JPH03158230A - Method for surface-treating silver clad copper material - Google Patents
Method for surface-treating silver clad copper materialInfo
- Publication number
- JPH03158230A JPH03158230A JP29868389A JP29868389A JPH03158230A JP H03158230 A JPH03158230 A JP H03158230A JP 29868389 A JP29868389 A JP 29868389A JP 29868389 A JP29868389 A JP 29868389A JP H03158230 A JPH03158230 A JP H03158230A
- Authority
- JP
- Japan
- Prior art keywords
- bta
- coated
- alloy
- silver
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 24
- 229910052709 silver Inorganic materials 0.000 title claims abstract description 8
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 7
- 238000000034 method Methods 0.000 title claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title abstract 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 title abstract 3
- 239000010949 copper Substances 0.000 title abstract 3
- 239000004332 silver Substances 0.000 title abstract 3
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910001316 Ag alloy Inorganic materials 0.000 claims abstract description 9
- -1 mercapto compound Chemical class 0.000 claims abstract description 7
- 229910000881 Cu alloy Inorganic materials 0.000 claims abstract description 6
- 239000000956 alloy Substances 0.000 claims abstract description 6
- 239000012964 benzotriazole Substances 0.000 claims abstract description 6
- 239000002904 solvent Substances 0.000 claims abstract description 6
- 239000004215 Carbon black (E152) Substances 0.000 claims abstract description 4
- 229930195733 hydrocarbon Natural products 0.000 claims abstract description 4
- 150000002430 hydrocarbons Chemical class 0.000 claims abstract description 4
- 238000004381 surface treatment Methods 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 230000007797 corrosion Effects 0.000 abstract description 11
- 238000005260 corrosion Methods 0.000 abstract description 11
- 239000011259 mixed solution Substances 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 2
- 238000005507 spraying Methods 0.000 abstract description 2
- 238000007598 dipping method Methods 0.000 abstract 1
- 239000011369 resultant mixture Substances 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 description 10
- 239000000047 product Substances 0.000 description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RMVRSNDYEFQCLF-UHFFFAOYSA-N thiophenol Chemical compound SC1=CC=CC=C1 RMVRSNDYEFQCLF-UHFFFAOYSA-N 0.000 description 3
- YXIWHUQXZSMYRE-UHFFFAOYSA-N 1,3-benzothiazole-2-thiol Chemical compound C1=CC=C2SC(S)=NC2=C1 YXIWHUQXZSMYRE-UHFFFAOYSA-N 0.000 description 2
- CMGDVUCDZOBDNL-UHFFFAOYSA-N 4-methyl-2h-benzotriazole Chemical compound CC1=CC=CC2=NNN=C12 CMGDVUCDZOBDNL-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 102100033722 Cholesterol 25-hydroxylase Human genes 0.000 description 2
- RWSOTUBLDIXVET-UHFFFAOYSA-N Dihydrogen sulfide Chemical class S RWSOTUBLDIXVET-UHFFFAOYSA-N 0.000 description 2
- 101000944583 Homo sapiens Cholesterol 25-hydroxylase Proteins 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000005461 lubrication Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- UOCLXMDMGBRAIB-UHFFFAOYSA-N 1,1,1-trichloroethane Chemical compound CC(Cl)(Cl)Cl UOCLXMDMGBRAIB-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- FLFWJIBUZQARMD-UHFFFAOYSA-N 2-mercapto-1,3-benzoxazole Chemical compound C1=CC=C2OC(S)=NC2=C1 FLFWJIBUZQARMD-UHFFFAOYSA-N 0.000 description 1
- 229940054266 2-mercaptobenzothiazole Drugs 0.000 description 1
- QRHDSDJIMDCCKE-UHFFFAOYSA-N 4-ethyl-2h-benzotriazole Chemical compound CCC1=CC=CC2=C1N=NN2 QRHDSDJIMDCCKE-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003849 aromatic solvent Substances 0.000 description 1
- UENWRTRMUIOCKN-UHFFFAOYSA-N benzyl thiol Chemical compound SCC1=CC=CC=C1 UENWRTRMUIOCKN-UHFFFAOYSA-N 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005536 corrosion prevention Methods 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000002845 discoloration Methods 0.000 description 1
- WNAHIZMDSQCWRP-UHFFFAOYSA-N dodecane-1-thiol Chemical compound CCCCCCCCCCCCS WNAHIZMDSQCWRP-UHFFFAOYSA-N 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000004435 hydrogen atom Chemical class [H]* 0.000 description 1
- 229910017053 inorganic salt Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229940057995 liquid paraffin Drugs 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- QJAOYSPHSNGHNC-UHFFFAOYSA-N octadecane-1-thiol Chemical compound CCCCCCCCCCCCCCCCCCS QJAOYSPHSNGHNC-UHFFFAOYSA-N 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 230000003449 preventive effect Effects 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は電気、電子機器とその部品に使用されるＡｇ被
覆Ｃｕ材の表面処理法に関するもので、特に長期間安定
した摺動特性及び電気接続性を付与するものである。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a surface treatment method for Ag-coated Cu materials used in electrical and electronic equipment and their parts, and particularly relates to long-term stable sliding properties and electrical properties. It provides connectivity.
一般に電気、電子機器とその部品には、Ｃｕ又はＣｕ合
金からなる基材の表面にＡｇ又はＡｇ合金を彼ｌしたＡ
ｇ被覆Ｃｕ材が用いられている。これらは何れもＡｇ特
有の優れた導電性、耐食性１電気接続性等を経済的に利
用したもので、特に接点用を始め安定した電気接続性を
要求されるものが多い。電気接続性を安定させるために
は、接触抵抗が初期及び経時的に安定しており、表面の
滑り性が良好で摩耗損傷が小さく、耐食性が優れている
ことが必要であるとされている。In general, electrical and electronic devices and their parts are manufactured using Ag or Ag alloys on the surface of a base material made of Cu or Cu alloy.
g-coated Cu material is used. All of these materials economically utilize the excellent conductivity, corrosion resistance, electrical connectivity, etc. peculiar to Ag, and many of them require stable electrical connectivity, especially for use in contacts. In order to stabilize electrical connectivity, it is said that it is necessary that the contact resistance be stable initially and over time, that the surface should have good slipperiness, little wear and tear, and excellent corrosion resistance.
Ａｇ被覆Ｃｕ材の電気接続性は、腐食皮膜が形成される
と腐食被膜の厚さに比例して劣化することが知られてい
る。最近電気、′ｒ４子機器の使用範囲の拡大により、
複雑な厳しい環境下で使用されるようになり、使用環境
の相違から異なる腐食皮膜を生成し、耐食性と電気接続
性か比例しないようになってきた。It is known that when a corrosion film is formed, the electrical connectivity of Ag-coated Cu material deteriorates in proportion to the thickness of the corrosion film. Recently, due to the expansion of the scope of use of electric and 'r4 child devices,
As they have come to be used in complex and harsh environments, different corrosion films are formed due to the different usage environments, and corrosion resistance and electrical connectivity have become unequal.
Ａｇ又はＡｇ合金の変色、腐食防止剤としてメルカプト
化合物（Ｍ）の被着か有効であるとされているが、Ｍの
被着ではＡｇ被覆Ｃｕ材の接触抵抗、滑り性、摩擦特性
等は改善されず、Ｍを被着しないものと同等又はこれよ
り劣るもので、Ａｇ被覆Ｃｕ材の電気接続性と滑り性を
長期間安定させることはできない。またＡｇ被覆Ｃｕ材
の耐食性についてもＭの被着では製造工程中の熱処理等
による基材成分の拡散や圧延等によるＡｇ被覆層の損傷
に基づく基材の露出部の腐食を防止することはできない
。It is said that adhesion of mercapto compound (M) is effective as a discoloration and corrosion preventive agent for Ag or Ag alloys, but adhesion of M does not improve the contact resistance, slipperiness, frictional properties, etc. of Ag-coated Cu material. However, the electrical connectivity and slipperiness of the Ag-coated Cu material cannot be stabilized for a long period of time. Regarding the corrosion resistance of Ag-coated Cu materials, M coating cannot prevent corrosion of exposed parts of the base material due to diffusion of base material components due to heat treatment during the manufacturing process or damage to the Ag coating layer due to rolling etc. .
本発明はこれに鑑み種々研究の結果、Ａｇ被覆Ｃｕ材に
長期間安定した摺動特性及び電気接続性を付与すること
ができるＡｇ被ｉｃｕ材の表面処理法を開発したもので
、Ａｇ又はＡｇ合金を被覆したＣｕ又はＣｕ合金材の表
面に、メルカプト化合物（Ｍ）と炭化水素（Ｐ）及びベ
ンゾトリアゾール又はその誘導体（ＢＴＡ）をＭ Ｏ，
０１〜５ ｗ１％（以下ｗ１％を％と略記）、Ｐｏ、０
１〜１０％、ＢＴＡｏ、０１〜１０％の範囲内で溶剤に
混合溶解した溶液として被着することを特徴とするもの
である。In view of this, as a result of various studies, the present invention has developed a surface treatment method for Ag ICU material that can provide long-term stable sliding characteristics and electrical connectivity to Ag-coated Cu material. A mercapto compound (M), a hydrocarbon (P), and a benzotriazole or its derivative (BTA) are added to the surface of the Cu or Cu alloy material coated with the alloy.
01-5 w1% (hereinafter w1% is abbreviated as %), Po, 0
It is characterized in that it is applied as a solution mixed and dissolved in a solvent in the range of 1 to 10% BTAo and 01 to 10% BTAo.
本発明表面処理法の液組成は上記組成からなり、Ａｇ又
はＡｇ合金被覆Ｃｕ材の表面に発生した熱拡散による基
材の露出や圧延損傷による基材露出部にＢＴＡが被着し
、Ａｇ又はＡｇ合金表面にはＭが被着する。またこれ等
の被着では同種金属同志の摩耗特性は改善されないが、
Ｐが摩耗特性の改善に大きく寄与する。しかもＡｇ又は
Ａｇ合金被覆Ｃｕ材表面へのＭとＰとＢＴＡの被着によ
り表面品質を低下させることなく耐食性と摩耗特性を向
上し、該材料の電気接続性を長期間安定させる。The liquid composition of the surface treatment method of the present invention has the above composition, and BTA adheres to the exposed parts of the base material due to heat diffusion generated on the surface of the Ag or Ag alloy-coated Cu material or to the exposed parts of the base material due to rolling damage. M adheres to the surface of the Ag alloy. Furthermore, although these types of adhesion do not improve the wear characteristics of similar metals,
P greatly contributes to improving wear characteristics. Moreover, by adhering M, P, and BTA to the surface of the Ag or Ag alloy-coated Cu material, corrosion resistance and wear characteristics are improved without deteriorating the surface quality, and the electrical connectivity of the material is stabilized for a long period of time.
しかして溶剤に溶解するＭｆｆｉを０．０１〜５％Ｐ量
を０００１〜１０％、ＢＴＡ量を０．０１〜１０％と限
定したのは、何れも下限未満では防蝕力及び潤滑効果が
不十分となり、上限を超えるとＡｇ被覆Ｃｕ材の表面に
過剰に被着し、その除去が困難で、外観、接触抵抗、経
済性の面から好ましくないためである。Therefore, the reason why we limited the Mffi that dissolves in the solvent to 0.01-5%, the amount of P to 0.001-10%, and the amount of BTA to 0.01-10% is because the corrosion prevention and lubrication effects are insufficient below the lower limits. This is because if the upper limit is exceeded, excessive adhesion will occur on the surface of the Ag-coated Cu material, making it difficult to remove and being unfavorable in terms of appearance, contact resistance, and economical efficiency.
本発明は上記の如（ＭとＰとＢＴＡの混合溶液中にＡｇ
又はＡｇ合金を被覆したＣｕ又はＣｕ合金材を浸漬する
か、又は該部材の表面に混合溶液をスプレー等により塗
布することにより、該部材の表面にＭとＰとＢＴＡを被
着する。The present invention is based on the method described above (Ag in a mixed solution of M, P, and BTA).
Alternatively, M, P, and BTA are deposited on the surface of the member by immersing Cu or Cu alloy material coated with Ag alloy, or by applying a mixed solution to the surface of the member by spraying or the like.
Ｍとは一般式Ｒ−３Ｈで示される有機化合物及びこれ等
の無機塩類で、例えば脂肪族メルカプタンとして効力及
び蒸気圧の点から炭素数０４〜Ｃｌ１１に相当するメル
カプタンが適しており、ラウリルメルカプタン（Ｃ１２
Ｈ２５Ｓ Ｈ） 、オクタデシルメルカプタン（ＣＩｌ
ＩＨ３□ＳＨ）等である。また芳香族メルカプタンとし
てフェニルメルカプタン（Ｃ６Ｈ−ＳＨ）、ベンジルメ
ルカプタン（Ｃ６Ｈ，ＣＨ２５Ｈ）、チオアンスラノー
ル（Ｃ，、Ｈ，ＳＨ）等である。またその他として２−
メルカプトベンゾチアゾール（Ｃ７Ｈ，ＣＨ２５Ｈ）、
ベンズオキサゾールチオール（Ｃ，Ｈ，Ｎ０３）、ベン
ズイミダゾールチオール（Ｃ７Ｈ６Ｎ、Ｓ）等がある。M refers to an organic compound represented by the general formula R-3H and inorganic salts thereof. For example, mercaptans having carbon numbers of 04 to Cl11 are suitable as aliphatic mercaptans from the viewpoint of efficacy and vapor pressure, and lauryl mercaptan ( C12
H25S H), octadecyl mercaptan (CIl
IH3□SH) etc. Examples of aromatic mercaptans include phenylmercaptan (C6H-SH), benzylmercaptan (C6H, CH25H), and thioanthranol (C,,H,SH). In addition, 2-
Mercaptobenzothiazole (C7H, CH25H),
Examples include benzoxazole thiol (C, H, N03) and benzimidazole thiol (C7H6N, S).
Ｐとは炭素と水素の化合物であって流動パラフィン（動
粘度４０°０． ９〜Ｉｔ（ｌｅｓｔ）か適している。P is a compound of carbon and hydrogen, and suitable is liquid paraffin (kinematic viscosity: 40°, 0.9 to It(rest)).
ＢＴＡとはベンゾトリアゾール又はその誘動体で、例え
ばベンゾトリアゾール、メチルベンゾトリアゾール、エ
チルベンゾトリアゾール、トリルトリアゾール又はそれ
等の無機塩類やそれと有機アミン、有機カルボン酸等と
の反応生成物等である。またＭ（！：ＰとＢを混合して
溶解する溶剤にはトルエン、トリクロールエタン、アロ
マチックソルベント等を用いる。BTA is benzotriazole or a derivative thereof, such as benzotriazole, methylbenzotriazole, ethylbenzotriazole, tolyltriazole, or an inorganic salt thereof, or a reaction product of it with an organic amine, an organic carboxylic acid, or the like. Further, toluene, trichloroethane, aromatic solvent, etc. are used as a solvent for mixing and dissolving M(!:P and B).
以下本発明を実施例について説明する。 The present invention will be described below with reference to Examples.
Ａｇを０．２μの厚さに被覆したＣｕ板（厚さｆｌ、２
ｍｍ、巾］Ｏｍ＋ｎ、長さ５（１ｍｍ）を用い、第１表
に示す被１処理を行なった。これ等について温度４０℃
、湿度９０％ＲＨのＨ２Ｓ ５００ｐｐｂ、 Ｎ Ｏ２
２００＋＋ｐｂ、 ３０２１（１００ｐｐｂ 、
Ｃ１２２０ｐｐｂ混合ガス中に１２時間保持した後、温
度６０℃、湿度７５％ＲＨの同一混合ガス中に１２時間
保持することを２０日間繰返して劣化処理し、これにつ
いて荷重２０ｇ、 ？ｌ流１００ｍ Ａの条件で接触抵
抗（Ｒｅ）を測定すると共に、バラテン型試験機を用い
て初期摩擦係数（μｋ）と摩擦係数の経時変化を測定し
た。これ等の結果を従来品と比較して第２表及び第３表
に示す。Cu plate coated with Ag to a thickness of 0.2μ (thickness fl, 2
mm, width] Om+n, length 5 (1 mm), and the treatment shown in Table 1 was performed. Temperature 40℃ for these
, H2S 500ppb at 90% RH, N O2
200++pb, 3021 (100ppb,
After holding in C1220ppb mixed gas for 12 hours, holding in the same mixed gas at a temperature of 60°C and humidity of 75% RH for 12 hours was repeated for 20 days for deterioration treatment, and a load of 20g was applied. The contact resistance (Re) was measured under the condition of 1 flow of 100 mA, and the initial friction coefficient (μk) and the change in the friction coefficient over time were measured using a Ballaten type tester. These results are shown in Tables 2 and 3 in comparison with conventional products.
第１表、第２表及び第３表から期らかなように、無処理
の従来品Ｎα１５は劣化処理後の接触抵抗（Ｒｃ）と摩
擦係数（μｋ）の劣化が著しいのに対し、本発明処理品
漱１〜８は何れも劣化処理後も接触抵抗（Ｒｃ）と摩擦
係数（μｋ）が殆ど劣化せず、長期にわたり安定した電
気接続性と特に優れた潤滑特性を有することが判る。As can be seen from Tables 1, 2, and 3, the untreated conventional product Nα15 shows significant deterioration in contact resistance (Rc) and friction coefficient (μk) after deterioration treatment, whereas the present invention It can be seen that the contact resistance (Rc) and friction coefficient (μk) of treated products Nos. 1 to 8 hardly deteriorate even after the deterioration treatment, and that they have stable electrical connectivity over a long period of time and particularly excellent lubrication properties.
これに対しＭ被着、Ｐ被着又はＢＴＡ被着を欠（比較処
理品Ｎα９〜１３では劣化処理による接触抵抗（Ｒｃ）
と摩擦係数（μｋ）の劣化を防止することができず、ま
たＭとＢＴＡを被着してもＭの溶解量が本発明で規定す
る量より少ない比較処理品ｋｌｌ、 Ｍ及びＢＴＡの溶
解量が本発明で規定する量より多い比較処理品Ｎα１２
では何れも劣化処理により接触抵抗（Ｒｃ）と摩擦係数
（μｋ）の劣化が防止できず、Ｐ被着のみの比較処理品
Ｎα１３では接触抵抗（Ｒｃ）の劣化が防止できないこ
とが判る。またＭとＢＴＡとＰＦＡＰを被着した比較処
理品Ｎα１４では初期摩擦係数において劣化処理前後と
も本発明処理品と同等の摩擦係数（μｋ）を示すものの
、摩擦係数の経時変化において摺動回数２００回で約２
倍の摩擦係数（μｍ０を示す。On the other hand, there is no M adhesion, P adhesion, or BTA adhesion (contact resistance (Rc) due to deterioration treatment for comparison treated products Nα9 to 13)
Comparatively treated products kll cannot prevent deterioration of the friction coefficient (μk), and even if M and BTA are coated, the amount of M dissolved is smaller than the amount specified in the present invention, and the amount of dissolved M and BTA is lower. Comparatively treated product Nα12 in which the amount is greater than the amount specified in the present invention.
It can be seen that deterioration of the contact resistance (Rc) and friction coefficient (μk) cannot be prevented by the deterioration treatment in any case, and deterioration of the contact resistance (Rc) cannot be prevented in the comparatively treated product Nα13 with only P coating. In addition, although the comparison treated product Nα14 coated with M, BTA, and PFAP shows the same initial friction coefficient (μk) as the inventive treated product both before and after the deterioration treatment, the change in friction coefficient over time shows that the number of sliding cycles is 200. About 2
Double the coefficient of friction (indicates μm0).
このように本発明によれば、Ａｇ彼ＩＣｕ材の電気接続
性及び摺動特性を長期間安定に維持することができ、処
理コストも安価である等工業上顕著な効果を奏するもの
である。As described above, according to the present invention, the electrical connectivity and sliding properties of the Ag-ICu material can be maintained stably for a long period of time, and the processing cost is low, which brings about remarkable industrial effects.
Claims (1)
面に、メルカプト化合物（Ｍ）と炭化水素（Ｐ）及びベ
ンゾトリアゾール又はその誘導体（ＢＴＡ）をＭ０．０
１〜５ｗｔ％，Ｐ０．０１〜１０ｗｔ％，ＢＴＡ０．０
１〜１０ｗｔ％の範囲内で溶剤に混合溶解した溶液とし
て被着することを特徴とするＡｇ被覆Ｃｕ材の表面処理
法。Mercapto compound (M), hydrocarbon (P), and benzotriazole or its derivative (BTA) are applied to the surface of Cu or Cu alloy material coated with Ag or Ag alloy at M0.0.
1-5wt%, P0.01-10wt%, BTA0.0
A surface treatment method for an Ag-coated Cu material, characterized in that the coating is applied as a solution mixed and dissolved in a solvent within a range of 1 to 10 wt%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298683A JP2599470B2 (en) | 1989-11-16 | 1989-11-16 | Surface treatment method for Ag-coated Cu material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1298683A JP2599470B2 (en) | 1989-11-16 | 1989-11-16 | Surface treatment method for Ag-coated Cu material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03158230A true JPH03158230A (en) | 1991-07-08 |
| JP2599470B2 JP2599470B2 (en) | 1997-04-09 |
Family
ID=17862929
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1298683A Expired - Lifetime JP2599470B2 (en) | 1989-11-16 | 1989-11-16 | Surface treatment method for Ag-coated Cu material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2599470B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012090780A1 (en) * | 2010-12-29 | 2012-07-05 | 三洋電機株式会社 | Solar cell and solar cell module |
| JP2016006915A (en) * | 2015-10-15 | 2016-01-14 | パナソニックＩｐマネジメント株式会社 | Solar cell and solar cell module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61133391A (en) * | 1984-11-30 | 1986-06-20 | Furukawa Electric Co Ltd:The | Method for stabilizing surface of ag coated cu material |
-
1989
- 1989-11-16 JP JP1298683A patent/JP2599470B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61133391A (en) * | 1984-11-30 | 1986-06-20 | Furukawa Electric Co Ltd:The | Method for stabilizing surface of ag coated cu material |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2012090780A1 (en) * | 2010-12-29 | 2012-07-05 | 三洋電機株式会社 | Solar cell and solar cell module |
| JP2012142452A (en) * | 2010-12-29 | 2012-07-26 | Sanyo Electric Co Ltd | Solar cell and solar cell module |
| US9425340B2 (en) | 2010-12-29 | 2016-08-23 | Panasonic Intellectual Property Management Co., Ltd. | Solar cell and solar cell module |
| JP2016006915A (en) * | 2015-10-15 | 2016-01-14 | パナソニックＩｐマネジメント株式会社 | Solar cell and solar cell module |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2599470B2 (en) | 1997-04-09 |
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