JPH0315832B2 - - Google Patents

Info

Publication number
JPH0315832B2
JPH0315832B2 JP22120985A JP22120985A JPH0315832B2 JP H0315832 B2 JPH0315832 B2 JP H0315832B2 JP 22120985 A JP22120985 A JP 22120985A JP 22120985 A JP22120985 A JP 22120985A JP H0315832 B2 JPH0315832 B2 JP H0315832B2
Authority
JP
Japan
Prior art keywords
melting point
low melting
electronic component
point metal
cooling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP22120985A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6281098A (ja
Inventor
Izumi Ono
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP22120985A priority Critical patent/JPS6281098A/ja
Priority to EP92100518A priority patent/EP0483108B1/en
Priority to US06/914,942 priority patent/US4879632A/en
Priority to EP86307669A priority patent/EP0217676B1/en
Priority to DE86307669T priority patent/DE3688962T2/de
Priority to DE3650687T priority patent/DE3650687T2/de
Publication of JPS6281098A publication Critical patent/JPS6281098A/ja
Priority to US07/079,876 priority patent/US4920574A/en
Priority to US07/079,877 priority patent/US4783721A/en
Priority to US07/261,904 priority patent/US5126919A/en
Publication of JPH0315832B2 publication Critical patent/JPH0315832B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP22120985A 1985-10-04 1985-10-04 冷却構造 Granted JPS6281098A (ja)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP22120985A JPS6281098A (ja) 1985-10-04 1985-10-04 冷却構造
DE3650687T DE3650687T2 (de) 1985-10-04 1986-10-03 Kühlmodule für Vorrichtungen mit elektronischem Schaltkreis
US06/914,942 US4879632A (en) 1985-10-04 1986-10-03 Cooling system for an electronic circuit device
EP86307669A EP0217676B1 (en) 1985-10-04 1986-10-03 Cooling system for electronic circuit device
DE86307669T DE3688962T2 (de) 1985-10-04 1986-10-03 Kühlsystem für eine elektronische Schaltungsanordnung.
EP92100518A EP0483108B1 (en) 1985-10-04 1986-10-03 Cooling modules for electronic circuit components
US07/079,876 US4920574A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/079,877 US4783721A (en) 1985-10-04 1987-07-30 Cooling system for an electronic circuit device
US07/261,904 US5126919A (en) 1985-10-04 1988-10-25 Cooling system for an electronic circuit device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22120985A JPS6281098A (ja) 1985-10-04 1985-10-04 冷却構造

Publications (2)

Publication Number Publication Date
JPS6281098A JPS6281098A (ja) 1987-04-14
JPH0315832B2 true JPH0315832B2 (esLanguage) 1991-03-04

Family

ID=16763171

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22120985A Granted JPS6281098A (ja) 1985-10-04 1985-10-04 冷却構造

Country Status (1)

Country Link
JP (1) JPS6281098A (esLanguage)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7697270B2 (ja) * 2021-06-03 2025-06-24 三菱電機株式会社 フェーズドアレイアンテナ

Also Published As

Publication number Publication date
JPS6281098A (ja) 1987-04-14

Similar Documents

Publication Publication Date Title
US6822867B2 (en) Electronic assembly with solderable heat sink and methods of manufacture
US4479140A (en) Thermal conduction element for conducting heat from semiconductor devices to a cold plate
US7342306B2 (en) High performance reworkable heatsink and packaging structure with solder release layer
US4561011A (en) Dimensionally stable semiconductor device
US4034469A (en) Method of making conduction-cooled circuit package
US20050146021A1 (en) System and method for high performance heat sink for multiple chip devices
JPH0334230B2 (esLanguage)
JP2004214284A (ja) 金属−セラミックス接合基板およびその製造方法
MX145056A (es) Mejoras en metodo para fabricar un paquete de circuito con enfriamiento por conduccion de calor
JPS6054785B2 (ja) 集積回路アセンブリの製造方法
JPS59115548A (ja) 熱伝導橋渡しエレメント
US5146981A (en) Substrate to heatsink interface apparatus and method
KR20100105641A (ko) 열분해 흑연-매설형 히트싱크의 형성 방법
US11622476B2 (en) Circuit board assemblies for electronic devices
CN114141728A (zh) 芯片模组和电路板
US4897764A (en) Conductive cooling cup module
JPH0315832B2 (esLanguage)
JPH0310705Y2 (esLanguage)
JPS58199546A (ja) 半導体冷却装置
US20200375066A1 (en) Multi-device cooling structure having assembly alignment features
JPS63228650A (ja) 発熱素子用冷却装置
JPS59208761A (ja) 電子部品冷却機構
JPS62216349A (ja) 伝導冷却機構の脱着方法
JPS59155156A (ja) Ｉｃモジユ−ル
JPH05160306A (ja) 放熱構造