JPS5857808A - Manufacture for spread mode oscillator - Google Patents
Manufacture for spread mode oscillatorInfo
- Publication number
- JPS5857808A JPS5857808A JP15701481A JP15701481A JPS5857808A JP S5857808 A JPS5857808 A JP S5857808A JP 15701481 A JP15701481 A JP 15701481A JP 15701481 A JP15701481 A JP 15701481A JP S5857808 A JPS5857808 A JP S5857808A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- strip
- contact
- hole
- oscillation element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 230000010355 oscillation Effects 0.000 claims abstract description 12
- 238000005520 cutting process Methods 0.000 claims abstract description 7
- 229920003002 synthetic resin Polymers 0.000 claims abstract description 6
- 239000000057 synthetic resin Substances 0.000 claims abstract description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 2
- 235000010724 Wisteria floribunda Nutrition 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/02—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of piezoelectric or electrostrictive resonators or networks
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
本発明は、圧電振動子の一種である拡がりモード発振子
を大量に、かつ極めて容易に組立てることができる方法
に関するものである。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method that can extremely easily assemble a large amount of spread mode oscillators, which are a type of piezoelectric oscillators.
圧電振動子の一種に拡がりモード振動子がある。この拡
がりモード振動子は、圧電板の面内放射方向の振動を利
用したものであるから、その振動を阻害することなく保
持し、かつ表面電極パターンとの電気的導通を計ること
が非常に難かしく、製造も面倒である。A spread mode vibrator is one type of piezoelectric vibrator. Since this spread mode vibrator utilizes the in-plane radial vibration of a piezoelectric plate, it is extremely difficult to hold the vibration without inhibiting it and to measure electrical continuity with the surface electrode pattern. It is difficult to manufacture.
従来の組立方法としては、第１図に示すように、大きな
貫通孔１と表裏両面に各２個の位置決め固定用の突起２
を有する合成樹脂製のベース３を用意し、該ペース３の
貫通孔１内に径方向波がりモード発振素子４を位置させ
、両面にリード部材６をキの透孔６が前記突起２に嵌合
するように配置し、その状態で前記突起２を加熱圧潰す
ることにより固着する。リード部材５の中央片７は予め
やや内方に曲げられていて、それによって発振素子４を
挾持すると共に、電気的導通をはかる。その後、゛ケー
ス８内に挿入し、開口部を封止するのである。As shown in Figure 1, the conventional assembly method involves a large through hole 1 and two positioning and fixing protrusions 2 on each of the front and back surfaces.
A base 3 made of synthetic resin with The protrusions 2 are arranged so as to fit together, and in this state, the protrusions 2 are heated and crushed to be fixed. The central piece 7 of the lead member 5 is bent slightly inward in advance, thereby holding the oscillation element 4 therebetween and providing electrical continuity. Thereafter, it is inserted into the case 8 and the opening is sealed.
しかし、このような方法は、とか〈手作業に頼りがちで
あり、小量の生産には適するかもしれないが、極めて煩
瑣な作業の連続であり、量産化に適した方法とは言い難
い。However, such methods tend to rely on manual labor, and while they may be suitable for small-scale production, they require a series of extremely complicated operations, and are not suitable for mass production.
本発明の目的は、このような従来技術の欠点を解消し、
製作容易で、大量生産に適した組立方法を提供すること
にある。The purpose of the present invention is to eliminate such drawbacks of the prior art,
The purpose is to provide an assembly method that is easy to manufacture and suitable for mass production.
以下、図面に基づき本発明について説明する。Hereinafter, the present invention will be explained based on the drawings.
第２図、第３図は本発明の一実施例の説明図である。！
、ず、第２図に示されているように、大きな貫通孔１０
と割溝１１とを交互に並設した合成樹脂製の帯状ベース
１２を用意する。そして、この貫通孔１０内にそれぞれ
圧電磁器板表裏向に所定の導電パターンを形成した径方
向拡がりモード発振素子１３を位置させる。それ故、前
記貫通孔１ｏは、発振素子１３を収容するに足るだけの
大きさを有する必要がある。また、連結片１４から多数
のリードピン１５を前記割溝１１と同じピンチで連設し
た金属片１６ａ。FIGS. 2 and 3 are explanatory diagrams of an embodiment of the present invention. !
, As shown in FIG. 2, a large through hole 10
A belt-shaped base 12 made of synthetic resin is prepared in which grooves 11 and grooves 11 are arranged alternately in parallel. Then, radial expansion mode oscillation elements 13 each having a predetermined conductive pattern formed on the front and back sides of a piezoelectric ceramic plate are positioned in this through hole 10 . Therefore, the through hole 1o needs to have a size sufficient to accommodate the oscillation element 13. Further, a metal piece 16a is formed by connecting a large number of lead pins 15 from the connecting piece 14 with the same pinch as the groove 11.
１６ｂを用意し、該金属片１６ａ 、＋ ６ｂを前記帯
状ベース１２の両面に当てて該リードピン１６の先端が
発振素子１３の導電パターンに接触するようにし、更に
その両面に前記と同様の割溝１７を有する合成樹脂製の
帯状カバー１８ａ、１８ｂを当接し、接着もしくは熱溶
着により固着一体化してリードピン１５を固定するとと
もに、該リードピン１６の先端のバネ弾性で前記発振素
子１３を挾持させるのである。従って、各リードピン１
６は、予めその先端部が内方（発振素子１３の中心方向
）に折９曲げられた形状としておくのがよい。このよう
に組上げた後、各リードピン１５の基端部で連結片１４
を切断し、割溝にそって折断すれば、個体分離された拡
がり゛モード発振子２０を得ることができる。なお、連
結片１４に設けられている穴１９は、治具（図示せず）
の所定位置に載置するだめの位置決め用のものである。16b is prepared, and the metal pieces 16a and +6b are applied to both sides of the band-shaped base 12 so that the tip of the lead pin 16 comes into contact with the conductive pattern of the oscillation element 13, and the same grooves as described above are formed on both sides. The lead pin 15 is fixed by abutting synthetic resin belt-shaped covers 18a and 18b having 17 and fixedly integrated by adhesion or heat welding, and the oscillation element 13 is held by the spring elasticity of the tip of the lead pin 16. . Therefore, each lead pin 1
6 is preferably shaped such that its tip is bent inward (toward the center of the oscillation element 13). After assembling in this way, connect the connecting piece 14 at the base end of each lead pin 15.
By cutting it and breaking it along the grooves, it is possible to obtain a spread mode oscillator 20 that is separated into individual pieces. Note that the hole 19 provided in the connecting piece 14 is formed using a jig (not shown).
This is for positioning the container to be placed in a predetermined position.
この実施例は、帯状ベース１２と２枚の帯状カバー１８
ａ 、 １８ｂの３層を同時に圧着するような構成とな
って工・程的には最も簡単である。This embodiment consists of a strip base 12 and two strip covers 18.
The structure is such that three layers a and 18b are pressed together at the same time, and is the simplest in terms of process.
しかし、一方の面を先に組立てるような構成とすること
もできる。すなわち、帯状ベース１２と一方の金属片１
６ｂ、帯状カバー１８ｂを予め積層して固着一体化して
おき、次に帯状ベース１２の貫通孔１０内に発振素子１
３を配設してから、他方の金属片１６ａ１帯状カバー１
８ａを積層して固着一体化するのである。その後は、前
記実施例の場合と同様、連結片を切断し、割溝を利用し
て分割していけばよいのである。However, it is also possible to have a configuration in which one side is assembled first. That is, the strip base 12 and one metal piece 1
6b, the strip cover 18b is laminated in advance and fixed and integrated, and then the oscillation element 1 is inserted into the through hole 10 of the strip base 12.
3, then the other metal piece 16a1 band-shaped cover 1
8a are laminated and fixed and integrated. After that, just as in the case of the previous embodiment, the connecting pieces can be cut and divided using the grooves.
接着もしくは熱溶着によって接合部分は密封されるが、
更に封止を完全にしだい場合には、樹脂液中に浸漬する
ようにしてもよい。The joints are sealed by adhesive or heat welding, but
Furthermore, if the sealing is to be completed completely, it may be immersed in a resin liquid.
このようにして組立てられた拡がりモード発振子ハ、例
えばマイクロプロセッサや各種クロンクジエネレータの
タイミング発生用として利用することができる。The spread mode oscillator thus assembled can be used, for example, for timing generation in microprocessors and various clock generators.
本発明は上記のように構成されているので、従来技術の
ように個別に微小部品をつまんで組立てるのとは異なり
、多数個を一度に組立てることができ、量産性に富み、
機械による自動化も容易に行えるなど、すぐれた効果を
有するものである。Since the present invention is configured as described above, unlike the prior art in which minute parts are individually picked up and assembled, a large number of parts can be assembled at once, making it highly suitable for mass production.
It has excellent effects, such as being easily automated by machines.
第１図は従来技術の説明図、第２図は本発明の一実施例
を示す説明図、第３図はその組立後の状態を示す説明図
である。
１０・・・貫通孔、１１・・割溝、１２・・帯状ベース
、１３・・発振素子、１４・・連結片、１５・・リード
ピン、１６ａ、１６ｂ＝金属片、１７・・割溝、＋８ａ
、１８ｂ＝帯状カバー。
特許出願人 富士電気化学株式会社FIG. 1 is an explanatory diagram of the prior art, FIG. 2 is an explanatory diagram showing an embodiment of the present invention, and FIG. 3 is an explanatory diagram showing the state after assembly. 10...Through hole, 11...Divided groove, 12...Band-shaped base, 13...Oscillating element, 14...Connection piece, 15...Lead pin, 16a, 16b=metal piece, 17...Divided groove, +8a
, 18b = strip cover. Patent applicant Fuji Electrochemical Co., Ltd.
Claims (1)
製の帯状ベー スの該貫通孔内に、拡がりモード発振素
子を位置せしめ、連結片から多数のリードビンを前記割
溝と同じピッチで連設した金属片を前記帯状ベースの表
面・に当てて該リードビンの先端が発振素子の導電、＜
ターンに接触するようにし、その上に前記と同様の割溝
を形成した帯状カバーを当接し、固着一体化させてリー
ドビンを固定すると共に、ｄリードピン先端のバネ弾性
で前記発振素子を挾持させた後、リードビンの基部を切
断し、割溝しそって分割して個体分離させることを特徴
とする拡がりモード発振子の製造方法。1. A spread mode oscillation element is positioned in the through hole of a synthetic resin band-shaped base in which large through holes and grooves are arranged alternately in parallel, and a large number of lead bins are inserted from the connecting piece at the same pitch as the grooves. The metal pieces connected in series are applied to the surface of the strip-shaped base so that the tip of the lead bin conducts the oscillation element.
A belt-shaped cover having grooves similar to those described above was brought into contact with the turn, and the lead bin was fixed by being fixed and integrated, and the oscillation element was held by the spring elasticity of the tip of the d-lead pin. A method for producing a spread mode oscillator, which comprises: cutting the base of the lead bin, dividing it along the dividing groove, and separating the individual pieces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15701481A JPS5857808A (en) | 1981-10-02 | 1981-10-02 | Manufacture for spread mode oscillator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15701481A JPS5857808A (en) | 1981-10-02 | 1981-10-02 | Manufacture for spread mode oscillator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5857808A true JPS5857808A (en) | 1983-04-06 |
Family
ID=15640289
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15701481A Pending JPS5857808A (en) | 1981-10-02 | 1981-10-02 | Manufacture for spread mode oscillator |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5857808A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160631U (en) * | 1984-03-30 | 1985-10-25 | 株式会社村田製作所 | Piezoelectric resonant components |
| JPH0370306A (en) * | 1989-08-10 | 1991-03-26 | Murata Mfg Co Ltd | Manufacture of piezoelectric resonator |
| JPH03179809A (en) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | Manufacture of piezoelectric vibration component |
| JPH0469254U (en) * | 1990-10-24 | 1992-06-18 | ||
| JPH04326612A (en) * | 1991-04-26 | 1992-11-16 | Murata Mfg Co Ltd | Piezoelectric component |
-
1981
- 1981-10-02 JP JP15701481A patent/JPS5857808A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60160631U (en) * | 1984-03-30 | 1985-10-25 | 株式会社村田製作所 | Piezoelectric resonant components |
| JPH0370306A (en) * | 1989-08-10 | 1991-03-26 | Murata Mfg Co Ltd | Manufacture of piezoelectric resonator |
| JPH03179809A (en) * | 1989-12-07 | 1991-08-05 | Murata Mfg Co Ltd | Manufacture of piezoelectric vibration component |
| JPH0469254U (en) * | 1990-10-24 | 1992-06-18 | ||
| JPH04326612A (en) * | 1991-04-26 | 1992-11-16 | Murata Mfg Co Ltd | Piezoelectric component |
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