JPH03178112A - Compound chip part - Google Patents

Abstract

PURPOSE:To facilitate the formation of compound capacitors having different temperature characteristics while reducing the stray capacitance in the substrate mounting process by a method wherein multiple capacitors to be alternately laminated with dielectrics and inner electrodes in vertical state to substrate mounting surfaces are formed. CONSTITUTION:Dielectrics 1 having CK characteristics and dielectrics 2 having UJ characteristics different from that of the dielectric 1 and the inner electrodes 3 are alternately laminated and then after performing the cutting off and baking processes in the thickness direction (a), outer electrodes 4 are provided. Next, capacitor elements using the dielectrics 1 as bases and the other capacitor elements using the dielectrics 2 as bases are laminated to bring about a state wherein the inner electrodes 3 are perpendicular to substrate mounting surfaces so that the opposite space of the inner electrodes 3 to the substrate mounting surfaces may be narrowed. Through these procedures, the multiple capacitors having the different temperature characteristics can be easily formed in only one body while reducing the stray capacitance in the substrate mounting process.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a composite chip component using a multilayer ceramic capacitor used in electronic equipment.

Conventional technology Conventionally, this type of composite chip component has a structure as shown in FIG. 2, in which dielectrics 5 and internal electrodes 6 are alternately stacked to a predetermined thickness, and then cut from the thickness direction. The structure was such that external electrodes 7 electrically connected to internal electrodes 6 were provided at both ends of the fired product. Therefore, the internal electrode 6 has a structure parallel to the width direction.

Problems to be Solved by the Invention In such a conventional configuration, dielectrics and internal electrodes are alternately laminated in the thickness direction and then cut in the thickness direction to form a plurality of capacitors in one shape. Even if capacitors with different temperature characteristics can be formed in one shape, there is a problem in that stray capacitance occurs between the internal electrodes of the capacitor and the land of the board when mounted on the board.

The present invention solves these problems, and makes it possible to easily form a plurality of capacitors with different temperature characteristics in an L shape, and to reduce the occurrence of stray capacitance when mounted on a board. The purpose is to provide a composite chip component that can be used.

Means for Solving the Problems In order to solve this problem, the present invention provides a first capacitor element portion in which dielectrics and internal electrodes are alternately laminated in a state perpendicular to the board mounting surface, and a first capacitor element portion of the first capacitor element portion. The second capacitor element part is stacked in the stacking direction and has dielectrics and internal electrodes alternately stacked perpendicularly to the board mounting surface similarly to the first capacitor element part. The second capacitor element portion is formed as a capacitor having different temperature characteristics.

Effect This configuration makes it possible to easily form multiple capacitors with different temperature characteristics in one shape. Especially for capacitors with specifications of 5 pF or less, where stray capacitance when mounted on a board is a problem, it is possible to easily form multiple capacitors with different temperature characteristics. Greater freedom.

Embodiment FIG. 1 is a perspective view and a cross-sectional view of a composite chip component according to an embodiment of the present invention, and is an example in which two capacitors having different temperature characteristics are combined in one shape. In Fig. 1, dielectric 1 has CK characteristics, and dielectric 2 has UJ characteristics, which is a temperature characteristic different from that of dielectric 1. After being laminated alternately with internal electrodes 3, they are cut from the thickness direction. After firing, the structure is such that an external electrode 4 is provided. Here, the dielectric l
A capacitor element based on a dielectric material 2 and a capacitor element based on a dielectric material 2 are stacked so that their internal electrodes 3 are perpendicular to the board mounting surface. The facing area is extremely small.

In addition, in consideration of shrinkage during firing, we used two types of dielectrics 1゜2 with approximately the same shrinkage rate during firing to minimize delamination at the joint between the two types of dielectrics and deformation of the element. It is desirable that consideration be given to suppressing this.

Effects of the Invention As described above, according to the present invention, since a plurality of capacitors are formed in which dielectrics and internal electrodes are alternately laminated perpendicular to the board mounting surface, it is possible to combine capacitors with different temperature characteristics. It is easy to perform and enables higher circuit density.
Furthermore, since the opposing area of the internal electrodes of each capacitor with respect to the substrate is small, it is possible to suppress the generation of stray capacitance when mounted on the substrate.

[Brief explanation of drawings]

FIG. 1 shows an embodiment of the composite chip component of the present invention, (
a) is a perspective view, (b) is an An, cross-sectional view, <c) is a cross-sectional view taken along line B, Id) is a cross-sectional view taken along line C, Figure 2 shows a conventional composite chip component, and (a) is a perspective view. , k (b)
is a cross-sectional view taken along line A, (C) is a cross-sectional view taken along line B, and (d) is a cross-sectional view taken along line C. 1.2... Dielectric, 3... Internal electrode,
4...External electrode.

Claims (1)

[Claims] a first capacitor element section in which dielectrics and internal electrodes are alternately stacked so as to be perpendicular to the board mounting surface; and a first capacitor element section overlapping in the stacking direction of the first capacitor element sections, and and a second capacitor element part in which dielectrics and internal electrodes are alternately stacked so as to be perpendicular to the board mounting surface, and the first and second capacitor element parts have different temperature characteristics. Composite chip parts configured in a similar manner.