JPH03179809A - Manufacture of piezoelectric vibration component - Google Patents

Abstract

PURPOSE:To reduce the cutting off quantity of a mother protection board or a mother containing body and to simplify the cut-off by employing the mother protection board or the mother containing body whose thickness is made thinner than the thickness of the remaining areas at least at the part of an area to be cut off between each piezoelectric vibrator component. CONSTITUTION:A mother piezoelectric vibrator element 21 whose plural vibration electrodes 25, 26 are formed to both major faces of a piezoelectric mother board 24 opposite to each other is prepared and mother protection boards 22, 23 are bonded to both major faces of the mother piezoelectric vibrator element 21 to form a lamination and the laminated part of the area between each piezoelectric vibrator component is cut off to obtain each piezoelectric vibrator part. The thickness of the mother protection boards 22, 23 at least at the part of the area cut-off or eliminated between each piezoelectric vibrator component is made relatively thinner than the thickness of other area. Since the quantity of cut-off of the mother protection boards 22, 23 or the mother container is reduced, the cut-off is implemented efficiently and the positioning is facilitated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing piezoelectric vibrating components, and particularly to a method in which a cutting process for obtaining individual piezoelectric vibrating components from a mother laminate is improved. .

[Conventional technology]

An example of a conventional piezoelectric resonant component will be described with reference to FIGS. 2 and 3. This piezoelectric resonant component has a structure in which protective substrates 2 and 3 are bonded to the upper and lower surfaces of a piezoelectric resonant element 1 using an adhesive (not shown).

The piezoelectric resonant element 1 is constructed using a rectangular piezoelectric substrate 4 that is polarized in the thickness direction. A resonant electrode 5 is formed in the central region of the upper surface of the piezoelectric substrate 4, and the piezoelectric substrate 4
A resonant electrode 6 is also formed on the lower surface. Resonant electrode5.
6 is drawn out to the edge of the piezoelectric base [4] by a connecting conductive part 7.8. By applying a voltage from this connecting conductive portion 7.8, the piezoelectric substrate portion on which the resonant electrode 5.6 is provided is excited, and the thickness longitudinal vibration is confined in the piezoelectric substrate portion. .

The protective substrate 2.3 is bonded to the piezoelectric resonant element l in order to seal and protect the resonant portion of the piezoelectric resonant element l. In order to increase the protection ability, protecting groups Fi2.
3 is usually made of hard ceramic such as alumina, glass, or a heat-resistant and high-strength resin plate.

A concave portion 3a (a concave portion is also formed on the protective substrate 2 side, but not shown) is formed in the protective substrate 2.3. The recessed portion 3a is formed to provide a space for not hindering the vibration of the resonant portion.

Note that the resonant component 10 is completed by providing external electrodes 9a and 9b shown in FIG. 3 to the laminate bonded together with an adhesive.

By the way, during actual manufacturing, in order to improve mass production, the mother piezoelectric resonant element and the ! A plurality of piezoelectric resonant components are mass-produced using a substrate.

This will be explained with reference to FIG.

As shown in FIG. 4, the base piezoelectric resonant element 11 has a structure in which a plurality of pairs of resonant electrodes 5 and 6 are formed on both main surfaces of the base piezoelectric substrate 14. As shown in FIG. Then, a mother protection substrate 12 is attached to the upper and lower surfaces of this mother piezoelectric resonant element 11 via an adhesive (not shown).
．． 13 are bonded together to obtain a laminate. Mother protection board 12
．． 13, recesses 12a and 13a are formed in portions that cover each vibrating electrode 5.6, respectively.

After obtaining the above-mentioned laminate, the cutting blade 19.19 is lowered from above to cut and remove the area between the dashed lines shown in the figure, thereby obtaining individual piezoelectric resonant components in a state before external electrodes are formed. Ta.

[Technical problem to be solved by the invention] However,
The mother protection substrate 12.13 is made of a relatively hard material as described above. Therefore, it is extremely difficult to efficiently cut and remove the area surrounded by the broken lines in FIG.

Therefore, an object of the present invention is to provide a method for manufacturing a piezoelectric vibrating component, which includes a process that makes it possible to efficiently cut a laminate of piezoelectric vibrating components obtained in a mother state into individual piezoelectric vibrating components. It's about doing.

[Means for solving technical problems]

A first method for manufacturing a piezoelectric vibrating component of the present invention includes the steps of preparing a mother piezoelectric vibrating element in which a plurality of vibrating electrodes are formed on both main surfaces of a piezoelectric mother substrate so as to face each other with the piezoelectric mother substrate interposed therebetween. , a motherboard on both principal surfaces of the motherboard piezoelectric vibrating element! The method includes a step of bonding one substrate to obtain a laminate, and a step of cutting and removing a portion of the laminate in the area between the individual piezoelectric vibrating components in order to cut the laminate into individual piezoelectric vibrating components. In the method of manufacturing a vibrating component, the piezoelectric vibrating component is used as a mother protective substrate, and the thickness of at least a portion of the region that is cut and removed between the individual piezoelectric vibrating components is relatively thinner than the thickness of other regions. It is characterized by using

Further, the second manufacturing method of the present invention includes a step of preparing a mother piezoelectric vibrating element in which a plurality of vibrating electrodes are formed on both main surfaces of a mother piezoelectric substrate so as to face each other with the mother piezoelectric substrate interposed therebetween; a step of cutting the piezoelectric vibrating element to obtain individual piezoelectric vibrating elements; a step of preparing a mother storage body that is planned to be divided into at least two parts and for hermetically sealing the piezoelectric vibrating element; A piezoelectric device comprising the steps of accommodating piezoelectric vibrating elements in a mother housing and hermetically sealing the same, and obtaining individual piezoelectric vibrating parts by cutting and removing portions of the mother housing between individual piezoelectric vibrating parts. A method for manufacturing a vibrating component, characterized in that a mother storage body is used in which at least a portion of a region to be cut and removed between individual piezoelectric vibrating components is relatively thinner than the remaining region. do.

(Function) The thickness of the protective substrate or the mother storage body is made thinner than the thickness in other regions in the portions that are cut and removed to obtain individual piezoelectric vibrating components.

Therefore, since the amount of the protective substrate or the mother storage body to be cut and removed is reduced, the cutting and removal can be performed efficiently.

Furthermore, since the thickness of at least a portion of the portion to be cut and removed is made thin as described above, positioning when cutting with a cutting blade or the like becomes easy.

[Explanation of Examples]

Hereinafter, an embodiment applied to a method of manufacturing a piezoelectric resonator device as an example of a piezoelectric vibrating component will be described.

FIG. 5 shows the process of laminating the prepared mother members. That is, on the upper and lower surfaces of the mother piezoelectric resonant element 2I,
Mother protecting group 41i22.2 via adhesive (not shown)
3 are pasted together.

The base piezoelectric resonant element 21 is constructed using a rectangular base piezoelectric substrate 24 made of piezoelectric ceramics such as lead zirconate titanate and polarized in the thickness direction.

On the upper surface of the mother piezoelectric substrate 24, resonance electrodes 25 having a circular planar shape are formed as vibration electrodes at appropriate intervals. Furthermore, connection conductive portions 27 are formed in series on the resonance electrode 25 . The resonant electrode 25 and the connecting conductive portion 27 are formed by depositing a conductive material on the upper surface of the mother piezoelectric substrate 24 and then etching it. However, the resonance type 8i25 and the connecting conductive portion 27 may be formed using other electrode forming methods.

Although it is not clear in FIG. 5, a plurality of resonant electrodes are formed on the lower surface side of the magnetic pressure i-substrate 24 at positions facing each resonant electrode 25 and the base pressure [substrate 24]. Each of the plurality of resonant electrodes formed thereon is formed with a connecting conductive portion extending in a direction opposite to the connecting conductive portion 27 on the upper surface side. The resonant electrode and the connecting conductive portion formed on the lower surface side of the mother piezoelectric substrate 24 are indicated by reference numbers 26 and 28, respectively, in FIG. 1, which will be described later.

The edge protection substrates 22 and 23 are made of hard ceramics such as alumina, glass, heat-resistant and high-strength resin plates, or the like. A plurality of grooves 31 and 32 extending in the X and Y directions in FIG. 5 are formed in the edge protection substrates 22 and 23. Similarly, on the lower motherboard 1 substrate 23 side, a plurality of grooves 31 and a plurality of grooves extending in the Y direction (not shown in FIG. 5) are formed.

The plurality of grooves 31 and 32 are formed in a portion to be cut and removed in a cutting and removing step to be described later. That is, grooves 31 and 32 are formed with a width that can be cut and removed by a cutting blade when cutting and removing the laminate to obtain individual piezoelectric resonator devices.

On the upper surface side of the edge protection board 23, a plurality of recesses 23a are distributed and arranged. The recess 23a is formed to provide a space above the resonant electrode formed on the lower surface side of the mother piezoelectric substrate 24. Although not shown in FIG. 5, a recess 22a (see FIG. 1) is also formed on the lower surface of the upper edge protection substrate 22.

Mother piezoelectric resonant element 21 and edge protection substrate 22 shown in FIG.
．． A laminate is obtained by bonding 23 together in the state shown in the figure.

A cross section of the obtained laminate is shown in FIG. 1. As is clear from FIG. It is provided on the protective substrates 22 and 23. Therefore, by cutting in the direction of the arrow shown in the figure using cutting blades 29, 29 having a width that matches the width of the groove 31, a laminate for each piezoelectric resonator can be obtained.

In this case, cutting and removal will remove the laminate by a width of 31, but the upper and lower mother protecting groups Fi22.2
3 is thinner in the region where the grooves 31 and 31 are formed than in other parts. Therefore, cutting and removal by the cutting blade 29 is much easier than in the case of the conventional method shown in FIG. I can see what can be done.

In FIG. 1, only the step of cutting and removing along the groove 31 is shown, but cutting and removing in the direction along the groove 32 can be similarly performed efficiently.

FIG. 6 shows a perspective view of the individual piezoelectric resonator device laminate obtained by cutting and removing. As is clear from FIG.
A connecting conductive portion 27 is exposed at 3a. in this way,
so that the end of the connection conductive part 27 is exposed to the end surface 33a.
The cutting/removal position and width described above are selected. That is, it is necessary to select the width of the groove 31, which is the width of the cutting/removal, so that when the cutting blade 29 cuts/removes the connecting conductive portions 27, 28 are exposed on the cut surface.

Although not particularly illustrated, individual piezoelectric resonator devices can be obtained by providing external electrodes to the opposing end surfaces 33a and 33b of the laminate 33 shown in FIG. 6 by a known external electrode forming method.

Note that the external electrodes are usually formed so as to extend not only to the end surfaces 33a and 33b but also to the upper and lower surfaces of the laminate 33 to enable surface mounting. On the other hand, the third
In the laminate 32 shown in FIG. 6, which is more prone to cracking and chipping of the electrodes at the edges than the laminate shown in the figure, the end surfaces 33a', 33
The boundary portions between b and the upper and lower surfaces are rounded. Therefore, when applying the external electrodes as described above, the external electrodes are likely to be formed with a different thickness even at the boundary portions, and the end surface 33
Breakage of the external electrode at the boundary between a and 33b and the upper and lower surfaces can be effectively prevented.

As is clear from FIG. 1, when cutting, the cutting blade 29
The cutting/removal is completed after passing through the bottom 31c of the groove 31 of the lower mother protection substrate 23. That is, the mother protection board 2
There is no need to lower the cutting blade 29 to the lowest surface of the cutter 3. Therefore, compared to the conventional example shown in FIG. .

In addition, in the conventional example shown in FIG.
It was necessary to place a soft base member on the support stand to avoid damage to the base.

On the other hand, in the embodiment shown in FIG.
The lowering of the cutting blade 29 can be stopped at the stage when it enters the groove 31 of No. 3. Therefore, unlike the conventional method, there is no need to place a member underneath to prevent damage to the cutting blade.

In addition to the piezoelectric resonator described above, the present invention can also be applied to methods of manufacturing other piezoelectric vibrating components such as filters and discriminators, and other laminated electronic components.

In the above-mentioned embodiment, 31.32 mm are formed on one side of the mother protection substrate 22.23. However, as shown in FIG. 7, the grooves 31a,
31b may be formed in advance.

Furthermore, as shown in FIG. 8, a groove 31 with a cross-sectional shape that opens outward may be formed. In other words, the cross-sectional shape of the groove that is temporarily formed for the mother protecting group may be changed as appropriate. can. In addition, in the structure of FIG. 8, the bottom part 3 of the groove 31
Cutting and removal will be performed along a region with a width of 1c.

Furthermore, in the mother protection board 22, 23 shown in FIG.
It formed a full 31°32 that extends continuously in the X and Y directions in the figure, but as shown in FIG.

Grooves 41, 42 that are interrupted in the Y direction may be formed, ie, in the present invention, the thickness of at least a portion of the region cut to obtain the individual piezoelectric resonators is relatively smaller than the thickness of the remaining region. In addition, only one of the protective substrates attached to both sides of the piezoelectric vibrating element may be thinned as described above.
Furthermore, even when the protective substrate is multi-layered, the same effect can be obtained by providing a thinner portion in at least 1 layers as described above.
Another embodiment of the present invention will be described with reference to FIG.

First, individual piezoelectric vibrating elements 51 are prepared by cutting a base piezoelectric element in which a plurality of pairs of vibrating electrodes are formed on both main surfaces of a base piezoelectric substrate.

On the other hand, a first mother housing substrate 52 shown in FIG. 1O is prepared. The first mother storage substrate 52 has a plurality of storage recesses 52.
a, and has a shape that is planned to be divided into a plurality of pieces. Storage recess 5 of this first mother storage body substrate 52
A piezoelectric vibrating element 51 is housed within 2a.

Next, the second mother storage substrate 53 having a flat bottom surface is attached onto the first mother storage substrate 52, and the storage recess 52a is hermetically sealed. That is, in this embodiment, the first. A mother storage body is constituted by the second mother storage body substrates 52 and 53,
After the 0th order in which the individual piezoelectric vibrating elements 51 are housed, the mother housing is cut and removed to obtain individual piezoelectric vibrating parts.

In this embodiment, the first. Grooves 54 and 55 are formed in the second mother housing substrate 52 and 53, thereby making it easy to cut and remove each piezoelectric vibrating component of the mother housing body.

That is, by providing the grooves 54, 55 in the regions where the mother storage body substrates 52, 53 are scheduled to be divided, the thickness of the portions to be cut and removed upon division is made thinner than other regions.

〔Effect of the invention〕

According to the present invention, since the mother protection substrate or the mother storage body is used in which the thickness of at least a part of the area to be cut and removed between the individual piezoelectric vibrating components is thinner than the thickness of the remaining area, the mother protection substrate or the mother storage body is used. The amount of the mother storage body to be cut and removed can be reduced. Therefore, it is possible to easily cut the mother protection substrate or mother storage body, which is usually made of a harder material than the piezoelectric substrate. Furthermore, positioning of the cutting blade and the like during cutting becomes easy. Therefore, it becomes possible to efficiently obtain individual piezoelectric vibrating components from the state of the mother laminate.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view for explaining the step of cutting a laminate with a cutting blade in a manufacturing method according to an embodiment of the present invention, FIG. 2 is an exploded perspective view of a piezoelectric resonator, and FIG. 3 is an exploded perspective view of a piezoelectric resonator. FIG. 4 is a cross-sectional view for explaining a conventional method of manufacturing a piezoelectric resonator, and FIG. 5 is for explaining a mother piezoelectric resonator element and a mother protection substrate prepared in an embodiment of the present invention. , FIG. 6 is a perspective view showing the individual piezoelectric resonator device laminates obtained by cutting and removal, and FIGS. 7 and 8 show the shape of the mother protective substrate used in the present invention, respectively. 9 is a perspective view illustrating still another example of the shape of the mother protective substrate, and FIG. 10 is a manufacturing method of another embodiment of the present invention. It is a sectional view for explanation. In the figure, 21 is a mother piezoelectric resonant element, 22.23 is a mother protection substrate, 24 is a mother piezoelectric substrate, 25.26 is a resonance electrode, 2
9 is a cutting blade, 31, 32.3341, /12 is a groove. Figure 1 Figure 2 Figure 5 z3α Figure 6

Claims (2)

[Claims] (1) A step of preparing a mother piezoelectric vibrating element in which a plurality of vibrating electrodes are formed on both principal surfaces of a mother piezoelectric substrate so as to face each other with the mother piezoelectric substrate interposed therebetween; Manufacturing of a piezoelectric vibrating component, comprising: obtaining a laminate by bonding a mother protection substrate; and obtaining individual piezoelectric vibrating components by cutting and removing portions of the laminate between individual piezoelectric vibrating components. In the method, as the mother protection substrate, cutting and
A method of manufacturing a piezoelectric vibrating component, characterized in that the thickness of at least a portion of the region to be removed is relatively thinner than the thickness of the remaining region. (2) preparing a mother piezoelectric vibrating element in which a plurality of vibrating electrodes are formed on both main surfaces of a mother piezoelectric substrate so as to face each other with the mother piezoelectric substrate interposed therebetween; and cutting the mother piezoelectric substrate element; a step of obtaining individual piezoelectric vibrating elements; a step of preparing a mother housing which is planned to be divided into at least two parts and for hermetically sealing said piezoelectric vibrating elements; and a step of preparing said piezoelectric vibration element in said mother housing. Manufacturing a piezoelectric vibrating component, comprising the steps of accommodating a vibrating element and hermetically sealing it; and obtaining individual piezoelectric vibrating components by cutting and removing portions between the individual piezoelectric vibrating components of the mother storage body. In the method, the mother storage body is characterized in that the thickness of at least a part of the area to be cut and removed between the individual piezoelectric vibrating parts is relatively thinner than the remaining area. Method of manufacturing piezoelectric vibrating parts.