバータ電源システムにおいて、冷媒液に浸漬
して冷却されるDC−DCコンバータを収納する容器を
設け、該容器内には冷媒液を充填して、該冷媒液中にD
C−DCコンバータを浸漬し、また冷媒液中に浸される
冷却板を備え、かつ内部に冷媒液が流れる流路を形成し
たコールドプレートを上記容器の上部に設置し、さらに
上記容器内の冷媒液を密閉するための0リングを上記コ
ールドプレートと上記容器の間に介在させたものである
[Means for Solving the Problems] In order to solve the above problems, the present invention has the following configuration. That is, the bulk rectifier of the electronic computer, I) C-
In a multi-converter power supply system composed of a DC converter and a power supply control circuit section, a container is provided to house the DC-DC converter that is cooled by being immersed in a refrigerant liquid, and the container is filled with the refrigerant liquid. D in the refrigerant liquid
A cold plate in which the C-DC converter is immersed and which is provided with a cooling plate immersed in the refrigerant liquid and has a flow path for the refrigerant liquid inside is installed on the upper part of the container, and furthermore, the refrigerant in the container is An O-ring for sealing the liquid is interposed between the cold plate and the container.

[実施例〕 第1図、及び第2図は本発明の一実施例の断面図である
。DC−DCコンバータモジュール2は、冷媒液3が充
填された収納容器1内面に設けたのコネクタ6に挿着さ
れ、該収納容器l内に収められている。冷媒液3として
は、水その他各種のフルオロカーボン等が使用できる。
[Embodiment] FIGS. 1 and 2 are cross-sectional views of an embodiment of the present invention. The DC-DC converter module 2 is inserted into a connector 6 provided on the inner surface of a storage container 1 filled with a refrigerant liquid 3, and is housed within the storage container 1. As the refrigerant liquid 3, water and various fluorocarbons can be used.

上記収納容器lの上部には、DC−DCコンバータモジ
ュール2から熱伝達がされた冷媒液3を冷却するための
冷却板8を備えると共に、内部に冷媒液が流れる流路5
を設けたコールドプレート4が、ねじ7により取り付け
られている。
The upper part of the storage container l is provided with a cooling plate 8 for cooling the refrigerant liquid 3 to which heat has been transferred from the DC-DC converter module 2, and a flow path 5 through which the refrigerant liquid flows inside.
A cold plate 4 is attached with screws 7.

上記冷却板8は板状体であり、コールドプレート4の内
側面に複数設けられて冷媒液3中に浸されている。これ
はコールドプレート4に一体に設けられる一体をと、そ
れにねじ等により取り付ける分離型とがとあるが、どち
らを使用してもよい。
The cooling plates 8 are plate-shaped bodies, and are provided in plural on the inner surface of the cold plate 4 and immersed in the refrigerant liquid 3. There are two types of this: an integral type that is provided integrally with the cold plate 4, and a separate type that is attached to the cold plate 4 with screws or the like, but either can be used.

この場合、冷却板8における冷媒液3と接触する面積を
、電源容器からの熱解析計算に基づいて適正な冷却能力
を発揮できる大きさとすることが可能であり、効率の良
い浸漬電源が得られる。
In this case, it is possible to set the area of the cooling plate 8 in contact with the refrigerant liquid 3 to a size that can exhibit an appropriate cooling capacity based on thermal analysis calculations from the power supply container, and an efficient immersion power supply can be obtained. .

またコールドプレート4は、熱伝導性に優れた金属であ
り、例えば黄銅等の材料が選択される。
Further, the cold plate 4 is made of a metal with excellent thermal conductivity, and a material such as brass is selected, for example.

上記のような構造により、上記熱伝達面12と冷却板8
を冷却し、さらに冷媒液3を冷却する6一方、上記収納
容器1中の冷媒液3は、該収納容器1の側壁上部の満9
にOリング10を挿入することにより容器l内に密封さ
れ、外部からの空気の侵入は遮断される。
With the above structure, the heat transfer surface 12 and the cooling plate 8
6. On the other hand, the refrigerant liquid 3 in the storage container 1 is cooled in the upper part of the side wall of the storage container 1.
By inserting the O-ring 10 into the container 1, the inside of the container 1 is sealed, and air is prevented from entering from the outside.

[発明の効果] 以上説明したように本発明は、DC−DCコンハークを
収納する容器内に冷媒液を充填して、該冷媒液中にDC
−DCコンバークを浸漬し、また冷媒液中に浸される冷
却板を備え、かつ内部に冷媒液が流れる流路を形成した
コールドプレートを上記容器の上部に設置したから、冷
媒液中の冷却板による熱交換により冷却能力が安定し、
また効率のよい浸漬電源が出来る効果がある。
[Effects of the Invention] As explained above, the present invention is characterized by filling a refrigerant liquid into a container that accommodates a DC-DC conch, and adding DC to the refrigerant liquid.
- A cold plate in which the DC converk is immersed, a cold plate immersed in the refrigerant liquid, and a flow path for the refrigerant liquid inside is installed at the top of the container, so that the cooling plate in the refrigerant liquid is immersed. The cooling capacity is stabilized by heat exchange with
It also has the effect of creating an efficient immersion power source.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は本発明の浸漬電源の一実施例を示した側面断面
図、第2図は本発明の浸漬電源の一実施例を示した正面
断面図、第3図は、従来の液冷モジュールの側面断面図
である。 l:収納容器   2 : DC−DCコンバータ3:
冷媒液    4:コールドプレート5:流路    
 6:コネクタ 7:ねじ     8:冷却板 9:溝     10:0リング
Fig. 1 is a side sectional view showing an embodiment of the immersion power supply of the present invention, Fig. 2 is a front sectional view showing an embodiment of the immersion power supply of the invention, and Fig. 3 is a conventional liquid cooling module. FIG. l: Storage container 2: DC-DC converter 3:
Refrigerant liquid 4: Cold plate 5: Channel
6: Connector 7: Screw 8: Cooling plate 9: Groove 10: 0 ring

Claims (1)

【特許請求の範囲】[Claims] 電子計算機の一括整流部と、DC−DCコンバータと、
電源制御回路部とから構成されるマルチコンバータ電源
システムにおいて、冷媒液に浸漬して冷却されるDC−
DCコンバータを収納する容器を設け、該容器内には冷
媒液を充填して、該冷媒液中にDC−DCコンバータを
浸漬し、また冷媒液中に浸される冷却板を備え、かつ内
部に冷媒液が流れる流路を形成したコールドプレートを
上記容器の上部に設置し、さらに上記容器内の冷媒液を
密閉するためのOリングを上記コールドプレートと上記
容器の間に介在させたことを特徴とする浸漬電源の冷却
構造。
A bulk rectifier of an electronic computer, a DC-DC converter,
In a multi-converter power supply system consisting of a power supply control circuit section, a DC-DC converter is cooled by being immersed in a refrigerant liquid.
A container for storing the DC converter is provided, the container is filled with a refrigerant liquid, the DC-DC converter is immersed in the refrigerant liquid, and a cooling plate is provided to be immersed in the refrigerant liquid. A cold plate forming a flow path for a refrigerant liquid is installed at the top of the container, and an O-ring for sealing the refrigerant liquid in the container is interposed between the cold plate and the container. Cooling structure for immersion power supply.
JP29796689A 1989-11-16 1989-11-16 Cooling structure for immersed power supply Pending JPH03183198A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29796689A JPH03183198A (en) 1989-11-16 1989-11-16 Cooling structure for immersed power supply

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29796689A JPH03183198A (en) 1989-11-16 1989-11-16 Cooling structure for immersed power supply

Publications (1)

Publication Number Publication Date
JPH03183198A true JPH03183198A (en) 1991-08-09

Family

ID=17853396

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29796689A Pending JPH03183198A (en) 1989-11-16 1989-11-16 Cooling structure for immersed power supply

Country Status (1)

Country Link
JP (1) JPH03183198A (en)

Similar Documents

Publication Publication Date Title
US7333334B2 (en) Liquid cooling system and electronic equipment using the same
US10271456B2 (en) Enclosure for liquid submersion cooled electronics
US20070034360A1 (en) High performance cooling assembly for electronics
US20030010050A1 (en) Computer cooling apparatus
KR20120021130A (en) A liquid submersion cooled server computer and server computer case thereof
KR100403966B1 (en) Computer having cooling apparatus and heat exchanging device of the cooling apparatus
JP2009147156A (en) Cooling device, and electronic apparatus using the same
KR20010000940A (en) Computer having cooling apparatus and heat exchanging device of the cooling apparatus
US20080006037A1 (en) Computer cooling apparatus
KR20010041932A (en) System for cooling device in computer
KR20100053429A (en) Hybrid immersion cooled server with integral spot and bath cooling
JP2023501829A (en) Cold plates and systems for cooling electronic devices
WO2023116491A1 (en) Immersion-type liquid-cooling device and immersion-type liquid-cooling system
US20060005953A1 (en) Liquid cooling device
JPH03183198A (en) Cooling structure for immersed power supply
JPH05243771A (en) Cooling structure for immersed dc-dc converter
JPH03183199A (en) Cooling structure for immersed power supply
JPH02224397A (en) Structure for cooling immersed power source
JP2746938B2 (en) Cooling device for power supply circuit board
JP2594688B2 (en) Immersion DC-DC converter cooler
JPH03179798A (en) Cooling structure
JP2589401B2 (en) Immersion DC-DC converter cooler
JPH0370955A (en) Cooling structure of immersed dc-dc converter
JPH0354894A (en) Cooling structure for power source
CN215222891U (en) Immersed type fluoride liquid cooling device for data center