JP2589401B2 - Immersion DC-DC converter cooler - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to a submerged DC-DC converter cooler, and particularly to a method of cooling a DC-DC converter used in an electronic computer.

2. Description of the Related Art Conventionally, as a cooling method of a DC-DC converter, a method of forcibly cooling with a fan provided below a power supply has been generally used.

On the other hand, in recent years, power consumption has increased as the density of logic boards has increased, and therefore, a power supply having a large capacity and a small size has been required.

However, in the forced air cooling, the heat sink becomes large, so the miniaturization cannot be expected, and when the air volume is increased, the noise regulation cannot be satisfied. .

As shown in FIG. 3, the liquid cooling system includes a transformer 5, a choke coil 6, and a secondary rectifier diode 14.
A circuit board 21 equipped with such as is inserted into a connector 22 provided at the bottom of a metal or plastic sealed container 20,
A heat exchanger 23 is provided as a condenser between the refrigerant liquid 8 and the upper part of the sealed container 20, and each component (heat generating component) on the circuit board 21 is supplied with water or other water injected into the heat exchanger 23. There is a method of cooling with a refrigerant.

Here, as the refrigerant liquid 8, various fluorocarbons which are non-corrosive and non-dissociating solutions are used.

As another cooling method, as shown in FIG. 4, a metal having a flow path (not shown) in which a refrigerant such as water is circulated by flowing from a water inlet 26 and discharging it to a water outlet 27 is provided. Rectifier diode on cold plate 25
There is a method in which a cold plate 25 is mounted to directly conduct cooling of the secondary rectifier diode 14 and the like by the cold plate 25, and heat generating components such as the transformer 5 and the choke coil 6 are forcibly air-cooled by a fan (not shown).

In such a conventional cooling method of a DC-DC converter,
When each component (heat-generating component) on the circuit board 21 is cooled by immersing it in the refrigerant liquid 8, a large amount of heat is required to cool the refrigerant liquid 8 because the total heat generation of the heat-generating components on the circuit board 21 is very large. There is a disadvantage that the exchanger 23 is required and the device cannot be downsized.

In addition, the secondary rectifier diode is provided by the cold plate 25.
When directly conducting cooling of heat-generating components such as 14, the heat-generating components are of many types and have various shapes, so they cannot be conductively cooled by being mounted on the cold plate 25, and cannot be cooled by being mounted on the cold plate 25. There is the disadvantage that the parts must be forced air cooled by a fan.

Object of the invention The present invention has been made in order to eliminate the above-mentioned drawbacks of the conventional one, there is no need for forced air cooling by a fan,
It is an object of the present invention to provide a submerged DC-DC converter cooler that can reduce the size of the device.

Constitution of the invention An immersion DC-DC converter cooler according to the present invention is mounted with a sealed container filled with a refrigerant liquid and immersed in cooling the DC-DC converter with the refrigerant liquid, and a heating element, and hermetically sealed the sealed container. A lid member, a flow path provided in the lid member and circulating a refrigerant for cooling the heat-generating component, and a heat connected to the flow path and cooling the refrigerant liquid filled in the sealed container. And an exchanger.

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of one embodiment of the present invention, and FIG. 2 is a cross-sectional view of one embodiment of the present invention. In these figures, a lid 2 is attached to a sealed container 1 via a packing 3 with screws 4a to 4a.
4o (the screws 4m to 4o are not shown) are fixed.

In the sealed container 1, components such as a transformer 5, a choke coil 6, and a circuit board 7 constituting a DC-DC converter are immersed in a refrigerant liquid 8 and stored.

Input and output currents and signals to and from these components are input and output via the sealed connector 9 and the bus bars 10a and 10b.

The lid 2 is made of a material having good heat conductivity, and has a water inlet therein.
A flow path 11 connected to the water outlet 17 and the water outlet 18 is provided. The flow path 11 is connected to a heat exchanger 12 attached to the lid 2.

A main transistor is provided inside the sealed container 1 of the lid 2.
13 and the secondary rectifier diode 14 are fixed by screws 16a to 16c via insulating materials 15a and 15b.

Therefore, heat generated by the main transistor 13 and the secondary rectifier diode 14 transmitted to the lid 2 is transmitted from the water inlet 17 to the water outlet 18.
Is cooled by a refrigerant such as water circulating in the flow path 11.

On the other hand, the heat generated by the other heat-generating components such as the transformer 5, the choke coil 6, and the components on the circuit board 7 transmitted to the refrigerant liquid 8 is generated by the refrigerant such as water circulating from the flow path 11 to the heat exchanger 12. Cooled.

As a result, since high heat-generating components such as the main transistor 13 and the secondary rectifier diode 14 are directly conducted and cooled by the lid 2, the number of components liquid-cooled by the refrigerant liquid 8 is reduced, and the amount of heat generated by immersion liquid cooling is reduced. In addition, the size of the heat exchanger 12 for cooling the refrigerant liquid 8 can be reduced, and the size of the apparatus can be reduced.

In addition, since the transformer 5 and the choke coil 6 that cannot be fixed to the lid 2 and each component on the circuit board 7 are immersed and cooled by the coolant liquid 8, the necessity of forced air cooling by a fan is eliminated.

Thus, the flow path is formed in the lid 2 for sealing the sealed container 1.
11 and the main transistor 13 and secondary rectifier diode
By mounting a heat exchanger 12 for cooling the refrigerant liquid 8 in which other heat-generating components are immersed in the flow path 11 together with the mounting of the heat-generating components, there is no need for forced air cooling by a fan, and the size of the apparatus can be reduced. Can be achieved.

Effects of the Invention As described above, according to the present invention, a heat-generating component is mounted on a lid member of a sealed container filled with a refrigerant liquid, and a flow path for circulating the refrigerant is provided in the lid member, and the flow path By connecting a heat exchanger that cools the refrigerant liquid to the air conditioner, there is no need for forced air cooling by a fan, and the device can be downsized.

[Brief description of the drawings]

FIG. 1 is a front view of one embodiment of the present invention, FIG. 2 is a sectional view of one embodiment of the present invention, and FIGS. 3 and 4 are views showing a conventional example. Description of Signs of Main Parts 1 Sealed Container 2 Lid 3 Packing 8 Refrigerant Liquid 11 Flow Channel 12 Heat Exchanger

Claims (1)

(57) [Claims] A refrigerant liquid is filled, and the refrigerant liquid is
A sealed container for immersion liquid cooling of the DC converter, mounted with a heat-generating component, a lid member for sealing the sealed container, and a flow channel provided in the lid member for circulating a refrigerant for cooling the heat-generating component. And a heat exchanger connected to the flow path and cooling the refrigerant liquid filled in the sealed container.