JPH0317240B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a plug-in package (also referred to as a plug-in array) and a method for manufacturing the same, and more specifically, the present invention relates to a plug-in package (also referred to as a plug-in array) and a method for manufacturing the same. The present invention relates to a plug-in package in which an input/output pin having a portion thicker than its diameter is inserted and fixed, and a method for manufacturing the same.

Conventionally, plug-in packages have been made of ceramic substrates, so when attaching input/output pins (hereinafter simply referred to as pins) to the substrate, approximately
Silver solder, which is melted at a relatively high temperature of 800°C, was used to secure it. However, silver solder is not only expensive, but also has the drawback of high costs because it requires complicated processes such as joining the pins at a high temperature of approximately 800°C.

In addition, it is also possible to use a method of fixing pins in the through-hole portions of ceramic substrates by means of insertion such as caulking. Since the pins are forcibly press-fitted into the ceramic substrate to deform the pins, there is a drawback that cracks form in the holes in the ceramic substrate and the substrate is easily damaged.

In view of the above-mentioned drawbacks of the prior art, the present invention provides a plug-in package and a low-cost plug-in package that can firmly fit and secure input/output pins without causing damage such as cracks to the through-holes of a printed wiring board. This paper aims to provide a manufacturing method for the same.

That is, the present invention provides a printed wiring board made of an organic resin material, a through hole formed in the printed wiring board and covered with a soft metal plating film such as gold, and a head inside the through hole. The head of the input/output pin has a thick part larger than the hole diameter of the through hole, and the thick part of the head of the input/output pin is connected to the metal of the through hole wall. The plug-in package is characterized in that the plating film is firmly attached to the through hole in an enlarged and deformed state.

The method for manufacturing the above-mentioned plug-in package involves forming through holes covered with a soft metal plating film on a double-sided copper-clad printed wiring board made of an organic resin material, and input/output inside the through holes. The head of the input/output pin has a thick part larger than the hole diameter of the through hole, and when the input/output pin is inserted, the thick part of the head There is a method of manufacturing a plug-in package characterized in that the plug-in package is firmly fixed to the through hole by enlarging and deforming the metal plating film on the wall surface of the through hole.

Hereinafter, the present invention will be specifically explained in more detail.

First, the present invention is characterized in that a printed wiring base material made of an organic resin material is used in place of the conventional ceramic substrate. The reason for this is that ceramic substrates are disadvantageous in keeping up with the recent trend toward lighter, thinner, and smaller electronic components, and they also require the frit bonding work and pin bonding work mentioned above in mounting various electronic components. However, there are drawbacks such as being complicated and expensive, so a printed wiring board made of a thin and lightweight organic resin material is used, and even if the pins are fixed in the through holes of the board using a method such as caulking, the organic Since substrates made of resin-based resin materials are flexible and elastic, we focused on the fact that they do not crack or break like ceramic substrates, and we confirmed this through experiments. Because I was able to do it.

The most typical printed wiring board substrate made of organic resin material used in the present invention is a glass fiber-reinforced copper-clad epoxy resin substrate (hereinafter referred to as a glass-epoxy resin substrate), and other materials include paper and phenol resin. Examples include a substrate, a paper epoxy resin substrate, a polyimide resin substrate, and a modified triazine resin substrate. These boards have a copper conductive film such as copper foil laminated on both sides in advance, and serve as a base for forming the conductor part of the printed wiring circuit, with an overall thickness of 0.1 mm to 2.0 mm. It is the rank.

Therefore, according to the present invention, the weight and board thickness can be reduced to about 1/3 to 1/10 compared to conventional plug-in packages made of ceramic substrates, which is in line with the recent trend toward lighter, thinner, and smaller electronic components. We can provide the best plug-in package for each trend.

On the other hand, substrates made of organic resin materials are generally more flexible and flexible than ceramic substrates, so they are susceptible to mechanical shocks such as caulking and other insertion methods, and thermal shocks such as heat shocks. It also has the property of being able to withstand a lot of damage.

Therefore, according to the present invention, when fixing a pin to a through hole provided in a substrate made of an organic resin material, an insertion method that involves a mechanical impact, such as a driving rivet center that performs caulking, is adopted to fix the pin in a through hole formed in a through hole shape. Even if the pin is fixed by deforming the substrate, it will not crack or break unlike conventional ceramic substrates.

Next, the characteristics of the shape and material of the pin used in the present invention will be explained.

FIG. 1 is a longitudinal sectional view showing various shapes of pins used in the present invention, and FIG. 2 is a plan view of various shapes of pins corresponding thereto. The pin shown in A is made of iron, copper alloy, etc., and the entire head of the pin is the diameter of the through hole, that is, the part that is thicker than D (the diameter of the through hole 2) in the cross-sectional view of the through hole 2 shown in Figure 4. In the case of the pin shown in B, the head of the pin has a flat circular or elliptical shape in plan, and the lower side of the head has a part thicker than the hole diameter of the through hole 2. and has a flat portion. In the pin shown in C, the head of the pin has a circular planar shape, but the lower side of the head has a portion that is slightly thicker than the diameter of the through-hole hole in the shape of a leaf-like moon, which is a flat circular shape or a combination of arcs. The pin head shown in D has a circular planar shape, and the lower side of the head also has a part that is thicker than the diameter of the circular through hole, and the pin shown in E has a flat head. The so-called three-pronged, four-pronged,
It has small round protrusions such as five prongs. In short, it is sufficient that a part or almost the entire pin has a portion slightly larger than the hole diameter of the through hole, and the pin used in the present invention is not limited to the shapes illustrated in FIGS. 1 and 2. do not have.

Furthermore, FIG. 3 is a perspective view of a pin used in the present invention. The planar shape is square or rectangular, and the portion A is thicker than the diameter of the through hole. Furthermore, the pin shown in (H) has a flange, for example, at the part B of the pin shown in (D) or (F). When fixing the pin to the board, this flange has the advantage of making positioning and locking easier, allowing the pin to be bonded and fixed to the board in a stable state, and it also increases the contact area with the through-hole land, making it electrically stable. This has the advantage of increasing the number of connections.

According to the present invention, a double-sided printed wiring board is formed by drilling a hole in a substrate such as glass epoxy resin and forming a relatively soft and conductive plating film such as copper, nickel or gold plating in the hole to form a through hole. Drive any of the pins of the various shapes mentioned above into the through-hole portions, insert them using a rivet center or other pin driving machine, and if necessary, reinforce and fix them with solder to form the pins shown in Figures 5 or 6. As shown in the cross-sectional view of the figure, when the through-hole wall is slightly enlarged and deformed with approximately the center part of the through-hole bulging, the pin side wall is firmly attached to the wall and is securely connected to the conductive part of the board. Can be joined to. A pin joined in this way is not only difficult to come out of the through hole because the copper and relatively soft metal wall such as nickel or gold plating is deformed, but also the area where the pin side wall contacts the conductive wall surface 3 increases, so it is electrically This has the advantage that the connection becomes stronger and the pin will not fall out of the through hole or become loose due to vibration or impact caused by the pin attachment control. Further, by providing a locking portion such as a collar on a part of the pin, it is convenient to improve the positioning and stability of the pin when fixing the pin to the substrate. The flange may be located at the head of the pin as shown in FIG. 5, or at the middle of the pin as shown in FIG. This is because the locking function as a flange is fully exhibited in any position. If the thus-attached pin, the through-hole, and the land portion around it are soldered to reinforce the joint of the pin, the pin can be attached in a more preferable and strong state.

Next, the effects of the present invention will be described.

That is, in the present invention, an organic resin material is used as the printed wiring board, and a soft metal plating film such as gold is applied in the through holes. On the other hand, the input/output pin has a thicker portion that is larger than the diameter of the through hole. Then, when inserting the head of the input/output pin into the through hole,
Since the organic resin material and the metal plating film are soft materials, they can be easily expanded and deformed by the thick portions of the input/output pins.

Therefore, the head of the input/output pin comes into close contact with the through hole in a state where the inside of the through hole is expanded and deformed, and is firmly inserted and fixed.

Therefore, damage such as cracks will not occur in the through holes of the plug-in package when the input/output pins are inserted and fixed. Moreover, the input/output pin can be firmly fixed by simply inserting its head into the through hole as described above.

Furthermore, unlike the prior art described above, it does not require treatment using silver solder and at a high temperature of 800° C., resulting in low cost.

Therefore, according to the present invention, it is possible to provide a low-cost plug-in package and a method for manufacturing the same, in which input/output pins can be firmly inserted and fixed without damaging through-holes. .

[Brief explanation of the drawing]

Fig. 1 is a longitudinal sectional view of the pin used in the present invention, Fig. 2 is a plan view corresponding to Fig. 1, Fig. 3 is a perspective view of the pin, and Fig. 4 is a longitudinal sectional view of the through-hole portion of the board. , 5 and 6 are partially enlarged vertical cross-sectional views of the plug-in package of the present invention in which pins are inserted and fixed in through holes. 1...Substrate made of organic resin material, 2...Through-hole hole, 3...Metal-plated side wall of through-hole, 4
...Pin body, 5... Thick part of pin, 6... Locking collar.

Claims (1)

[Scope of Claims] 1. A printed wiring board made of an organic resin material, a through hole formed in the printed wiring board and covered with a soft metal plating film such as gold, and a head inside the through hole. In addition, the head of the input/output pin has a thick part larger than the hole diameter of the through hole, and the thick part of the head of the input/output pin is connected to the wall of the through hole. A plug-in package characterized by a metal plated film that is firmly attached to a through hole in an enlarged and deformed state. 2. The plug-in package according to claim 1, wherein the input/output pin has a collar. 3. The plug-in package according to claim 1, wherein the input/output pin is soldered within the through hole and at the land portion of the through hole. 4. The plug-in package according to claim 1, wherein the input/output pin has a portion at its head that is thicker than the main body. 5 A step of forming a through hole covered with a soft metal plating film on a double-sided copper-clad printed wiring board made of an organic resin material, and a step of inserting and fixing the head of an input/output pin into the through hole. and the head of the input/output pin has a thick part larger than the hole diameter of the through hole, and when the input/output pin is inserted, the thick part of the head expands and deforms the metal plating film on the wall of the through hole. A method for manufacturing a plug-in package, characterized in that the plug-in package is firmly fixed to a through hole.