JPH03188698A - Electronic device with heat dissipation mechanism - Google Patents
Electronic device with heat dissipation mechanismInfo
- Publication number
- JPH03188698A JPH03188698A JP1213618A JP21361889A JPH03188698A JP H03188698 A JPH03188698 A JP H03188698A JP 1213618 A JP1213618 A JP 1213618A JP 21361889 A JP21361889 A JP 21361889A JP H03188698 A JPH03188698 A JP H03188698A
- Authority
- JP
- Japan
- Prior art keywords
- rubber
- heat dissipation
- bus
- temperature
- air layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、ＩＣ等の電子部品が発生する熱を放熱する
機構を有する電子装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device having a mechanism for dissipating heat generated by electronic components such as ICs.
第５図は従来のこの種放熱機構付電子装置を示す図で、
図において、１は基板、２は基板１に配置され、端部に
放熱部２１を有するサーマルブス、３は熱伝導性のよい
ラバー４を介してサーマルラス２上に配置され基板１に
半田付５されたＩＣ１６はＩＣ３とラバー４およびラバ
ー４とサーマルブス２の間に生じた空気層である。FIG. 5 is a diagram showing a conventional electronic device with a heat dissipation mechanism of this type.
In the figure, 1 is a board, 2 is a thermal bus placed on the board 1 and has a heat dissipation part 21 at the end, and 3 is placed on a thermal lath 2 via a rubber 4 with good thermal conductivity, and is soldered to the board 1. The IC 16 shown in FIG. 5 is an air layer formed between the IC 3 and the rubber 4 and between the rubber 4 and the thermal bus 2.
この従来のものでは、ＩＣ３で発生する熱は、ＩＣ３の
底面空気層６．ラバー４、空気層６、サーマルブス２を
経て伝わり、サーマルブス２の冷却部２１に吸収されて
ＩＣが冷却される。In this conventional device, the heat generated in the IC3 is transferred to the bottom air layer 6 of the IC3. It is transmitted through the rubber 4, the air layer 6, and the thermal bus 2, and is absorbed by the cooling part 21 of the thermal bus 2, thereby cooling the IC.
従来のサーマルブス付基板は以上のように構成されてい
るので、ＩＣ３から発生する熱が空気層６を２回分して
伝わるため、この部分での温度上昇が大きくなり、ＩＣ
３の温度が高くなる。また空気［６の厚みはサーマルブ
ス２．ＩＣ３の表面荒さやＩＣ３がサーマルブス２に対
して押しつけられる力等に起因するため、空気層６の厚
みをコントロールするのは不可能であり、空気層のバラ
ツキによるＩＣの温度のバラツキが生じるなどの問題点
があった。Since the conventional board with thermal bus is configured as described above, the heat generated from the IC 3 is transmitted through the air layer 6 twice, resulting in a large temperature rise in this part, and the IC
3. The temperature increases. Also, the thickness of air [6 is thermal bus 2. It is impossible to control the thickness of the air layer 6 because it is caused by the surface roughness of the IC 3 and the force with which the IC 3 is pressed against the thermal bus 2, and variations in the temperature of the IC occur due to variations in the air layer. There was a problem.
この発明は、このような問題点を解消するためになされ
たもので、ＩＣの底面とラバーおよびうバーとサーマル
ブスの間の空気層をなくすとともに、ＩＣの温度上昇を
おさえ、ＩＣの温度上昇のバラツキをなくすことができ
る放熱機構付電子装置を得ることを目的とする。This invention was made to solve these problems, and it eliminates the air layer between the bottom surface of the IC and the rubber and between the cover and the thermal bus, suppresses the temperature rise of the IC, and reduces the temperature rise of the IC. An object of the present invention is to obtain an electronic device with a heat dissipation mechanism that can eliminate variations in the temperature.
この発明に係る放熱機構付電子装置は、放熱部材に熱伝
導性の良好なラバーを介して電子部品を取付けるものに
おいて、電子部品をラバーを介して放熱部材に固定した
後、高温状態下でラバーを軟化膨張させ、電子部品とラ
バーおよびラバーと放熱部材との間の空気層を除去する
よう構成したものである。In the electronic device with a heat dissipation mechanism according to the present invention, in which an electronic component is attached to a heat dissipation member through a rubber having good thermal conductivity, after the electronic component is fixed to the heat dissipation member through the rubber, the The rubber is softened and expanded to remove the air layer between the electronic component and the rubber, and between the rubber and the heat dissipation member.
この発明におけるラバーは、−度高温放置されるので、
電子部品とラバーおよびラバーと放熱部材を完全密着で
き、電子部品の温度上昇をおさえ、ＩＣの温度上昇のバ
ラツキをなくすことができる。Since the rubber in this invention is left at a -degree high temperature,
The electronic component and the rubber and the rubber and the heat dissipation member can be brought into perfect contact with each other, suppressing the temperature rise of the electronic component and eliminating variations in the temperature rise of the IC.
以下この発明の一実施例を第１図〜第３図にもとづいて
説明する。即ち第１図〜第３図において、７はＩＣ３と
ラバー４およびラバー４とサーマルブス２の完全密着部
である。なおその他の構成は第５図に示す従来のものと
同様であるので説明を省略する。An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. That is, in FIGS. 1 to 3, 7 is a complete contact portion between the IC 3 and the rubber 4, and between the rubber 4 and the thermal bus 2. The rest of the configuration is the same as the conventional one shown in FIG. 5, so the explanation will be omitted.
このように構成されたものでは、まずＩＣ３をラバー４
を介してサーマルジス２上に置き、第３図イの矢印方向
にＩＣ３を押さえて基板１に半田付５後、第３図口に示
すようにラバー４を軟化させ高温状態で放置し、ラバー
４を軟化膨張させＩＣ３とラバー４およびラバー４とサ
ーマルブス２との間の空気層６を除去し、空気層にラバ
ーを浸透させ、しかる後第３図ハに示すように常温状態
で放置して、ラバーを軟化させ、Ｉ Ｃ３，ラバー４、
サーマルジス２相互間を完全密着させる。With this configuration, first, IC3 is connected to rubber 4.
After soldering 5 to the board 1 by pressing the IC 3 in the direction of the arrow in FIG. The air layer 6 between the IC 3 and the rubber 4 and between the rubber 4 and the thermal bus 2 is removed by softening and expanding, and the rubber is allowed to penetrate into the air layer, and then left at room temperature as shown in Fig. 3C. , soften the rubber, IC3, rubber 4,
Thermal gases 2 are brought into complete contact with each other.
このように構成されたものでは、ＩＣ３で発生する熱は
、ＩＣ３の底面ラバー４．サーマルブス２を経てサーマ
ルブス２の冷却部２１に吸収され、ＩＣが冷却されるが
、この際温度上昇の原因となる空気層を介さないで伝え
ることができるので、ＩＣの放熱が安定し、ＩＣの温度
上昇のバラツキかなくなる。With this configuration, the heat generated in the IC3 is transferred to the bottom rubber 4. The heat is absorbed into the cooling part 21 of the thermal bus 2 through the thermal bus 2, and the IC is cooled. At this time, the heat can be transmitted without going through an air layer that causes a temperature rise, so the heat radiation of the IC is stabilized. Eliminates variations in IC temperature rise.
なお、この実施例では、高温放置後常温放置させる工程
によって製造するものについて説明したが、ＩＣを基板
に固定するものの半田付プロセスにおいて、半田層の周
囲温度を高温に保持した状態で、半田付プロセスを行っ
ても同じ構造のものを得ることができる。In addition, in this example, an explanation has been given of a device manufactured by a process of leaving it at a high temperature and then leaving it at a room temperature. However, in the soldering process for fixing an IC to a substrate, soldering is performed while the ambient temperature of the solder layer is maintained at a high temperature. Even if the process is repeated, the same structure can be obtained.
また、これらの実施例では、サーマルブス付基板の場合
について説明したが、第４図に示すようにトランジスタ
８をラバー４を介して冷却フィン９に取付けるものに対
しても適用できる。Further, in these embodiments, the case of a substrate with a thermal bus has been described, but the present invention can also be applied to a case where a transistor 8 is attached to a cooling fin 9 via a rubber 4 as shown in FIG.
上記のようにこの発明による放熱ｖ１楕付電子装置は、
電子部品と放熱部材との間に熱伝導性が良く、高温で軟
化するラバーを挿入し、電子部品の取付後、ラバーの軟
化温度に放置させて、電子部品とラバーおよびラバーと
放熱部材との間の空気層を除去して完全に密着させたも
ので、ＩＣの温度上昇がおさえられＩＣの温度上昇のバ
ラツキをなくすことができ、信頼性が向上する。As mentioned above, the electronic device with the heat dissipation v1 ellipse according to the present invention has the following features:
A rubber that has good thermal conductivity and softens at high temperatures is inserted between the electronic component and the heat dissipation member, and after the electronic component is installed, it is left at the softening temperature of the rubber, and the electronic component and the rubber and the rubber and the heat dissipation member are bonded. By removing the air layer between the ICs and making them completely adhere to each other, it is possible to suppress the temperature rise of the IC, eliminate variations in the temperature rise of the IC, and improve reliability.
第１図〜第３図はいずれもこの発明の一実施例を示す図
で、第１図は分解組立斜視図、第２図は第１図の■−■
線の断面図、第３図イ１ロ、ハは製造工程を説明する断
面図、第４図はこの発明の他の実施例を示す分解組立斜
視図、第５図は従来のこの種放熱機構付電子装置を示す
斜視図である。
図中、１は基板、２はサーマルブス、２１は放熱部、３
はＩＣ１４はラバー、５は半田、６は空気層である。
なお、図中同一符号は同−又は相当部分を示す。Figures 1 to 3 are views showing one embodiment of the present invention, with Figure 1 being an exploded perspective view, and Figure 2 being the same as shown in Figure 1.
3 is a cross-sectional view explaining the manufacturing process, FIG. 4 is an exploded perspective view showing another embodiment of the present invention, and FIG. 5 is a conventional heat dissipation mechanism of this type. FIG. 2 is a perspective view showing an attached electronic device. In the figure, 1 is the board, 2 is the thermal bus, 21 is the heat dissipation part, 3
IC14 is rubber, 5 is solder, and 6 is an air layer. Note that the same reference numerals in the figures indicate the same or equivalent parts.
Claims (1)
を取付けるものにおいて、電子部品をラバーを介して放
熱部材に固定した後、高温状態下でラバーを軟化膨張さ
せ電子部品とラバーおよびラバーと放熱部材との間の空
気層を除去するよう構成してなる放熱機構付電子装置。In the case where electronic components are attached to a heat dissipation member via rubber with good thermal conductivity, after the electronic components are fixed to the heat dissipation member via the rubber, the rubber is softened and expanded under high temperature conditions to bond the electronic components to the rubber and the rubber. An electronic device with a heat dissipation mechanism configured to remove an air layer between the heat dissipation member and the heat dissipation member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213618A JPH03188698A (en) | 1989-08-19 | 1989-08-19 | Electronic device with heat dissipation mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1213618A JPH03188698A (en) | 1989-08-19 | 1989-08-19 | Electronic device with heat dissipation mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03188698A true JPH03188698A (en) | 1991-08-16 |
Family
ID=16642156
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1213618A Pending JPH03188698A (en) | 1989-08-19 | 1989-08-19 | Electronic device with heat dissipation mechanism |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03188698A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563773A (en) * | 1991-11-15 | 1996-10-08 | Kabushiki Kaisha Toshiba | Semiconductor module having multiple insulation and wiring layers |
| WO2002075755A1 (en) * | 2001-03-21 | 2002-09-26 | Shin-Etsu Chemical Co., Ltd. | Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work |
-
1989
- 1989-08-19 JP JP1213618A patent/JPH03188698A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5563773A (en) * | 1991-11-15 | 1996-10-08 | Kabushiki Kaisha Toshiba | Semiconductor module having multiple insulation and wiring layers |
| WO2002075755A1 (en) * | 2001-03-21 | 2002-09-26 | Shin-Etsu Chemical Co., Ltd. | Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work |
| US7417078B2 (en) | 2001-03-21 | 2008-08-26 | Shin-Etsu Chemical Co., Ltd. | Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work |
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