JPH0316350U - - Google Patents

Info

Publication number
JPH0316350U
JPH0316350U JP7594089U JP7594089U JPH0316350U JP H0316350 U JPH0316350 U JP H0316350U JP 7594089 U JP7594089 U JP 7594089U JP 7594089 U JP7594089 U JP 7594089U JP H0316350 U JPH0316350 U JP H0316350U
Authority
JP
Japan
Prior art keywords
semiconductor element
mounting
lead frame
center
utility
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP7594089U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7594089U priority Critical patent/JPH0316350U/ja
Publication of JPH0316350U publication Critical patent/JPH0316350U/ja
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8338Bonding interfaces outside the semiconductor or solid-state body
    • H01L2224/83385Shape, e.g. interlocking features

Landscapes

  • Lead Frames For Integrated Circuits (AREA)

Description

【図面の簡単な説明】
第1図は本考案の実施例1を示す平面図、第2
図は本考案の実施例2を示す平面図、第3図は従
来の半導体素子搭載用リードフレームを示す平面
図である。 1……半導体素子搭載用リードフレーム、2…
…溝、3……斜方向の溝、4……枝。

Claims (1)

    【実用新案登録請求の範囲】
  1. 半導体素子搭載用リードフレームの半導体素子
    搭載部に中央部から放射状に延びる溝を有するこ
    とを特徴とする半導体素子搭載用リードフレーム
JP7594089U 1989-06-28 1989-06-28 Pending JPH0316350U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7594089U JPH0316350U (ja) 1989-06-28 1989-06-28

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7594089U JPH0316350U (ja) 1989-06-28 1989-06-28

Publications (1)

Publication Number Publication Date
JPH0316350U true JPH0316350U (ja) 1991-02-19

Family

ID=31616960

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7594089U Pending JPH0316350U (ja) 1989-06-28 1989-06-28

Country Status (1)

Country Link
JP (1) JPH0316350U (ja)

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