JPH0487643U - - Google Patents
Info
- Publication number
- JPH0487643U JPH0487643U JP1990130707U JP13070790U JPH0487643U JP H0487643 U JPH0487643 U JP H0487643U JP 1990130707 U JP1990130707 U JP 1990130707U JP 13070790 U JP13070790 U JP 13070790U JP H0487643 U JPH0487643 U JP H0487643U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- substrate
- semiconductor device
- semiconductor
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990130707U JPH0487643U (un) | 1990-11-30 | 1990-11-30 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1990130707U JPH0487643U (un) | 1990-11-30 | 1990-11-30 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0487643U true JPH0487643U (un) | 1992-07-30 |
Family
ID=31878024
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1990130707U Pending JPH0487643U (un) | 1990-11-30 | 1990-11-30 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0487643U (un) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09214071A (ja) * | 1996-01-31 | 1997-08-15 | Hitachi Ltd | 家庭用電気機器の制御基板 |
KR100545881B1 (ko) * | 1998-03-24 | 2006-01-25 | 세이코 엡슨 가부시키가이샤 | 반도체 칩의 실장 구조체, 액정장치 및 전자기기 |
-
1990
- 1990-11-30 JP JP1990130707U patent/JPH0487643U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09214071A (ja) * | 1996-01-31 | 1997-08-15 | Hitachi Ltd | 家庭用電気機器の制御基板 |
KR100545881B1 (ko) * | 1998-03-24 | 2006-01-25 | 세이코 엡슨 가부시키가이샤 | 반도체 칩의 실장 구조체, 액정장치 및 전자기기 |