JPH03158B2 - - Google Patents

Info

Publication number
JPH03158B2
JPH03158B2 JP9876582A JP9876582A JPH03158B2 JP H03158 B2 JPH03158 B2 JP H03158B2 JP 9876582 A JP9876582 A JP 9876582A JP 9876582 A JP9876582 A JP 9876582A JP H03158 B2 JPH03158 B2 JP H03158B2
Authority
JP
Japan
Prior art keywords
tin
composition
solder
silver
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP9876582A
Other languages
English (en)
Japanese (ja)
Other versions
JPS58215289A (ja
Inventor
Hiroyuki Baba
Chikao Takebayashi
Tetsuo Masuda
Osamu Kodan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Shibaura Electric Co Ltd filed Critical Tokyo Shibaura Electric Co Ltd
Priority to JP9876582A priority Critical patent/JPS58215289A/ja
Publication of JPS58215289A publication Critical patent/JPS58215289A/ja
Publication of JPH03158B2 publication Critical patent/JPH03158B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B23K35/268—Pb as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
JP9876582A 1982-06-09 1982-06-09 ダイボンデイング用はんだ Granted JPS58215289A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9876582A JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9876582A JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Publications (2)

Publication Number Publication Date
JPS58215289A JPS58215289A (ja) 1983-12-14
JPH03158B2 true JPH03158B2 (forum.php) 1991-01-07

Family

ID=14228490

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9876582A Granted JPS58215289A (ja) 1982-06-09 1982-06-09 ダイボンデイング用はんだ

Country Status (1)

Country Link
JP (1) JPS58215289A (forum.php)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2178683A (en) * 1985-07-11 1987-02-18 Nat Semiconductor Corp Improved semiconductor die-attach method and product
JPS6272496A (ja) * 1985-09-26 1987-04-03 Matsuo Handa Kk はんだ合金
CN116038052A (zh) * 2022-12-07 2023-05-02 四川特锐祥科技股份有限公司 一种锡银铅铜高温锡膏及电子元器件芯片的焊接方法

Also Published As

Publication number Publication date
JPS58215289A (ja) 1983-12-14

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