JPH03162682A - Substrate inspecting device - Google Patents
Substrate inspecting deviceInfo
- Publication number
- JPH03162682A JPH03162682A JP1302708A JP30270889A JPH03162682A JP H03162682 A JPH03162682 A JP H03162682A JP 1302708 A JP1302708 A JP 1302708A JP 30270889 A JP30270889 A JP 30270889A JP H03162682 A JPH03162682 A JP H03162682A
- Authority
- JP
- Japan
- Prior art keywords
- probe
- frequency
- pattern
- terminal
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 title abstract description 3
- 239000000523 sample Substances 0.000 claims abstract description 30
- 238000007689 inspection Methods 0.000 claims abstract description 13
- 239000003990 capacitor Substances 0.000 claims abstract description 11
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 230000010355 oscillation Effects 0.000 abstract description 11
- 230000007547 defect Effects 0.000 abstract description 4
- 238000005259 measurement Methods 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 3
- 230000002950 deficient Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明は基板検査装置に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a board inspection device.
ご従来の技術〕
従来の基板検査装置について、図面を参照して詳細に説
明する。Background Art] A conventional board inspection apparatus will be described in detail with reference to the drawings.
第４図は従来の基板検査装置の一例を示すブロック図で
ある。FIG. 4 is a block diagram showing an example of a conventional board inspection device.
従来の基板検査装置は抵抗計１６と、金属配線パターン
８（以下パターンとする）に接触する２本のプローブ７
と、前記プローブの位置ぎめ部３と、前記抵抗計、プロ
ーブ、位置ぎめ部を制御する制御部２とを含んで構成さ
れる。A conventional board inspection device includes a resistance meter 16 and two probes 7 that contact a metal wiring pattern 8 (hereinafter referred to as a pattern).
The probe positioning section 3 includes a control section 2 that controls the resistance meter, the probe, and the positioning section.
この装置は、パターンの二つの端子におのおのプローブ
を接触させ、プローブに抵抗計を接続して、２端子間の
配線の抵抗値を測定し、抵抗値が大きいときはパターン
の断線あるいはかけ、細り等の不良と判定する。抵抗値
が十分小さいときは良品と判定する。This device measures the resistance value of the wiring between the two terminals by touching each probe to the two terminals of the pattern and connecting an ohmmeter to the probe. etc., is determined to be defective. When the resistance value is sufficiently small, it is determined to be a good product.
検査の手順としては、あらかじめ制御部２に記憶した、
パターンの端子部１１及び１２の位置にプローブ３をそ
れぞれ移動させ、端子間の抵抗値を測定する。The inspection procedure is as follows, which is stored in the control unit 2 in advance.
The probe 3 is moved to the positions of the terminal parts 11 and 12 of the pattern, respectively, and the resistance value between the terminals is measured.
測定完了後は別のパターンにプローブを移動する。この
手順を繰り返して、基板内のすべてのパターンを検査す
る。After measurement is completed, move the probe to another pattern. Repeat this procedure to inspect all patterns in the board.
上述した従来の基板検査装置では、パターンの良否判定
をするのに２本のプローブを用いている。従ってひとつ
のパターンの検査を絆わっで次のパターンの検査に移る
とき、２木のプローブを移動しなければならないが、こ
のとき各々のプローブの移動距離は同じとは限らないの
で、片方のプローブがさきに移動完了してもう片方が移
動完了するのを待つことが頻繁に発生する。The conventional board inspection apparatus described above uses two probes to determine whether a pattern is good or bad. Therefore, when you finish inspecting one pattern and move on to inspecting the next pattern, you have to move two probes, but at this time, the distance each probe moves is not necessarily the same, so one probe It often happens that the first one completes its move and then waits for the other to complete its move.
このように片方の１ローブの移動の待ち時間の分だけ検
査時間が延びるという欠点があった。In this way, there is a drawback that the inspection time is extended by the waiting time for the movement of one lobe on one side.
本発明の基板検査装置は被測定基板上の金属配線パター
ンに接触するプローブと、前記プローブに接続される抵
抗器，コンデンサと、前記抵抗器，コンデンサに接続さ
れる電圧増幅器と、被測定基板に隣接して設置される基
準電極と、前記電圧増幅器の出力の周波数を測定する周
波数測定器と、前記プローブ，周波数測定器の位置ぎめ
を行う位置ぎめ部と、前記位置ぎめ部を制御する制御部
とを含んで構成される。The board inspection device of the present invention includes a probe that contacts a metal wiring pattern on a board to be measured, a resistor and a capacitor connected to the probe, a voltage amplifier connected to the resistor and capacitor, and a probe that contacts a metal wiring pattern on the board to be measured. A reference electrode installed adjacently, a frequency measuring device for measuring the frequency of the output of the voltage amplifier, a positioning section for positioning the probe and the frequency measuring device, and a control section for controlling the positioning section. It consists of:
次に本発明の実施例について、図面を参照して詳細に説
明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示すブロック図である。FIG. 1 is a block diagram showing one embodiment of the present invention.
プローブ７は位置決め部３により、検査したいパターン
８の端子部１１に移動され、接触される。１ローブ７に
は抵抗器４およびコンデンサ５が接続され、抵抗器４お
よびコンデンサ５の他端は増幅器６の出力に接続される
。The probe 7 is moved by the positioning section 3 to the terminal section 11 of the pattern 8 to be inspected and brought into contact therewith. A resistor 4 and a capacitor 5 are connected to the first lobe 7 , and the other ends of the resistor 4 and the capacitor 5 are connected to the output of an amplifier 6 .
またプローブ７の電圧が増幅器６の入力される。増幅器
６の出力は周波数測定器１に入力され、増幅器６の出力
の周波数を測定する。測定した周波数のデータは制御部
１２に送られ、パターンの良否判定に利用される．
第２図は検査の対象となるパターンの電気的等価回路図
である。Further, the voltage of the probe 7 is input to the amplifier 6. The output of the amplifier 6 is input to the frequency measuring device 1, and the frequency of the output of the amplifier 6 is measured. The measured frequency data is sent to the control unit 12 and used to judge whether the pattern is good or bad. FIG. 2 is an electrical equivalent circuit diagram of a pattern to be inspected.
つぎに検査における不良の判定方法を説明する。Next, a method for determining defects during inspection will be explained.
第３図はプローブ７がパターンの端子部１１に接触して
いる時の、増幅器６、抵抗器４、コンデンサ５およびパ
ターン８をすべて含めた等価回路である。FIG. 3 shows an equivalent circuit including the amplifier 6, resistor 4, capacitor 5, and pattern 8 when the probe 7 is in contact with the terminal portion 11 of the pattern.
この回路は、発振回路を構成し、発振周波数ωは次のよ
うになる。ただし抵抗値ｌ４をＲ、静電容量１３をＣｓ
、静電容量１４をＣｂ、抵抗器４をＲｆ、コンデンサ５
をＣｆとして表す。This circuit constitutes an oscillation circuit, and the oscillation frequency ω is as follows. However, the resistance value l4 is R, and the capacitance 13 is Cs.
, capacitance 14 is Cb, resistor 4 is Rf, capacitor 5
is expressed as Cf.
ω＝ （ Ｃ ｓ ＋ Ｃ ｂ ） ／ （ Ｒ ｆ−
Ｃ ｆ−Ｒ−Ｃ ｂ ）検査には、この回路の発振周波
数の測定値を用いる。抵抗値１５が小さいときは、発振
が起こらないのに対して、抵抗値が大きくなるに連れて
、発振周波数が小さくなる。ω= (Cs + Cb) / (Rf-
C f-R-C b ) The measured value of the oscillation frequency of this circuit is used for the test. When the resistance value 15 is small, no oscillation occurs, whereas as the resistance value increases, the oscillation frequency becomes smaller.
そこで発振周波数を周波数測定器で測定し、周波数が十
分高いときは、良品と判定し、周波数が低い場合は抵抗
値１５が大きいので不良であると判定する。Therefore, the oscillation frequency is measured with a frequency measuring device, and if the frequency is sufficiently high, it is determined to be a good product, and if the frequency is low, the resistance value 15 is large, so it is determined to be defective.
なお静電容量ｌ４静電容量１３に比べて非常に小さいと
きは、発振周波数が高くなるので、不良を検出できない
が、このときはパターンのもう一方の端子１２にプロー
ブを当てて発振周波数を測定すると、式の上では、ｃｂ
とＣｓが入れ替わるので、発振周波数が低くなる。この
ことにより確実に抵抗値１５の不良を検出する。Note that if the capacitance l4 is very small compared to the capacitance 13, the oscillation frequency will be high, so a defect cannot be detected, but in this case, apply a probe to the other terminal 12 of the pattern and measure the oscillation frequency. Then, on the formula, cb
Since Cs and Cs are exchanged, the oscillation frequency becomes lower. This ensures that a defect with a resistance value of 15 is detected.
本発明の基板検査装置は、プローブを一本しか用いない
ので、プローブの移動完了後、すぐに抵抗値を測定する
ことができ、プローブの移動完了の待ち時間が無いので
検査時間を短縮することが出来る。Since the board inspection device of the present invention uses only one probe, the resistance value can be measured immediately after the probe movement is completed, and there is no waiting time for the probe movement to be completed, so the inspection time can be shortened. I can do it.
第１図は本発明の一実施例をしめずブロック図、第２図
は検査の対象となるパターンの電気的等価回路図、第３
図は本発明の検査に用いる信号を得る発振回路図、第４
図は従来の一例を示すブロック図である。
１・・・周波数測定器、２・・・制御部、３・・・位置
決め部、４・・・抵抗器、５・・・コンデンサ、６・・
・増幅器、７・・・プローブ、８・・・パターン、９・
・・基板、１ｏ・・・基準電極、１１．１２・・・端子
部、１３ １４・・・パターンの静電容量、ｌ５・・・
パターンの抵抗、１６・・・抵抗計。Fig. 1 is a block diagram showing one embodiment of the present invention, Fig. 2 is an electrical equivalent circuit diagram of a pattern to be inspected, and Fig. 3 is an electrical equivalent circuit diagram of a pattern to be inspected.
The figure is an oscillation circuit diagram for obtaining signals used for testing the present invention.
The figure is a block diagram showing an example of the conventional technology. DESCRIPTION OF SYMBOLS 1... Frequency measuring device, 2... Control part, 3... Positioning part, 4... Resistor, 5... Capacitor, 6...
・Amplifier, 7... Probe, 8... Pattern, 9.
...Substrate, 1o...Reference electrode, 11.12...Terminal section, 13 14...Capacitance of pattern, l5...
Pattern resistance, 16...resistance meter.
Claims (1)
と、前記プローブに接続される抵抗器、コンデンサと、
前記抵抗器、コンデンサに接続される電圧増幅器と、被
測定基板に隣接して設置される基準電極と、前記電圧増
幅器の出力の周波数を測定する周波数測定器と、前記プ
ローブ、周波数測定器の位置ぎめを行う位置ぎめ部と、
前記位置ぎめ部を制御する制御部とを含む事を特徴とす
る基板検査装置。a probe that contacts a metal wiring pattern on a board to be measured; a resistor and a capacitor connected to the probe;
A voltage amplifier connected to the resistor and capacitor, a reference electrode installed adjacent to the board to be measured, a frequency measuring device for measuring the frequency of the output of the voltage amplifier, and the positions of the probe and frequency measuring device. a positioning section that performs positioning;
A board inspection device comprising: a control section that controls the positioning section.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302708A JPH03162682A (en) | 1989-11-20 | 1989-11-20 | Substrate inspecting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302708A JPH03162682A (en) | 1989-11-20 | 1989-11-20 | Substrate inspecting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03162682A true JPH03162682A (en) | 1991-07-12 |
Family
ID=17912232
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1302708A Pending JPH03162682A (en) | 1989-11-20 | 1989-11-20 | Substrate inspecting device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03162682A (en) |
-
1989
- 1989-11-20 JP JP1302708A patent/JPH03162682A/en active Pending
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