JPH0317534A - Preparing method of check crosses for evaluating adhesion - Google Patents
Preparing method of check crosses for evaluating adhesionInfo
- Publication number
- JPH0317534A JPH0317534A JP15311789A JP15311789A JPH0317534A JP H0317534 A JPH0317534 A JP H0317534A JP 15311789 A JP15311789 A JP 15311789A JP 15311789 A JP15311789 A JP 15311789A JP H0317534 A JPH0317534 A JP H0317534A
- Authority
- JP
- Japan
- Prior art keywords
- adhesion
- polyimide resin
- film
- resin film
- technique
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 17
- 229920001721 polyimide Polymers 0.000 claims abstract description 24
- 239000009719 polyimide resin Substances 0.000 claims abstract description 24
- 239000004065 semiconductor Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims abstract description 9
- 238000005530 etching Methods 0.000 claims abstract description 6
- 238000011156 evaluation Methods 0.000 claims description 4
- 238000010998 test method Methods 0.000 claims description 3
- 238000001459 lithography Methods 0.000 claims 1
- 238000011158 quantitative evaluation Methods 0.000 abstract description 5
- 238000000059 patterning Methods 0.000 abstract description 2
- 230000015572 biosynthetic process Effects 0.000 abstract 2
- 238000000206 photolithography Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- 229920000298 Cellophane Polymers 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 241001428214 Polyides Species 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 210000004709 eyebrow Anatomy 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Formation Of Insulating Films (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、ポリイミド樹脂膜の密着性を評価する試験に
用いる碁盤目作成方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for creating a grid pattern used in a test for evaluating the adhesion of a polyimide resin film.
［従来の技術１
ポリイミド樹脂は、ＩＣ．ＬＳＩの高集積化を実現する
多層配線方式の眉間絶縁膜として、あるいは半導体の表
面保護膜として用いられている．ポリイミド樹脂は耐熱
性、平坦性に優れる等の利点を有するが、耐湿性無機膜
との接着性に問題点がある。後者の接着性に関して様々
な改良が加えられているが、その評価は、半導体素子の
長期環境信頼性を確保するために重要である。[Prior art 1] Polyimide resin is manufactured by IC. It is used as an insulating film between the eyebrows in multilayer wiring systems to achieve high integration in LSIs, and as a surface protection film for semiconductors. Although polyimide resin has advantages such as excellent heat resistance and flatness, it has a problem in adhesiveness with a moisture-resistant inorganic film. Various improvements have been made regarding the latter adhesive property, and its evaluation is important to ensure the long-term environmental reliability of semiconductor devices.
従来、ポリイミド樹脂膜の密着性評価方法として、日本
工業規格（ＪＩＳ Ｄ ０２０２）ｒ自動車部品の
塗膜通則」に規定されている「碁盤目付着性試験方法」
に則り、密着性が評価されている．すなわち、ポリイミ
ド樹脂膜が塗布された半導体基板表面上に、片刃かみそ
りで、１閤又は２閣角の碁盤目１００個（ＩＯＸＩＯ）
を作り、碁盤目上にセロハン粘着テープ（ＪＩＳ Ｚ
１５２２による幅１２ｍｍのもの）を完全に付着さ
せ、直ちにテープの一端を塗膜面に直角に保ち、瞬間的
に引き離し、完全にはがれないで残った碁盤目の数を調
べ評価するものである。Conventionally, as a method for evaluating the adhesion of polyimide resin films, the "checkerboard adhesion test method" specified in the Japanese Industrial Standard (JIS D 0202) r General Rules for Automotive Parts Paint Films has been used.
Adhesion was evaluated according to the following. That is, on the surface of the semiconductor substrate coated with the polyimide resin film, 100 grids of 1 square or 2 squares (IOXIO) are cut using a single-edged razor.
, and put cellophane adhesive tape (JIS Z) on the grid.
1522 (width 12 mm) is completely adhered, one end of the tape is immediately held perpendicular to the coating surface, and the tape is pulled off momentarily, and the number of grids that remain without being completely peeled off is examined and evaluated.
本発明は上記課題を解決するため、碁盤目付着性試験方
法によりポリイミド樹脂膜の密着性を評価する試験に用
いる碁盤目作成方法において、主表面上にシリコン酸化
膜、アルミニウム等の無機膜が形成された半導体基板に
ボリイξド樹脂を塗布し、フォトリソグラフ技術及び選
択エッチング技術により、前記ポリイミド樹脂膜に所定
形状の碁盤目を形成したことを特徴とする．
〔実施例〕
以下、本発明の実施例を説明する．まず、半導体基板１
上にポリイミド樹脂膜との密着性を評価する膜を形成す
る（シリコン酸化膜、アルミニウム等、基板との密着性
を評価する場合はこの工程は省略する）．次に、前記膜
上にポリイミド樹脂を塗布する．しかる後、通常の半導
体製造工程で用いられているフォトリソグラフ技術及び
選択エッチング技術により、前記ポリイミド樹脂膜に所
定形状の碁盤目２を形戒する（第ｌ図参照）。In order to solve the above-mentioned problems, the present invention uses a cross-cut adhesion test method to form an inorganic film such as silicon oxide film or aluminum on the main surface of a polyimide resin film. The polyimide resin film is characterized in that a polyimide resin is applied to the polyimide resin film, and a grid pattern of a predetermined shape is formed on the polyimide resin film by photolithography and selective etching. [Examples] Examples of the present invention will be described below. First, semiconductor substrate 1
A film is formed on top to evaluate the adhesion with the polyimide resin film (this step is omitted when evaluating the adhesion with a substrate such as a silicon oxide film or aluminum). Next, polyimide resin is applied onto the film. Thereafter, a predetermined grid pattern 2 is formed on the polyimide resin film by photolithography and selective etching techniques used in normal semiconductor manufacturing processes (see FIG. 1).
このようにして形威された碁盤目２を用いて密着性を評
価する．その方法は、前述の如きＪＩＳに規定されたセ
ロハン粘着テープを用いる方法でもよいし、他の方法を
用いてもよい．
このように、フォトリソグラフ技術を用いることで、碁
盤目の大きさ、数、基板上の形戒箇所は、フォトマスク
を変えるだけで任意に自由に設定できる．また、下地の
膜をポリイミド樹脂膜形成以前にパターン加工しておく
ことで、多種の膜との密着性を同時に評価できる（第２
図参照）．なお、第２図において、１は半導体基板、２
は碁盤目、３はシリコン酸化膜、４はシリコン基亭反、
５はアルミニウムである．さらに、ポリイミド樹脂膜の
形状も第３図に示すように自由に設定でき、実際のデバ
イスに用いられる場合に近い形状での評価も可能である
．
〔発明の効果〕
本発明は上記のように、フォトリソグラフ技術及び選択
エッチング技術によりポリイ〔ド樹脂膜に所定形状の碁
盤目を形成したことを特徴とするので、正確で定量的な
評価が可能な密着性評価用の碁盤目を作威できる．Adhesion is evaluated using the grid 2 formed in this way. The method may be a method using cellophane adhesive tape specified by JIS as described above, or other methods may be used. In this way, by using photolithography technology, the size, number, and shape of the grid can be freely set by simply changing the photomask. In addition, by patterning the underlying film before forming the polyimide resin film, it is possible to simultaneously evaluate the adhesion with various types of films (second
(see figure). In addition, in FIG. 2, 1 is a semiconductor substrate, 2
is a grid, 3 is a silicon oxide film, 4 is a silicon substrate,
5 is aluminum. Furthermore, the shape of the polyimide resin film can be freely set as shown in Figure 3, making it possible to evaluate a shape close to that used in an actual device. [Effects of the Invention] As described above, the present invention is characterized in that a grid pattern of a predetermined shape is formed on a polyide resin film by photolithography technology and selective etching technology, and therefore accurate and quantitative evaluation is possible. It is possible to create a grid for evaluating adhesion.
第１図乃至第３図は本発明により形成された碁盤目を示
すもので、第１図及び第２図は平面図、第３図は拡大平
面図である。
１・・・半導体基板、２・・・碁盤目．第１図
ｒ
）
第２図1 to 3 show a grid pattern formed according to the present invention, FIGS. 1 and 2 are plan views, and FIG. 3 is an enlarged plan view. 1... Semiconductor substrate, 2... Grid. Figure 1r) Figure 2
Claims (1)
密着性を評価する試験に用いる碁盤目作成方法であって
、主表面上に無機膜が形成された半導体基板にポリイミ
ド樹脂を塗布し、フォトリソグラフ技術及び選択エッチ
ング技術により、前記ポリイミド樹脂膜に所定形状の碁
盤目を形成して成る密着性評価用の碁盤目作成方法。(1) A method for creating a grid pattern used in a test to evaluate the adhesion of a polyimide resin film by a grid adhesion test method, in which a polyimide resin is applied to a semiconductor substrate on which an inorganic film is formed on the main surface, and a photo A method for creating a grid for adhesion evaluation, comprising forming a grid in a predetermined shape on the polyimide resin film using lithography technology and selective etching technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15311789A JPH0317534A (en) | 1989-06-15 | 1989-06-15 | Preparing method of check crosses for evaluating adhesion |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15311789A JPH0317534A (en) | 1989-06-15 | 1989-06-15 | Preparing method of check crosses for evaluating adhesion |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0317534A true JPH0317534A (en) | 1991-01-25 |
Family
ID=15555343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15311789A Pending JPH0317534A (en) | 1989-06-15 | 1989-06-15 | Preparing method of check crosses for evaluating adhesion |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0317534A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010083843A (en) * | 2001-07-04 | 2001-09-03 | 이정석 | circle infrared rays emission vessel |
| WO2003008938A3 (en) * | 2001-07-16 | 2003-05-22 | Siemens Ag | Method for determining the adhesiveness of a coating on a component |
| JP2006176169A (en) * | 2004-12-22 | 2006-07-06 | Kentaro Sano | Functional lid and container |
| US7597006B2 (en) | 2004-06-09 | 2009-10-06 | Canon Kabushiki Kaisha | Method of evaluating adhesiveness of member |
| US9004292B2 (en) | 2010-02-12 | 2015-04-14 | Seventh Generation Ventures, Inc. | Squeezable beverage bottle and filter system |
-
1989
- 1989-06-15 JP JP15311789A patent/JPH0317534A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20010083843A (en) * | 2001-07-04 | 2001-09-03 | 이정석 | circle infrared rays emission vessel |
| WO2003008938A3 (en) * | 2001-07-16 | 2003-05-22 | Siemens Ag | Method for determining the adhesiveness of a coating on a component |
| US7597006B2 (en) | 2004-06-09 | 2009-10-06 | Canon Kabushiki Kaisha | Method of evaluating adhesiveness of member |
| JP2006176169A (en) * | 2004-12-22 | 2006-07-06 | Kentaro Sano | Functional lid and container |
| US9004292B2 (en) | 2010-02-12 | 2015-04-14 | Seventh Generation Ventures, Inc. | Squeezable beverage bottle and filter system |
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