JPH03188698A - Electronic device with heat dissipation mechanism - Google Patents

Electronic device with heat dissipation mechanism

Info

Publication number
JPH03188698A
JPH03188698A JP1213618A JP21361889A JPH03188698A JP H03188698 A JPH03188698 A JP H03188698A JP 1213618 A JP1213618 A JP 1213618A JP 21361889 A JP21361889 A JP 21361889A JP H03188698 A JPH03188698 A JP H03188698A
Authority
JP
Japan
Prior art keywords
rubber
heat dissipation
bus
temperature
air layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1213618A
Other languages
Japanese (ja)
Inventor
Kenji Tokunaga
徳永 健治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1213618A priority Critical patent/JPH03188698A/en
Publication of JPH03188698A publication Critical patent/JPH03188698A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • H05K1/0201Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/306Lead-in-hole components, e.g. affixing or retention before soldering, spacing means

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To suppress a rise in the temperature of an IC and to contrive a reduction in irregularity in the temperature rise of the IC by a method wherein an electronic component is fixed on a heat dissipation member via a rubber and thereafter, the rubber is softened and expanded under a high-temperature state and air layers between the component and the rubber and between the rubber and the member are removed. CONSTITUTION:An IC 3 is first put on a thermal bus 2 via a rubber 4 and after the bus is soldered on a substrate 1, they are left to stand in a high- temperature state, the rubber 4 is softened and expanded to remove air layers between the IC 3 and the rubber 4 and between the rubber 4 and the bus 2. After the rubber is made to soak in the air layers, they are left to stand it normal temperatures and the IC 3 and the rubber 4 and the rubber 4 and the bus 2 are mutually made to completely adhere. Thereby, heat which is generated in the IC 3 is absorbed in a beat dissipation part 21 via the base of the IC 3, the rubber 4 and the bus 2 and the IC is cooled. Accordingly, as no air layer is interposed between the IC and the rubber and between the rubber and the bus, the heat dissipation of the IC is stabilized and irregularity in a rise in the temperature of the IC is eliminated.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、IC等の電子部品が発生する熱を放熱する
機構を有する電子装置に関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic device having a mechanism for dissipating heat generated by electronic components such as ICs.

〔従来の技術〕[Conventional technology]

第5図は従来のこの種放熱機構付電子装置を示す図で、
図において、1は基板、2は基板1に配置され、端部に
放熱部21を有するサーマルブス、3は熱伝導性のよい
ラバー4を介してサーマルラス2上に配置され基板1に
半田付5されたIC16はIC3とラバー4およびラバ
ー4とサーマルブス2の間に生じた空気層である。
FIG. 5 is a diagram showing a conventional electronic device with a heat dissipation mechanism of this type.
In the figure, 1 is a board, 2 is a thermal bus placed on the board 1 and has a heat dissipation part 21 at the end, and 3 is placed on a thermal lath 2 via a rubber 4 with good thermal conductivity, and is soldered to the board 1. The IC 16 shown in FIG. 5 is an air layer formed between the IC 3 and the rubber 4 and between the rubber 4 and the thermal bus 2.

この従来のものでは、IC3で発生する熱は、IC3の
底面空気層6.ラバー4、空気層6、サーマルブス2を
経て伝わり、サーマルブス2の冷却部21に吸収されて
ICが冷却される。
In this conventional device, the heat generated in the IC3 is transferred to the bottom air layer 6 of the IC3. It is transmitted through the rubber 4, the air layer 6, and the thermal bus 2, and is absorbed by the cooling part 21 of the thermal bus 2, thereby cooling the IC.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

従来のサーマルブス付基板は以上のように構成されてい
るので、IC3から発生する熱が空気層6を2回分して
伝わるため、この部分での温度上昇が大きくなり、IC
3の温度が高くなる。また空気[6の厚みはサーマルブ
ス2.IC3の表面荒さやIC3がサーマルブス2に対
して押しつけられる力等に起因するため、空気層6の厚
みをコントロールするのは不可能であり、空気層のバラ
ツキによるICの温度のバラツキが生じるなどの問題点
があった。
Since the conventional board with thermal bus is configured as described above, the heat generated from the IC 3 is transmitted through the air layer 6 twice, resulting in a large temperature rise in this part, and the IC
3. The temperature increases. Also, the thickness of air [6 is thermal bus 2. It is impossible to control the thickness of the air layer 6 because it is caused by the surface roughness of the IC 3 and the force with which the IC 3 is pressed against the thermal bus 2, and variations in the temperature of the IC occur due to variations in the air layer. There was a problem.

この発明は、このような問題点を解消するためになされ
たもので、ICの底面とラバーおよびうバーとサーマル
ブスの間の空気層をなくすとともに、ICの温度上昇を
おさえ、ICの温度上昇のバラツキをなくすことができ
る放熱機構付電子装置を得ることを目的とする。
This invention was made to solve these problems, and it eliminates the air layer between the bottom surface of the IC and the rubber and between the cover and the thermal bus, suppresses the temperature rise of the IC, and reduces the temperature rise of the IC. An object of the present invention is to obtain an electronic device with a heat dissipation mechanism that can eliminate variations in the temperature.

〔課題を解決するための手段〕[Means to solve the problem]

この発明に係る放熱機構付電子装置は、放熱部材に熱伝
導性の良好なラバーを介して電子部品を取付けるものに
おいて、電子部品をラバーを介して放熱部材に固定した
後、高温状態下でラバーを軟化膨張させ、電子部品とラ
バーおよびラバーと放熱部材との間の空気層を除去する
よう構成したものである。
In the electronic device with a heat dissipation mechanism according to the present invention, in which an electronic component is attached to a heat dissipation member through a rubber having good thermal conductivity, after the electronic component is fixed to the heat dissipation member through the rubber, the The rubber is softened and expanded to remove the air layer between the electronic component and the rubber, and between the rubber and the heat dissipation member.

〔作用〕[Effect]

この発明におけるラバーは、−度高温放置されるので、
電子部品とラバーおよびラバーと放熱部材を完全密着で
き、電子部品の温度上昇をおさえ、ICの温度上昇のバ
ラツキをなくすことができる。
Since the rubber in this invention is left at a -degree high temperature,
The electronic component and the rubber and the rubber and the heat dissipation member can be brought into perfect contact with each other, suppressing the temperature rise of the electronic component and eliminating variations in the temperature rise of the IC.

〔実施例〕〔Example〕

以下この発明の一実施例を第1図〜第3図にもとづいて
説明する。即ち第1図〜第3図において、7はIC3と
ラバー4およびラバー4とサーマルブス2の完全密着部
である。なおその他の構成は第5図に示す従来のものと
同様であるので説明を省略する。
An embodiment of the present invention will be described below with reference to FIGS. 1 to 3. That is, in FIGS. 1 to 3, 7 is a complete contact portion between the IC 3 and the rubber 4, and between the rubber 4 and the thermal bus 2. The rest of the configuration is the same as the conventional one shown in FIG. 5, so the explanation will be omitted.

このように構成されたものでは、まずIC3をラバー4
を介してサーマルジス2上に置き、第3図イの矢印方向
にIC3を押さえて基板1に半田付5後、第3図口に示
すようにラバー4を軟化させ高温状態で放置し、ラバー
4を軟化膨張させIC3とラバー4およびラバー4とサ
ーマルブス2との間の空気層6を除去し、空気層にラバ
ーを浸透させ、しかる後第3図ハに示すように常温状態
で放置して、ラバーを軟化させ、I C3,ラバー4、
サーマルジス2相互間を完全密着させる。
With this configuration, first, IC3 is connected to rubber 4.
After soldering 5 to the board 1 by pressing the IC 3 in the direction of the arrow in FIG. The air layer 6 between the IC 3 and the rubber 4 and between the rubber 4 and the thermal bus 2 is removed by softening and expanding, and the rubber is allowed to penetrate into the air layer, and then left at room temperature as shown in Fig. 3C. , soften the rubber, IC3, rubber 4,
Thermal gases 2 are brought into complete contact with each other.

このように構成されたものでは、IC3で発生する熱は
、IC3の底面ラバー4.サーマルブス2を経てサーマ
ルブス2の冷却部21に吸収され、ICが冷却されるが
、この際温度上昇の原因となる空気層を介さないで伝え
ることができるので、ICの放熱が安定し、ICの温度
上昇のバラツキかなくなる。
With this configuration, the heat generated in the IC3 is transferred to the bottom rubber 4. The heat is absorbed into the cooling part 21 of the thermal bus 2 through the thermal bus 2, and the IC is cooled. At this time, the heat can be transmitted without going through an air layer that causes a temperature rise, so the heat radiation of the IC is stabilized. Eliminates variations in IC temperature rise.

なお、この実施例では、高温放置後常温放置させる工程
によって製造するものについて説明したが、ICを基板
に固定するものの半田付プロセスにおいて、半田層の周
囲温度を高温に保持した状態で、半田付プロセスを行っ
ても同じ構造のものを得ることができる。
In addition, in this example, an explanation has been given of a device manufactured by a process of leaving it at a high temperature and then leaving it at a room temperature. However, in the soldering process for fixing an IC to a substrate, soldering is performed while the ambient temperature of the solder layer is maintained at a high temperature. Even if the process is repeated, the same structure can be obtained.

また、これらの実施例では、サーマルブス付基板の場合
について説明したが、第4図に示すようにトランジスタ
8をラバー4を介して冷却フィン9に取付けるものに対
しても適用できる。
Further, in these embodiments, the case of a substrate with a thermal bus has been described, but the present invention can also be applied to a case where a transistor 8 is attached to a cooling fin 9 via a rubber 4 as shown in FIG.

〔発明の効果〕〔Effect of the invention〕

上記のようにこの発明による放熱v1楕付電子装置は、
電子部品と放熱部材との間に熱伝導性が良く、高温で軟
化するラバーを挿入し、電子部品の取付後、ラバーの軟
化温度に放置させて、電子部品とラバーおよびラバーと
放熱部材との間の空気層を除去して完全に密着させたも
ので、ICの温度上昇がおさえられICの温度上昇のバ
ラツキをなくすことができ、信頼性が向上する。
As mentioned above, the electronic device with the heat dissipation v1 ellipse according to the present invention has the following features:
A rubber that has good thermal conductivity and softens at high temperatures is inserted between the electronic component and the heat dissipation member, and after the electronic component is installed, it is left at the softening temperature of the rubber, and the electronic component and the rubber and the rubber and the heat dissipation member are bonded. By removing the air layer between the ICs and making them completely adhere to each other, it is possible to suppress the temperature rise of the IC, eliminate variations in the temperature rise of the IC, and improve reliability.

【図面の簡単な説明】[Brief explanation of drawings]

第1図〜第3図はいずれもこの発明の一実施例を示す図
で、第1図は分解組立斜視図、第2図は第1図の■−■
線の断面図、第3図イ1ロ、ハは製造工程を説明する断
面図、第4図はこの発明の他の実施例を示す分解組立斜
視図、第5図は従来のこの種放熱機構付電子装置を示す
斜視図である。 図中、1は基板、2はサーマルブス、21は放熱部、3
はIC14はラバー、5は半田、6は空気層である。 なお、図中同一符号は同−又は相当部分を示す。
Figures 1 to 3 are views showing one embodiment of the present invention, with Figure 1 being an exploded perspective view, and Figure 2 being the same as shown in Figure 1.
3 is a cross-sectional view explaining the manufacturing process, FIG. 4 is an exploded perspective view showing another embodiment of the present invention, and FIG. 5 is a conventional heat dissipation mechanism of this type. FIG. 2 is a perspective view showing an attached electronic device. In the figure, 1 is the board, 2 is the thermal bus, 21 is the heat dissipation part, 3
IC14 is rubber, 5 is solder, and 6 is an air layer. Note that the same reference numerals in the figures indicate the same or equivalent parts.

Claims (1)

【特許請求の範囲】[Claims]  放熱部材に熱伝導性の良好なラバーを介して電子部品
を取付けるものにおいて、電子部品をラバーを介して放
熱部材に固定した後、高温状態下でラバーを軟化膨張さ
せ電子部品とラバーおよびラバーと放熱部材との間の空
気層を除去するよう構成してなる放熱機構付電子装置。
In the case where electronic components are attached to a heat dissipation member via rubber with good thermal conductivity, after the electronic components are fixed to the heat dissipation member via the rubber, the rubber is softened and expanded under high temperature conditions to bond the electronic components to the rubber and the rubber. An electronic device with a heat dissipation mechanism configured to remove an air layer between the heat dissipation member and the heat dissipation member.
JP1213618A 1989-08-19 1989-08-19 Electronic device with heat dissipation mechanism Pending JPH03188698A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1213618A JPH03188698A (en) 1989-08-19 1989-08-19 Electronic device with heat dissipation mechanism

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1213618A JPH03188698A (en) 1989-08-19 1989-08-19 Electronic device with heat dissipation mechanism

Publications (1)

Publication Number Publication Date
JPH03188698A true JPH03188698A (en) 1991-08-16

Family

ID=16642156

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1213618A Pending JPH03188698A (en) 1989-08-19 1989-08-19 Electronic device with heat dissipation mechanism

Country Status (1)

Country Link
JP (1) JPH03188698A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
WO2002075755A1 (en) * 2001-03-21 2002-09-26 Shin-Etsu Chemical Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5563773A (en) * 1991-11-15 1996-10-08 Kabushiki Kaisha Toshiba Semiconductor module having multiple insulation and wiring layers
WO2002075755A1 (en) * 2001-03-21 2002-09-26 Shin-Etsu Chemical Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work
US7417078B2 (en) 2001-03-21 2008-08-26 Shin-Etsu Chemical Co., Ltd. Electromagnetic wave absorbing thermally conductive composition and thermosoftening electromagnetic wave absorbing heat dissipation sheet and method of heat dissipation work

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