JP2517984B2 - Manufacturing method of ceramic package - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention will be described in the following order.

A. Industrial field B. Outline of invention C. Prior art [Fig. 4] D. Problems to be solved by the invention E. Means for solving the problems F. Action G. 1 to 3] H. Effects of the Invention (A. Field of Industrial Application) The present invention relates to a method for manufacturing a ceramic package, and more particularly to a method for manufacturing a laminated ceramic package that houses a solid-state image sensor.

(B. Outline of the Invention) The present invention can easily form a reference plane for alignment in which a green sheet is effectively used and accurate alignment can be performed in a method of manufacturing a laminated ceramic package that houses a solid-state image sensor. In order to do so, the chocolate break after firing divides into individual ceramic packages for solid-state imaging devices, and the reference planes for alignment are formed at the corners of the ceramic packages.

(C. Prior Art) [FIG. 4] A solid-state image pickup device using a CCD or MOS type solid-state image pickup device is disclosed in, for example, Japanese Patent Laid-Open No. 58-115838 or Japanese Patent Laid-Open No. 60-58838.
As is apparent from Japanese Patent Publication No. 74565, a laminated ceramic package is generally used as a device for housing a solid-state image sensor.

Then, conventionally, the stack for accommodating the solid-state image sensor is manufactured by the method shown in FIGS. 4 (A) to 4 (D).
That is, first, as shown in FIG. 1A, a plurality of (for example, three) green sheets a, b, c, which have been subjected to predetermined conductive film formation (printing) and punching processing, are prepared. , b, c in the figure (B)
As shown in FIG. 6C, the individual solid-state imaging device packages d ', d', are stacked by stacking as shown in FIG.
The ceramic package d as shown in FIG. 6D is obtained by separating the ceramic package into ... And firing it.

(D. Problems to be Solved by the Invention) By the way, according to the method for manufacturing a ceramic package as shown in FIG. 4, a green sheet laminated body in which packages for a plurality of solid-state imaging devices are integrated is pressed or the like. Since it was divided into individual solid-state imaging device packages by performing the cutting process according to (4), a cutting margin is required, and the ceramic material is wasted accordingly. Further, since the ceramic material is very expensive, the method of manufacturing the ceramic package which involves a large waste of the ceramic material is not preferable.

Therefore, we examined the adoption of the method of dividing into individual ceramic packages for solid-state imaging devices by chocolate break after firing. However, in such a case, the outer surface of the ceramic package becomes rattling, and a problem that it cannot be used as a reference surface for alignment is faced. This point will be described in more detail as follows.

That is, the solid-state image pickup device has a built-in solid-state image pickup element, and when the solid-state image pickup device is attached to, for example, a lens, the solid-state image pickup device is aligned and attached so that the positional relationship between the lens and the solid-state image pickup element has a predetermined positional relation. There must be. Therefore, it is necessary to form an alignment reference surface on the outer surface of the ceramic package so that the lens and the like can be aligned and attached to the internal solid-state image sensor even if the solid-state image sensor is built in and sealed. is there. According to the conventional ceramic package manufacturing method shown in FIG. 4, the two outer surfaces e and f adjacent to each other and forming a right angle can be used as the alignment reference surfaces. However, according to the method of dividing the fired ceramic into individual ceramic packages for solid-state imaging devices by chocolate break, the outer surface of the ceramic package becomes rattling and cannot be used as a reference plane for alignment.

Although it is possible to form the alignment reference plane by polishing the two outer surfaces entirely, since the ceramic is originally very hard, it is necessary to polish the outer surface of the ceramic package. Is very unfavorable because it takes a very long time and causes the abrasive to be consumed drastically.

The present invention has been made to solve such a problem, and an object of the present invention is to effectively form a green sheet and to easily form an alignment reference surface that enables accurate alignment. To do.

(E. Means for Solving Problems) In order to solve the above-mentioned problems, the method for manufacturing a ceramic package of the present invention is to divide into individual ceramic packages for solid-state imaging devices by chocolate break after firing, and It is characterized in that the alignment reference surface is formed at the corner of the package.

(F. Action) According to the method for manufacturing the ceramic package of the present invention, the chocolate break after firing divides the ceramic package for individual solid-state image pickup device into individual ceramic packages, so that it is not necessary to take a cutting allowance for the division. Therefore, the waste of the ceramic material can be eliminated.

Since the reference plane for alignment is provided at the corner of the ceramic package, the reference plane for alignment can be formed without the need to polish over a large area.

(G. Embodiment) [FIGS. 1 to 3] Hereinafter, a method for producing the ceramic package of the present invention will be described in detail with reference to illustrated embodiments.

FIGS. 1A to 1E show one embodiment of a method for manufacturing the ceramic package of the present invention in the order of steps.

First, as shown in FIG. 3A, a plurality of green sheets 1a, 1b, 1c are prepared. 1c is a green sheet forming the bottom layer, which is a wiring film 2 to which a solid-state image sensor is bonded,
2, 2, ... Are formed. Reference numeral 1b is a green sheet which is the second layer from the bottom and has holes 3, 3, ... for escaping the solid-state image sensor in the central portion thereof, and the holes 3, 3 ,. The wiring films 4, 4, ... Connected to the electrodes via the connector wires are formed. Reference numeral 1c is a green sheet forming the uppermost layer, and has fenestrations 5, 5 ,.

The green sheets 1a, 1b, 1c are formed by integrally forming a plurality of solid-state image pickup devices, and a cutting margin is not provided between one package region and a package region adjacent thereto. Further, through holes 6, 6 having a square cross-section are formed at a corner of each package region at an angle of 45 ° with respect to each side of the package when viewed from above.

Next, as shown in FIG. 3B, 1c is positioned and laminated so that the package regions overlap each other. In this case, the through holes 6, 6 of the green sheets 1a, 1b, 1c,
By aligning…, you can automatically perform proper alignment.

Next, as shown in FIG. 6C, V-shaped groove-shaped cuts 7, 7, ... Are formed at the boundaries between the package regions on the surface of the uppermost green sheet 1c.

Next, sintering is performed to form a ceramic fired body 8 in which a plurality of packages are integrally formed as shown in FIG.

Next, the ceramic fired body 8 is broken into chocolate along the respective cuts 7, 7, ... As shown in FIG. 7E, the ceramic packages for solid-state image pickup devices 9, 9 ,. The outer surface of each of the ceramic packages 9, 9, ... Is a rough rough surface. However, since the corner portion forms one surface of the through hole 6 having a square cross section at the stage of the green sheet, it becomes a flat surface. Two of the four corners serve as the alignment reference planes A and B. Incidentally, FIG. 2 is a plan view of the ceramic package.

In the bonding of the solid-state image pickup element and in various assembling after the completion of the solid-state image pickup device, the alignment is performed with reference to the alignment reference planes A and B.

That is, after the completion of the ceramic package, the solid-state imaging device is aligned and bonded on the wiring film 2 so as to have a predetermined positional relationship with the reference planes A and B for alignment, and the reference planes A and B for alignment are solid. Since it has a predetermined positional relationship with the image pickup device, the position of the solid-state image pickup device can be indirectly confirmed from the reference planes A and B for alignment. Therefore, even if the solid-state image pickup device is hidden inside the solid-state image pickup device, the solid-state image pickup device is aligned with another member such as a lens so that the solid-state image pickup device has a predetermined positional relationship, and the solid-state image pickup device is attached to a member such as a lens. Is made possible by the reference planes A and B for alignment.

As shown in FIG. 3, after the solid-state image sensor 10 is bonded, the corners are ground so as to have a predetermined positional relationship with the solid-state image sensor 10 to form the alignment reference planes A and B. It is also possible to guarantee the position with high accuracy. The alignment reference planes may be formed at four corners A, B, C, D instead of at the two corners.

(H. Effect of the Invention) As described above, in the method for manufacturing the ceramic package of the present invention, the ceramic packages for a plurality of solid-state imaging devices are integrally formed by stacking and firing a plurality of green sheets, The ceramic packages for the plurality of solid-state image pickup devices are divided into individual ceramic packages by a chocolate break, and at least two corners of each ceramic package indicate a reference plane for alignment that indicates a predetermined positional relationship with the solid-state image pickup device. Is formed.

Therefore, according to the manufacturing method of the ceramic package of the present invention, since it is divided into individual ceramic packages for solid-state imaging devices by a chocolate break after firing,
There is no need to take a cutting allowance for division. Therefore, the waste of the ceramic material can be eliminated.

Since the reference plane for alignment is provided at the corner of the ceramic package, the reference plane required for alignment can be formed without polishing over a wide area.

In particular, as shown in the above example, if a rectangular through hole is provided at the corner of each package area of the green sheet before firing, after the chocolate break, the ceramic package forming one surface of the through hole is formed. The corners of can be used as the alignment reference plane as they are, and it is possible to eliminate polishing at all.

[Brief description of drawings]

1 (A) to 1 (E) are perspective views showing one embodiment of a method for manufacturing a ceramic package of the present invention in the order of steps, FIG. 2 is a plan view of a ceramic package, and FIG. 3 is another reference plane for alignment. 4A to 4D are perspective views showing a conventional example in the order of steps, for explaining the forming method. Explanation of symbols 1a, 1b, 1c …… Green sheet, 9 …… Ceramic package, A, B, C, D …… Reference plane for alignment.

Claims (1)

(57) [Claims] 1. A ceramic package for a plurality of solid-state imaging devices is integrally formed by laminating and firing a plurality of green sheets, and the ceramic packages for the plurality of solid-state imaging devices are individually broken by chocolate break. A method for manufacturing a ceramic package, characterized in that the ceramic substrate is divided into packages, and at least two corners of each ceramic package are formed with alignment reference planes that indicate a predetermined positional relationship with the solid-state image sensor.