JPH03161943A - Spark device - Google Patents
Spark deviceInfo
- Publication number
- JPH03161943A JPH03161943A JP1302709A JP30270989A JPH03161943A JP H03161943 A JPH03161943 A JP H03161943A JP 1302709 A JP1302709 A JP 1302709A JP 30270989 A JP30270989 A JP 30270989A JP H03161943 A JPH03161943 A JP H03161943A
- Authority
- JP
- Japan
- Prior art keywords
- torch
- rod
- bonding
- time
- spark
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004904 shortening Methods 0.000 abstract description 4
- 230000005611 electricity Effects 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/78268—Discharge electrode
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/85009—Pre-treatment of the connector or the bonding area
- H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
- H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
- H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はスパーク装置、特にワイヤーポンタに適用しう
るスパーク装置に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a spark device, particularly to a spark device applicable to a wire ponter.
従来のスパーク装置は、キャピラリの中心線と一定位離
隔して後端がボンディングヘットに固着するトーチロッ
ドと、トーチロットの先端に固定したＩ〜−チとを含ん
で楕或される。A conventional spark device has an oval shape and includes a torch rod whose rear end is fixed to a bonding head at a certain distance from the center line of a capillary, and an I--CH fixed to a tip of the torch rod.
次に、従来のスパーク装置について図面を参照して詳細
に説明する。Next, a conventional spark device will be described in detail with reference to the drawings.
第３図は従来のスパーク装置の一例を示す斜視図である
。FIG. 3 is a perspective view showing an example of a conventional spark device.
第３図に示すスパーク装置は、１〜−ヂロッ１へ１ｂと
１・−チ２を含んで構或される。The spark device shown in FIG. 3 is constructed to include 1 to 1 to 1b and 1 to 2.
１一一チロッド１ｂはボンディンクヘッド３に固設して
おり、キャピラリ４を保持するポンディンクツール５が
上方向に移動し、キャピラリ４がトーチ２よりも高い位
置になった状態でキャピラリ４に通された金線６とトー
チ２間でスパークを飛ばす構造となっている。The bonding rod 1b is fixed to the bonding head 3, and the bonding tool 5 that holds the capillary 4 moves upward, and when the capillary 4 is at a higher position than the torch 2, it is attached to the capillary 4. The structure is such that sparks are emitted between the gold wire 6 and the torch 2.
次に、第４図を参照しながら動作を説明する。Next, the operation will be explained with reference to FIG.
あるチップのボンディンクが終了し、次のチップのボン
ディンクに移る際には、リートフレーム搬送路１１のワ
ーク押え７を上けて、り−１ヘフレーｌ＼１０の移動を
行う。When the bonding of one chip is completed and the next chip is to be bonded, the work holder 7 of the REET frame conveyance path 11 is raised and the frame 10 is moved to the RI-1.
その場合に、スパークを飛ばさない状態では１一−チロ
ッＦ ］． ｂは、リードフレーム搬送路１１のワーク
押え７と干渉しないように常にリートフレーム搬送路１
１のワーク押え７よりもトーチ２か高い状態に位置する
ように設置されている。In that case, in a state where no spark is emitted, 1-chiro F ]. b is always connected to the lead frame transport path 1 so as not to interfere with the work holder 7 of the lead frame transport path 11.
The torch 2 is installed so as to be located higher than the work holder 7 of the torch 1.
また、スパークを飛はず状態では、キャピラリ４がトー
ヂ２の」゛、方に拉置するようにポンティングヘッ１−
５は士．昇する。In addition, when the spark is not flying, the capillary 4 is placed on the ponting head 1- to the side of the torque 2.
5 is a master. rise
従来のスパーク装置ではスパークを飛ばずことにボンテ
ィングツールが上下移動するので、スパークを飛はずの
に要する時間が長くなり、それにｊ心してボンーｊ−イ
ンク１１．４７問うゝ体の長さムｆ＜： ＜ ！’ｆる
。With conventional spark devices, the bonding tool moves up and down without causing a spark to fly, which increases the time required to make the spark fly. <: <! 'fru.
−Ｅ述したスパーク装置ては、スパークを飛ばずごとに
ボンディングツールが上下移動するので、スパークを飛
ばすのに要する時間か長くなり、それに応じてホンティ
ング時間全体の長さも長くなるという欠点がある。- EThe sparking device described above has the disadvantage that the bonding tool moves up and down every time the spark is ejected, which increases the time required to emit the spark, and the overall length of the bonding time increases accordingly. .
〔課題を解決するための手段〕
本発明のスパーク装置は、キャピラリの中心線と一定位
離隔してボンディンクヘッドに固着し垂直方向に可動す
る１・−チロッ｝へと、前記１ヘーチロットの後端と連
結し前記＋−−チロットを駆動するソレ，ノイドと、前
記１一一チロッドの先端に固定したトーチとを含んて横
戒される。[Means for Solving the Problems] The spark device of the present invention connects a 1.-chirot that is fixed to a bonding head at a certain distance from the center line of a capillary and is movable in a vertical direction, after the 1-hachirot. The rod includes a solenoid connected to the end and driving the +-- pilot rod, and a torch fixed to the tip of the rod.
次に、本発明の実施例について、図面を参照して詳細に
説明する。Next, embodiments of the present invention will be described in detail with reference to the drawings.
第１図は本発明の一実施例を示す斜視図である。FIG. 1 is a perspective view showing an embodiment of the present invention.
第１図に示すスパーク装置は、トーチロッド］とソレノ
イ１〜８と１ランシャ９と１ヘーチ２とを含んで構戒さ
れる。The spark device shown in FIG. 1 includes a torch rod, solenoids 1 to 8, a runner 9, and a hitch 2.
１・−チロット１は上下移動できるようにホンディンク
ヘット３に設置されていて、１・−チロッド１の基部に
はソレノイド８のプランシャ９を連結し、ソレノイド８
に通電されてプランジャ９が突出するとトーチロットｌ
は上昇する。1.-Chirod 1 is installed in the Hondink head 3 so that it can move up and down, and the plunger 9 of solenoid 8 is connected to the base of 1.-chirod 1.
When energized and the plunger 9 protrudes, the torch rod l
will rise.
次に、第２図を参照しながら動作を説明する。Next, the operation will be explained with reference to FIG.
スパークを飛ばさない状態ではトーチ２はキャピラリ４
の下方に位置しており、スパークを飛ばす状態の同一の
状態になっているので、ボンディングツール５は上下移
動する必要はない。When no spark is emitted, torch 2 is capillary 4.
The bonding tool 5 does not need to be moved up or down because it is located below the 2nd position and is in the same state where sparks are emitted.
よって、ポンティンクツールの移動時間がないので、ボ
ンディンクに要する時間は短縮する。また、リードフレ
ーム１０の移動を行う際の１〜−チ２とリードフレーｌ
＼搬送路］１のワーク押え７の干渉を防ぐため、トーチ
ロッド１を上昇させ、トーヂ２はワーク押え７より高い
位置に移動する。Therefore, since there is no time to move the ponting tool, the time required for bonding is shortened. Also, when moving the lead frame 10, 1 to 2 and the lead frame l
\Conveyance Path] In order to prevent interference with the work holder 7 of 1, the torch rod 1 is raised and the torch 2 is moved to a position higher than the work holder 7.
作業時間全体からみて、リードフレームの移動に要する
時間の割合は小さく、実際のポンディング時間が大半を
占めるため、ボンティンク時間を短縮することにより全
体の作業時間を短縮できる。In view of the total working time, the time required for moving the lead frame is small and the actual bonding time accounts for most of the time, so by shortening the bonding time, the overall working time can be shortened.
本発明のスパーク装置は、トーチロッドの上下移動機構
を設けることによりスパークを飛ばすのに要する時間か
短くなり、それに応してボンデインク時間も短くなるの
で、作業時間が短縮化するという効果がある。By providing a mechanism for moving the torch rod up and down, the spark device of the present invention reduces the time required to blow a spark, and the bonding time is correspondingly shortened, resulting in an effect of shortening the working time.
５
第１図は本発明の一実施例を示す斜視図、第２図は本発
明の動作例を示す動作説明図、第３図は従来の一例を示
す斜視図、第４図は従来の動作例を示す動作説明図であ
る。
１．，］．ｂ ・・トーチロッド、２・・・トーチ、
３・・・ボンディングヘッド、４・・・キャピラリ、５
・・・ボンディンクツール、６・・・金線、７ ・ワー
ク押え、８・・・ソレノイド、９・・・プランジャ、］
０・・・リートフレーム、１］・・り−１〜フレーム搬
送路。5. Fig. 1 is a perspective view showing an embodiment of the present invention, Fig. 2 is an operation explanatory diagram showing an example of the operation of the present invention, Fig. 3 is a perspective view showing an example of the conventional method, and Fig. 4 is a conventional operation diagram. FIG. 3 is an operation explanatory diagram showing an example. 1. ,]. b...Torch rod, 2...Torch,
3... Bonding head, 4... Capillary, 5
... bonding tool, 6 ... gold wire, 7 - work holder, 8 ... solenoid, 9 ... plunger, ]
0...Reet frame, 1]...Ri-1~frame conveyance path.
Claims (1)
ドに固着し垂直方向に可動するトーチロッドと、前記ト
ーチロッドの後端と連結し前記トーチロッドを駆動する
ソレノイドと、前記トーチロッドの先端に固定したトー
チとを含むことを特徴とするスパーク装置。a torch rod that is fixed to the bonding head at a certain distance from the center line of the capillary and movable in the vertical direction; a solenoid that is connected to the rear end of the torch rod and drives the torch rod; and a solenoid that is fixed to the tip of the torch rod. A spark device comprising a torch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302709A JPH03161943A (en) | 1989-11-20 | 1989-11-20 | Spark device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1302709A JPH03161943A (en) | 1989-11-20 | 1989-11-20 | Spark device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03161943A true JPH03161943A (en) | 1991-07-11 |
Family
ID=17912243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1302709A Pending JPH03161943A (en) | 1989-11-20 | 1989-11-20 | Spark device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03161943A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666332A (en) * | 2010-11-15 | 2012-09-12 | 松下电器产业株式会社 | Tape adhesion device and tape adhesion method |
| CN110620054A (en) * | 2019-08-19 | 2019-12-27 | 浙江锐群科技有限公司 | Full-automatic deep cavity ball lead bonding head device |
-
1989
- 1989-11-20 JP JP1302709A patent/JPH03161943A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102666332A (en) * | 2010-11-15 | 2012-09-12 | 松下电器产业株式会社 | Tape adhesion device and tape adhesion method |
| CN110620054A (en) * | 2019-08-19 | 2019-12-27 | 浙江锐群科技有限公司 | Full-automatic deep cavity ball lead bonding head device |
| CN110620054B (en) * | 2019-08-19 | 2021-03-23 | 浙江锐群科技有限公司 | Full-automatic deep cavity ball lead bonding head device |
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