JPH03184349A - Manufacture of resin-sealed electronic component - Google Patents
Manufacture of resin-sealed electronic componentInfo
- Publication number
- JPH03184349A JPH03184349A JP1321525A JP32152589A JPH03184349A JP H03184349 A JPH03184349 A JP H03184349A JP 1321525 A JP1321525 A JP 1321525A JP 32152589 A JP32152589 A JP 32152589A JP H03184349 A JPH03184349 A JP H03184349A
- Authority
- JP
- Japan
- Prior art keywords
- main surface
- resin
- support plate
- molding cavity
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 11
- 239000011347 resin Substances 0.000 claims abstract description 62
- 229920005989 resin Polymers 0.000 claims abstract description 62
- 238000000465 moulding Methods 0.000 claims abstract description 50
- 238000007789 sealing Methods 0.000 claims abstract description 43
- 238000002347 injection Methods 0.000 claims description 11
- 239000007924 injection Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 11
- 239000004065 semiconductor Substances 0.000 description 10
- 230000017525 heat dissipation Effects 0.000 description 3
- 238000003780 insertion Methods 0.000 description 3
- 230000037431 insertion Effects 0.000 description 3
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 3
- 238000001721 transfer moulding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
童東上立並五狂夏
本発明は樹脂封止形電子部品の製造方法に関し、詳細に
は複数個の支持板が１つの樹脂封止体で被覆され且つこ
れら複数の支持板の下面側にも樹脂封止体の一部が形成
されている樹脂封止形電子部品の製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method of manufacturing a resin-sealed electronic component, and more specifically, a method for manufacturing a resin-sealed electronic component, in which a plurality of support plates are covered with one resin-sealed body, and a plurality of these The present invention relates to a method for manufacturing a resin-sealed electronic component in which a part of the resin-sealed body is also formed on the lower surface of a support plate.
び の べき
電力用半導体装置において、放熱板を兼ねる支持板の下
面側にも樹脂封止体の一部が形成された樹脂封止形半導
体装置がある。この種の半導体装置では外部放熱体への
取付けにマイカ板等の絶縁部材が不要であり取付は作業
が簡単化する反面。Among power semiconductor devices that should be expanded, there are resin-sealed semiconductor devices in which a portion of a resin-sealed body is also formed on the lower surface of a support plate that also serves as a heat sink. This type of semiconductor device does not require an insulating member such as a mica plate to attach to an external heat sink, which simplifies the installation process.
放熱板の裏面が露出した構造の半導体装置に比べて放熱
性の低下する欠点がある。このため、支持板の下面側に
形成される樹脂封止体の厚みを支持板の上面側に形成さ
れる樹脂封止体の厚みに比べて十分に薄くして放熱性を
少しでも向上させる必要がある。この種の半導体装置の
樹脂封止体は周知のトランファモールド成形で形成する
。したがって、支持板の下面側に薄い樹脂封止体を形成
するには、封止用樹脂を支持板の下面とそれに対向する
成形空所の底面との狭い間隔に充填する必要がある。そ
のため、支持板の下面側に樹脂封止体を良好に形成する
ことは容易ではない。This has the disadvantage that heat dissipation performance is lower than that of a semiconductor device having a structure in which the back surface of the heat dissipation plate is exposed. Therefore, it is necessary to make the thickness of the resin encapsulant formed on the lower surface of the support plate sufficiently thinner than the thickness of the resin encapsulant formed on the upper surface of the support plate to improve heat dissipation as much as possible. There is. The resin-sealed body of this type of semiconductor device is formed by well-known transfer molding. Therefore, in order to form a thin resin sealing body on the lower surface side of the support plate, it is necessary to fill the narrow space between the lower surface of the support plate and the bottom surface of the molding cavity facing therewith with the sealing resin. Therefore, it is not easy to form a good resin sealing body on the lower surface side of the support plate.
ところで、今日、電力用半導体装置の高機能化に伴って
複数の支持板を１つの樹脂封止体で被覆する電子部品の
実現が望まれる。この場合、１個の支持板を樹脂封止す
る場合に比べて支持板の下面側に良好な樹脂封止体を形
成することが更に困難となること、が本願発明者等によ
って明らかとされた。このため、例えば特開昭６０−２
５７２９号公報に開示されているように、上型の一部に
封止用樹脂の注入方向と垂直な方向に延在する突出部を
設けて支持板の上面側への封止用樹脂の流れを抑制して
、支持板の下面への封止用樹脂の流れを相対的に強める
方法が提案されている。この方法は支持板が１個の場合
には有効であっても、支持板を２個以上被覆する場合に
は十分な効果が得られなかった。Nowadays, as power semiconductor devices become more sophisticated, it is desired to realize an electronic component in which a plurality of support plates are covered with one resin sealant. In this case, the inventors of the present application have clarified that it is more difficult to form a good resin sealing body on the lower surface side of the support plate than when one support plate is resin-sealed. . For this reason, for example, JP-A-60-2
As disclosed in Japanese Patent No. 5729, a protrusion extending in a direction perpendicular to the injection direction of the sealing resin is provided in a part of the upper mold to allow the sealing resin to flow toward the upper surface of the support plate. A method has been proposed in which the flow of the sealing resin to the lower surface of the support plate is relatively strengthened by suppressing this. Although this method is effective when there is only one support plate, sufficient effects cannot be obtained when two or more support plates are coated.
そこで、本発明は上記の問題を解決し、複数個の支持板
を１つの樹脂封止体で良好に且つ容易に樹脂封止するこ
とのできる樹脂封止形電子部品の製造方法を提供するこ
とを目的とする。SUMMARY OF THE INVENTION Therefore, the present invention solves the above problems and provides a method for manufacturing a resin-sealed electronic component that can satisfactorily and easily resin-seal a plurality of support plates with one resin-sealed body. With the goal.
を するための
本発明の樹脂封止形電子部品の製造方法によれば、まず
、リードフレーム組立体を用意する。このリードフレー
ムは互いに離間して配置された複数の支持板と支持板の
一方の端部側に配置された複数の外部リードとを有する
。また、支持板の一方の主面には電子素子が固着されて
おり、電子素子と外部リードとがリード細線を介して電
気的に接続されている。According to the method for manufacturing a resin-sealed electronic component of the present invention, first, a lead frame assembly is prepared. This lead frame has a plurality of support plates arranged apart from each other and a plurality of external leads arranged at one end side of the support plates. Further, an electronic element is fixed to one main surface of the support plate, and the electronic element and external leads are electrically connected via thin lead wires.
次に、リードフレーム組立体を成形用型に配置する。即
ち、成形用型を構成する上型と下型とを閉じることによ
って形成される成形空所内にリードフレーム組立体の隣
り合う少なくとも２つの支持板を配置する。また、支持
板の一方の主面とそれに対向する成形空所の第１の主面
との間隔よりも小さい間隔において、支持板の他方の主
面を成形空所の第２の生餌から離間させる。更に、成形
空所に連絡する複数の樹脂注入口の各々の少なくとも一
部を支持板の一方の主面上に位置する平面と成形空所の
第２の主面との間に設ける。更に、支持板の各々の他方
の端部を対応する樹脂注入口に対向させる。The lead frame assembly is then placed in a mold. That is, at least two adjacent support plates of the lead frame assembly are disposed within a molding cavity formed by closing an upper mold and a lower mold forming a mold. Further, the other main surface of the support plate is separated from the second live bait in the forming cavity at a distance smaller than the distance between one main surface of the support plate and the first main surface of the forming cavity opposite thereto. let Further, at least a portion of each of the plurality of resin inlets communicating with the molding cavity is provided between a plane located on one major surface of the support plate and a second major surface of the molding cavity. Further, the other end of each of the support plates is opposed to the corresponding resin injection port.
続いて、複数の樹脂封入口の各々から成形空所に封止用
樹脂を注入する。Subsequently, a sealing resin is injected into the molding cavity from each of the plurality of resin sealing ports.
本発明の実施例では、樹脂注入口は支持板の一方の主面
上に位置する平面と成形空所の第２の主面との間に配置
されている。In an embodiment of the invention, the resin inlet is arranged between a plane located on one major surface of the support plate and a second major surface of the molding cavity.
庄−一部
請求項（１）に記載の発明によれば、成形空所内に配置
された複数の支持板の各々が支持板の一方の端部側で少
なくともｌっの樹脂注入口に対向している。また、各樹
脂注入口の少なくとも一部は支持板の一方の主面よりも
下側の領域に対向している。したがって、樹脂注入口か
ら成形空所内に封止用樹脂を注入すれば、各支持板の他
方の主面側にも封止用樹脂を良好に注入することができ
る。According to the invention set forth in part claim (1), each of the plurality of support plates arranged in the molding cavity faces at least one resin injection port on one end side of the support plate. ing. Furthermore, at least a portion of each resin injection port faces a region below one main surface of the support plate. Therefore, by injecting the sealing resin into the molding cavity from the resin injection port, the sealing resin can also be successfully injected into the other main surface side of each support plate.
請求項（２）に記載の発明では、樹脂注入口が支持板の
一方の主面上に位置する平面と成形空所の第２の主面と
の間に配置されているから、複数の支持板の他方の主面
側に対して封止用樹脂を十分に供給でき、成形性が更に
向上する。In the invention described in claim (2), since the resin injection port is arranged between the plane located on one main surface of the support plate and the second main surface of the molding cavity, the plurality of supports Encapsulating resin can be sufficiently supplied to the other main surface of the plate, further improving moldability.
失−一族一〜銖
以下、本発明の一実施例である樹脂封止形トランジスタ
装置の製造方法について説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS A method of manufacturing a resin-sealed transistor device according to an embodiment of the present invention will be described below.
本実施例で形成される樹脂封止形トランジスタ装置は、
第１図に示すように２個分のトランジスタが１つの外囲
体でパッケージされた複合型トランジスタ装置である。The resin-sealed transistor device formed in this example is as follows:
As shown in FIG. 1, this is a composite transistor device in which two transistors are packaged in one envelope.
第１図に示すトランジスタ装Ｍ （１）を形成するには
、まず第２図に示すリードフレーム組立体（２）を用意
する。リードフレーム組立体（２）は、リードフレーム
（３）と。To form the transistor device M (1) shown in FIG. 1, first, a lead frame assembly (2) shown in FIG. 2 is prepared. The lead frame assembly (2) includes a lead frame (3).
電子素子としての複数の半導体チップ（４）と、複数の
リード細線（５）とから構成される。リードフレーム（
３）は複数の支持板（６）と、複数の支持板（６）の一
方の端部（６ｃ）側に配置された複数の外部リード（８
）と、複数の支持板（６）の他方の端部（６ｄ）側に配
置された複数の支持リード（７）とを有する。並置され
た複数の支持リード（７）と外部リード（８）は各々支
持リード連結細条（９）及び外部リード連結細条（１０
） （１１）によって連結されている。半導体チップ
（４）は周知のダイボンディング法によって半田（図示
省略）を介して支持板（６）の一方の主面（６ａ）に固
着されている。リード細線（５）は周知のワイヤボンデ
ィング法によって形成され、半導体チップ（４）の上面
に形成された電極（図示省略）と外部リード（８）とを
電気的に接続している０本実施例のリードフレーム（３
）は支持板（６）の他方の端部（６ｄ）側が支持リード
連結細条（９）によって連結され、支持板（６）の一方
の端部（６ｃ）側が外部リード連結細条（１０） （
１１）によって連絡され全体として梯子形状に連結され
るから、曲がりや歪みが生じ難い。It is composed of a plurality of semiconductor chips (4) as electronic elements and a plurality of thin lead wires (5). Lead frame(
3) includes a plurality of support plates (6) and a plurality of external leads (8) disposed on one end (6c) side of the plurality of support plates (6).
) and a plurality of support leads (7) arranged on the other end (6d) side of the plurality of support plates (6). A plurality of support leads (7) and external leads (8) juxtaposed each have a support lead connection strip (9) and an external lead connection strip (10).
) (11). The semiconductor chip (4) is fixed to one main surface (6a) of the support plate (6) via solder (not shown) by a well-known die bonding method. The thin lead wire (5) is formed by a well-known wire bonding method and electrically connects the electrode (not shown) formed on the top surface of the semiconductor chip (4) and the external lead (8). lead frame (3
) is connected to the other end (6d) side of the support plate (6) by the support lead connection strip (9), and the one end (6c) side of the support plate (6) is connected to the external lead connection strip (10). (
11) and are connected in a ladder shape as a whole, so bending and distortion are unlikely to occur.
次に、第１図に示す樹脂封止体（１２）を周知のトラン
スファモールド法で形成するため、第２図のリードフレ
ーム組立体（２）をトランスファモールド成形用の金型
に配置する。第３図に示すように、本実施例の金型（１
３）は上下に開閉可能な一対の上型（１４）と下型（１
５）から構成されている。第３図に示すように上型（１
４）と下型（１５）にはそれぞれ凹部（１６）及び凹部
（１７）が形成されている。上型（１４）の凹部（１６
）には段差部（１８）が形成されており、支持板（６）
の他方の端部（６ｄ）側に第１の平面（１９）、支持板
（６）の一方の端部（６ｃ）側に第２の平面（２０）が
設けられる。第１の平面（１９〉と第２の平面（２０）
は成形空所の第１の主面を形成する。第１の平面（１９
）は第２の平面（２０）よりも支持板（６）の一方の主
面（６８）側に偏位している。上型（１４）と下型（１
５）を閉じると、金型（１３）内には凹部（１６〉 と
凹部（１７）によって成形空所（キャビティ） （２
１）が形成される。成形空所（２１）は樹脂封止体（１
２）の形状に合致し、支持板（６）が２個づつ収容され
る。凹部（１６）の第１の平面（１９）には１つの成形
空所（２１）につき２個のビン（２２）と１個の凸部（
２３）が形成されている。下型（１５）には、支持リー
ド（７）と支持リード連結細条（９）が収容される溝（
２４）及び外部リード（８）と外部リード連結細条（１
０） （１１）の収容される溝（２５）が形成されて
いる。更に、下型（１５）には封止用樹脂の流通路であ
るメインライナ（２６）、サブライナ（２７） 、ゲー
ト（２８）が形成されている。メインライナ（２６）は
封止用樹脂の投入されるポット（封止用樹脂投入口）に
通じており、支持リード細結細条（９）の延在する方向
に沿って形成されている。サブランナ（２７）はメイン
ランナ（２６）から分岐しており、ゲート（２８）を通
して成形空所（２１）に連絡している。第４図に示すよ
うに、各ゲート（２８）は各支持板（６）の他方の端部
（６ｄ）に対向して形成されている。ゲート（２８）は
支持板（６）の一方の主面（６ａ）上に位置する平面と
成形空所（２１）の底面（３０）との間の高さに形成さ
れている。凸部（２３）は成形空所（２１）の第１の平
面（１９）から部分的に支持板（６）の一方の主面（６
ａ）側、即ち底面（３０）に向って隣合う支持板（６）
の間に形成された中間領域（２９）に対向して突出し、
且つ支持板（６）の他方の端部側（６ｄ）から一方の端
部側（６ｅ）に向って外部リード（８）の導出する方向
に延在している。Next, in order to form the resin sealing body (12) shown in FIG. 1 by the well-known transfer molding method, the lead frame assembly (2) shown in FIG. 2 is placed in a mold for transfer molding. As shown in Fig. 3, the mold (1
3) is a pair of upper mold (14) and lower mold (1) that can be opened and closed vertically.
5). As shown in Figure 3, the upper mold (1
4) and the lower mold (15) are formed with a recess (16) and a recess (17), respectively. The recess (16) of the upper mold (14)
) is formed with a stepped portion (18), and the supporting plate (6)
A first plane (19) is provided on the other end (6d) side of the support plate (6), and a second plane (20) is provided on the one end (6c) side of the support plate (6). First plane (19) and second plane (20)
forms the first major surface of the mold cavity. First plane (19
) is deviated from the second plane (20) toward one main surface (68) of the support plate (6). Upper mold (14) and lower mold (1
When the mold (13) is closed, a molding cavity (2) is created by the recess (16> and recess (17)
1) is formed. The molding cavity (21) is filled with a resin sealing body (1
Matching the shape of 2), two support plates (6) are accommodated each. On the first plane (19) of the recess (16) there are two bottles (22) and one protrusion (22) per molding cavity (21).
23) is formed. The lower die (15) has a groove (
24) and external lead (8) and external lead connection strip (1
0) A groove (25) in which (11) is accommodated is formed. Furthermore, a main liner (26), a sub-liner (27), and a gate (28) are formed in the lower mold (15) as flow paths for the sealing resin. The main liner (26) communicates with a pot (sealing resin inlet) into which the sealing resin is introduced, and is formed along the direction in which the support lead thin strips (9) extend. The sub-runner (27) branches off from the main runner (26) and communicates with the forming cavity (21) through a gate (28). As shown in FIG. 4, each gate (28) is formed facing the other end (6d) of each support plate (6). The gate (28) is formed at a height between the plane located on one main surface (6a) of the support plate (6) and the bottom surface (30) of the forming cavity (21). The convex portion (23) extends partially from the first plane (19) of the molding cavity (21) to one main surface (6) of the support plate (6).
Adjacent support plates (6) toward the a) side, that is, the bottom surface (30)
protruding opposite to the intermediate region (29) formed between;
Further, it extends from the other end side (6d) to the one end side (6e) of the support plate (6) in the direction in which the external lead (8) is led out.
支持リード（７）と外部リード（８）をそれぞれ溝（２
４）と溝（２５）に配置して上型（１４〉と下型（１５
）を閉じると、第３図に示すように支持リード（７）と
外部リード（８）が上型（１４）と下型（１５）に挟ま
れて、支持板（６）が成形空所（２１）の第２の主面と
しての底面（３０）からＲｒｌｆｆシた状態で固定され
る。支持板（６）の他方の主面（６ｂ）と成形空所（２
１）の底面（３０）との間隔は、約０゜５ｇｍであり、
支持板（６）の一方の主面（６ａ〉と成形空所（２１）
の第１の平面（１９）又は支持板（６）の一方の主面（
６ａ）と成形空所（２１）の第２の平面（２０）との間
隔よりも十分に小さい。上型（１４）に設けられた２つ
のピン（２２）は各々対応する支持板（６）の貫通孔（
６ｅ）に配置される。Connect the support lead (7) and external lead (8) to the groove (2).
4) and the groove (25), and place the upper mold (14> and lower mold (15)
) is closed, the support lead (7) and external lead (8) are sandwiched between the upper mold (14) and the lower mold (15), and the support plate (6) is placed in the molding cavity ( 21) from the bottom surface (30) as the second principal surface. The other main surface (6b) of the support plate (6) and the molding cavity (2
The distance between 1) and the bottom surface (30) is approximately 0°5 gm,
One main surface (6a) of the support plate (6) and the molding cavity (21)
The first plane (19) of or one main surface of the support plate (6) (
6a) and the second plane (20) of the forming cavity (21). The two pins (22) provided on the upper mold (14) are inserted into the corresponding through holes (6) of the support plate (6).
6e).
ピン（２２）は貫通孔（６ｅ）の周面とは離間して配置
されるので、貫通孔（６ｅ）の内側には樹脂封止体（１
２）の一部が形成される。金型（１３）内には多数の成
形空所（２１）が形成され、第２図に示すリードフレー
ム組立体（２）の隣り合う支持板（６）が２個づつ各成
形空所（２１）に配置される。成形空所（２１）内にお
いて、隣り合う支持板（６）の間に形成された中間領域
（２９）の幅Ｌｚ（第４図）は、支持板（６）の側面と
それに対向する成形空所（２１）の側面との間隔Ｌ２よ
りも大きい、第３図及び第５図に示すように、支持板（
６）の一方の主面（６ａ）と成形空所（２１）の第１の
主面との間隔は、第２の平面（２ｏ）と対向する部分で
一番大きく、最大間隔が形成される６次いで支持板（６
）の一方の主面（６ａ）と成形空所（２１）の第１の主
面との間隔は、第１の平面（１９）と対向する部分で大
きく、中間領域（２９）に向って成形空所（２１）の第
１の平面（１９）から突出する凸部（２３）と対向する
部分で一番小さい、凸部（２３）の作用については後述
する。なお、第１図に示す樹脂封止体（１２）、の凹部
（１２ａ）は凸部（２３）により形成される。Since the pin (22) is arranged apart from the circumferential surface of the through hole (6e), the resin sealing body (1) is placed inside the through hole (6e).
2) is formed. A number of molding cavities (21) are formed in the mold (13), and two adjacent support plates (6) of the lead frame assembly (2) shown in FIG. ). In the molding cavity (21), the width Lz (Fig. 4) of the intermediate region (29) formed between adjacent support plates (6) is the width between the side surface of the support plate (6) and the molding cavity opposite thereto. As shown in FIGS. 3 and 5, the support plate (21) is larger than the distance L2 from the side surface of the
The distance between the one main surface (6a) of 6) and the first main surface of the molding cavity (21) is the largest in the part facing the second plane (2o), and the maximum distance is formed. 6 Then the support plate (6
) and the first main surface of the molding cavity (21) is larger in the portion facing the first plane (19), and the distance between the main surface (6a) of the molding cavity (21) is larger in the portion facing the first plane (19), and The effect of the convex portion (23), which is the smallest in the portion facing the convex portion (23) protruding from the first plane (19) of the cavity (21), will be described later. Note that the concave portion (12a) of the resin sealing body (12) shown in FIG. 1 is formed by the convex portion (23).
次に、高周波加熱によって軟化された封止用樹脂を金型
（１３）のポットに投入する。続いて、ポット内で上下
に駆動可能なプランジャ（押し型）によって封止用樹脂
を押圧してメインランナ（２６）及びサブランナ（２７
）を通してゲート（２８）がら成形空所（２１）内に押
圧注入する。本実施例では。Next, the sealing resin softened by high-frequency heating is put into the pot of the mold (13). Next, the sealing resin is pressed by a plunger (push mold) that can be driven up and down in the pot to form the main runner (26) and sub-runner (27).
) through the gate (28) into the molding cavity (21). In this example.
１つの成形空所（２１）に形成された２つのゲート（２
８）の各々に対し１つの支持板（６）の他方の端部（６
ｄ）側を対向させて配置するので、成形空所（２１）内
に一方の支持板（６）側と他方の支持板（６）側とにそ
れぞれ適正量で封止用樹脂を注入することができる。従
来では封止用樹脂を注入し難い支持板（６）の他方の主
面（６ｂ）側の薄い間隙内にも比較的容易に封止用樹脂
を注入できる８即ち、２つの支持板（６）間の中間領域
（２９）に連絡するゲート（２８）を１個のみ設けた場
合は、封止用樹脂が中間領域（２９）を通って支持板（
６）の一方の主面（６ａ）側に流入し易い０本実施例で
は、ゲート（２８）が中間領域（２９）の延長部分から
横方向に離間して設けられ、更に支持板（６）の他方の
端部（６ｄ）とこれに対向する成形空所（２１）の沿面
との間隔り、が隣り合う支持板（６）の間隔り、よりも
十分に小さい、このため、ゲート（２ｇ）から中間領域
（２９）に達する経路では封止用樹脂の流れ抵抗が大き
く、中間領域（２９）を通って支持板（６）の一方の主
面（６ａ）側へ向かう封止用樹脂の流れを抑制できる。Two gates (2) formed in one molding cavity (21)
the other end (6) of the support plate (6), one for each of the support plates (6)
d) Since the sides are arranged to face each other, an appropriate amount of sealing resin must be injected into the molding cavity (21) into one support plate (6) side and the other support plate (6) side, respectively. I can do it. In other words, it is possible to relatively easily inject the sealing resin into the thin gap on the other main surface (6b) side of the support plate (6), which is difficult to inject with the sealing resin in the past. ) If only one gate (28) is provided that communicates with the intermediate region (29) between
In this embodiment, the gate (28) is provided laterally spaced apart from the extended portion of the intermediate region (29), and the support plate (6) The distance between the other end (6d) of the gate (2g ) to the middle region (29), the flow resistance of the sealing resin is large, and the flow resistance of the sealing resin is large in the route from the middle region (29) to the one main surface (6a) of the support plate (6). The flow can be suppressed.
更に５本実施例では、２つのゲート（２８）がいずれも
支持板（６）の一方の主面（６ａ）よりも下側に形成さ
れているので、封止用樹脂が支持板（６）の他方の主面
（６ｂ）側に流動し易い、また、本実施例では、中間領
域（２９）を通って支持板（６）の一方の主面（６ａ）
側に向かう封止用樹脂の流れが凸部（２３）によって更
に有効に抑制される。Furthermore, in this embodiment, since the two gates (28) are both formed below one main surface (6a) of the support plate (6), the sealing resin is applied to the support plate (6). In this embodiment, the fluid flows easily toward the other main surface (6b) of the support plate (6) through the intermediate region (29).
The flow of the sealing resin toward the side is further effectively suppressed by the convex portion (23).
成形空所（２１）内に十分に充填された封止用樹脂が硬
化した後、リードフレーム組立体（３〉 を金型（１３
）から取出す。封止用樹脂が固化して形成された樹脂封
止体（１２）は支持板（６）の全面と外部リード（８）
の端部を被覆する。After the sealing resin sufficiently filled in the molding cavity (21) has hardened, the lead frame assembly (3) is placed in the mold (13).
). The resin sealing body (12) formed by solidifying the sealing resin covers the entire surface of the support plate (6) and the external lead (8).
Cover the ends of the
第１図において（１２ｂ）はピン（２２）に対応して形
成されたネジ挿入用孔である。また、支持リード（７）
をその導出方向に引張って樹脂封止体（１２）の内部で
破断する結果、樹脂封止体（１２）には支持リード（７
）の引抜きにより生じた孔（１２ｃ）が形成されている
。In FIG. 1, (12b) is a screw insertion hole formed to correspond to the pin (22). Also, support lead (7)
As a result, the support leads (7
) is formed by pulling out the hole (12c).
以上のように、本実施例によれば成形空所（２１）に配
置された２つの支持板（６）が１つの樹脂封止体（１２
）によって封止された構造の樹脂封止形電子部品の実現
が可能となる。As described above, according to this embodiment, the two support plates (6) arranged in the molding cavity (21) form one resin sealing body (12).
) makes it possible to realize a resin-sealed electronic component with a sealed structure.
変−一並一一斑
本発明の実施例は前記の例に限定されず種々の変更が可
能である。例えば、ゲート（２８）は支持板（６）の一
方の主面（６ａ）よりも上方に位置する部分を有しても
良い。しかしながら、支持板（６）の他方の主面（６ｂ
）側に封止用樹脂が良好に注入されるようにするには、
実施例のゲート構造が望ましい。The embodiments of the present invention are not limited to the above-mentioned examples, but can be modified in various ways. For example, the gate (28) may have a portion located above one main surface (6a) of the support plate (6). However, the other main surface (6b) of the support plate (6)
) side to ensure that the sealing resin is injected well.
The gate structure of the example is desirable.
また、第７図に示すようにゲート（２８）の上面を形成
する上型（１４）の下面にテーパ部（１４ａ）を設けて
も良い。これにより、封止用樹脂が成形空所（２１）の
底面（３０）に向けて射出されるので。Further, as shown in FIG. 7, a tapered portion (14a) may be provided on the lower surface of the upper mold (14) that forms the upper surface of the gate (28). As a result, the sealing resin is injected toward the bottom surface (30) of the molding cavity (21).
支持板（６）の他方の主面（６ｂ）の下方に封止用樹脂
が流入され易くなる。The sealing resin can easily flow below the other main surface (6b) of the support plate (6).
更に、前記実施例では、中間領域（２９）に沿って第１
の主面（１９）の一方の端部から他方の端部まで凸部（
２３）を延在させているが、凸部（２３）は第１の主面
（１９）に部分的に形威し、全体にわたり形成しなくて
も良い。しかしながら、支持板（６）の上面側への封止
用樹脂の流れを十分に抑制するには、ゲート（２８）の
形成された成形空所（２１）の側面（２１ａ）がら第１
の主面（１９）の長さの１／３以上、望ましくは１／２
以上まで凸部（２３）を延在させるのが良い。また、成
形空所（２１） （７）第１の主面（１９）と第２の主
面（２ｏ）トの間に段差部（１８）がない場合、ゲート
（２８）の形成された成形空所（２１）の側面（２１ａ
）から第１の主面（１９）と第２の主ｉｆ￥（２ｏ）と
を合計したの長さの１／６以上、望ましくは１／４以上
まで延在させるのが良い。Furthermore, in the embodiment, the first
The convex portion (
Although the convex portion (23) extends partially on the first main surface (19), it is not necessary to form the convex portion (23) over the entire surface. However, in order to sufficiently suppress the flow of the sealing resin toward the upper surface side of the support plate (6), it is necessary to
1/3 or more, preferably 1/2 of the length of the main surface (19) of
It is preferable to extend the convex portion (23) further than this. In addition, if there is no step part (18) between the molding cavity (21) (7) first main surface (19) and second main surface (2o), the molding with the gate (28) Side surface (21a) of empty space (21)
) to 1/6 or more, preferably 1/4 or more of the total length of the first main surface (19) and the second main surface (2o).
ネジ挿入用の孔（１２ｂ）を２つの支持板（６）の間に
配置した構造としてもよい。この場合、ネジ挿入用の孔
（１２ｂ）を形成するためのピン（２２）が中間領域（
２９）を流れる封止用樹脂の流れ留めとして機能する。A structure may also be adopted in which a screw insertion hole (12b) is arranged between two support plates (6). In this case, the pin (22) for forming the screw insertion hole (12b) is in the intermediate region (
29) functions as a flow stopper for the sealing resin flowing through.
３つ以上の支持板（６）を１つの樹脂封止体（１２）で
封止する構造としてもよい。この場合も、１つの支持板
に対して少なくともｌっの樹脂注入口を対向させる。A structure may be adopted in which three or more support plates (6) are sealed with one resin sealing body (12). In this case as well, at least one resin injection port is opposed to one support plate.
凸部（２３）を成形空所（２１）に対して上下に駆動可
能に設けて、封止用樹脂を成形空所（２１）内に注入す
るとき、凸部（２３）を成形空所（２１）内に突出させ
、その後凸部（２３）を成形空所（２１）から引抜いて
も良い。The convex portion (23) is provided so as to be movable up and down relative to the molding cavity (21), and when the sealing resin is injected into the molding cavity (21), the convex portion (23) is moved up and down into the molding cavity (21). 21) and then the protrusion (23) may be pulled out from the molding cavity (21).
凸部（２３）と支持板（６）の上面（６ａ）との間隔は
、支持板（６）の下面（６ｂ）とを成形空所（２１）の
底面（３０）との間隔より小さくしてもよい。The distance between the convex portion (23) and the top surface (6a) of the support plate (6) is made smaller than the distance between the bottom surface (6b) of the support plate (6) and the bottom surface (30) of the molding cavity (21). You can.
見見夏募来
以上のように、本発明によれば複数の支持板が１つの樹
脂封止体によって封止された構造の樹脂封止形電子部品
を戒形性良く且つ容易に形成することができる。As described above, according to the present invention, it is possible to easily form a resin-sealed electronic component having a structure in which a plurality of support plates are sealed with one resin sealing body with good formability. I can do it.
第１図は本発明の製造方法により製造された樹脂封止形
トランジスタ装置の斜視図、第２図はこの製造方法に使
用するリードフレーム組立体の平面図、第３図は第４図
のｍ−ｍ線に沿う断面図。
第４図はリードフレーム組立体を成形用型に装着した状
態を示す断面図、第５図は第４図の■−ｖ線に沿う断面
図、第６図は第４図のＶＩ−ＶＩ線に沿う断面図、第７
図は変形実施例を示すゲートの部分的断面図である。
（２） 、 、リードフレーム組立体、（４） 、 、
半導体チップ（電子素子）、（５） 、 、リード細線
、（６） 、 、支持板、（６ａ） 、 、支持板の一
方の主面、（６ｂ） 、 、支持板の他方の主面、（６
ｃ） 、 。
支持板の一方の端部、（６ｄ） 、 、支持板の他方の
端部、（１４） 、 、上型、（１５） 、 、下型、
（１９） 。
、第１の平面（成形空所の第１の主面）、（２０） 。
、第２の平面（成形空所の第１の主面）、（２１） 。
、成形空所、（２３） 、 、凸部、（２５） 、 、
外部リード、（２８） 、 、ゲート（樹脂注入口）、
（２９） 。
、中間領域、（３０） 、 、底面（成形空所の第２の
主面）、FIG. 1 is a perspective view of a resin-sealed transistor device manufactured by the manufacturing method of the present invention, FIG. 2 is a plan view of a lead frame assembly used in this manufacturing method, and FIG. - A cross-sectional view taken along the m line. Fig. 4 is a sectional view showing the lead frame assembly mounted on a mold, Fig. 5 is a sectional view taken along line ■-v in Fig. 4, and Fig. 6 is a sectional view taken along line VI-VI in Fig. 4. 7th cross-sectional view along
The figure is a partial sectional view of a gate showing a modified embodiment. (2) , Lead frame assembly, (4) , ,
Semiconductor chip (electronic device), (5), , Thin lead wire, (6), , Support plate, (6a), , One main surface of the support plate, (6b), , The other main surface of the support plate, ( 6
c). One end of the support plate, (6d), the other end of the support plate, (14), upper mold, (15), lower mold,
(19). , first plane (first main surface of the forming cavity), (20). , second plane (first main surface of the forming cavity), (21). , molding cavity, (23) , , protrusion, (25) , ,
External lead, (28), , gate (resin injection port),
(29). , middle region, (30), , bottom surface (second main surface of molding cavity),
Claims (2)
板の一方の端部側に配置された複数の外部リードとを有
し、前記支持板の一方の主面には電子素子が固着されて
おり、該電子素子と前記外部リードとがリード細線を介
して電気的に接続されたリードフレーム組立体を用意す
る工程と、成形用型を構成する上型と下型とを閉じるこ
とによって形成される成形空所内に前記リードフレーム
組立体の隣り合う少なくとも２つの前記支持板を配置し
、前記支持板の一方の主面とそれに対向する前記成形空
所の第１の主面との間隔よりも小さい間隔において、前
記支持板の他方の主面を前記成形空所の第２の主面から
離間させ、前記成形空所に連絡する複数の樹脂注入口の
各々の少なくとも一部を前記支持板の一方の主面上に位
置する平面と前記成形空所の第２の主面との間に設けて
、前記支持板の各々の他方の端部を対応する前記樹脂注
入口に対向させて前記リードフレーム組立体を前記成形
用型に配置する工程と、 前記複数の樹脂封入口の各々から前記成形空所に封止用
樹脂を注入する工程と、 を有することを特徴とする樹脂封止形電子部品の製造方
法。(1) It has a plurality of support plates arranged at a distance from each other and a plurality of external leads arranged at one end side of the support plates, and an electronic element is arranged on one main surface of the support plate. a step of preparing a lead frame assembly in which the electronic element and the external lead are electrically connected via thin lead wires, and closing an upper mold and a lower mold forming a molding mold. at least two adjacent support plates of the lead frame assembly are disposed in a molding cavity formed by a molding cavity, and one main surface of the support plate and a first main surface of the molding cavity opposite thereto are arranged. the other major surface of the support plate is spaced apart from the second major surface of the molding cavity at an interval smaller than the spacing, and at least a portion of each of the plurality of resin injection ports communicating with the molding cavity is spaced apart from the second major surface of the molding cavity. provided between a plane located on one main surface of the support plate and a second main surface of the molding cavity, so that the other end of each of the support plates faces the corresponding resin injection port; a step of placing the lead frame assembly in the molding die, and a step of injecting a sealing resin into the molding cavity from each of the plurality of resin sealing ports. A method for manufacturing stationary electronic components.
置する平面と前記成形空所の第２の主面との間に配置さ
れている請求項（１）記載の樹脂封止形電子部品の製造
方法。(2) The resin sealing according to claim (1), wherein the resin injection port is arranged between a plane located on one main surface of the support plate and a second main surface of the molding cavity. A method for manufacturing shaped electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321525A JPH03184349A (en) | 1989-12-13 | 1989-12-13 | Manufacture of resin-sealed electronic component |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1321525A JPH03184349A (en) | 1989-12-13 | 1989-12-13 | Manufacture of resin-sealed electronic component |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03184349A true JPH03184349A (en) | 1991-08-12 |
Family
ID=18133546
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1321525A Pending JPH03184349A (en) | 1989-12-13 | 1989-12-13 | Manufacture of resin-sealed electronic component |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03184349A (en) |
-
1989
- 1989-12-13 JP JP1321525A patent/JPH03184349A/en active Pending
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