JPH0316327U - - Google Patents
Info
- Publication number
- JPH0316327U JPH0316327U JP1989076527U JP7652789U JPH0316327U JP H0316327 U JPH0316327 U JP H0316327U JP 1989076527 U JP1989076527 U JP 1989076527U JP 7652789 U JP7652789 U JP 7652789U JP H0316327 U JPH0316327 U JP H0316327U
- Authority
- JP
- Japan
- Prior art keywords
- chip
- solder bumps
- electrode portions
- flip
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 8
- 239000004065 semiconductor Substances 0.000 claims description 5
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/1401—Structure
- H01L2224/1403—Bump connectors having different sizes, e.g. different diameters, heights or widths
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
- H01L2224/14—Structure, shape, material or disposition of the bump connectors prior to the connecting process of a plurality of bump connectors
- H01L2224/141—Disposition
- H01L2224/1412—Layout
- H01L2224/14179—Corner adaptations, i.e. disposition of the bump connectors at the corners of the semiconductor or solid-state body
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076527U JPH0316327U (un) | 1989-06-29 | 1989-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989076527U JPH0316327U (un) | 1989-06-29 | 1989-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0316327U true JPH0316327U (un) | 1991-02-19 |
Family
ID=31618078
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989076527U Pending JPH0316327U (un) | 1989-06-29 | 1989-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316327U (un) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08298264A (ja) * | 1995-04-27 | 1996-11-12 | Hitachi Ltd | 電子回路装置 |
| JP2006271522A (ja) * | 2005-03-28 | 2006-10-12 | Sanyo Chem Ind Ltd | 組立式簡易洋式便器 |
-
1989
- 1989-06-29 JP JP1989076527U patent/JPH0316327U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08298264A (ja) * | 1995-04-27 | 1996-11-12 | Hitachi Ltd | 電子回路装置 |
| JP2006271522A (ja) * | 2005-03-28 | 2006-10-12 | Sanyo Chem Ind Ltd | 組立式簡易洋式便器 |