JPH0315357B2 - - Google Patents
Info
- Publication number
- JPH0315357B2 JPH0315357B2 JP57012437A JP1243782A JPH0315357B2 JP H0315357 B2 JPH0315357 B2 JP H0315357B2 JP 57012437 A JP57012437 A JP 57012437A JP 1243782 A JP1243782 A JP 1243782A JP H0315357 B2 JPH0315357 B2 JP H0315357B2
- Authority
- JP
- Japan
- Prior art keywords
- metal
- metal core
- core
- printed wiring
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229910052751 metal Inorganic materials 0.000 claims description 73
- 239000002184 metal Substances 0.000 claims description 73
- 239000004020 conductor Substances 0.000 claims description 25
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 20
- 229910052802 copper Inorganic materials 0.000 claims description 15
- 239000010949 copper Substances 0.000 claims description 15
- 229910052782 aluminium Inorganic materials 0.000 claims description 11
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 11
- 230000000149 penetrating effect Effects 0.000 claims description 6
- 238000010030 laminating Methods 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 description 17
- 238000005476 soldering Methods 0.000 description 13
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000011889 copper foil Substances 0.000 description 5
- 239000011888 foil Substances 0.000 description 5
- 230000004907 flux Effects 0.000 description 4
- 229910020816 Sn Pb Inorganic materials 0.000 description 3
- 229910020922 Sn-Pb Inorganic materials 0.000 description 3
- 229910008783 Sn—Pb Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 229910004866 Cd-Zn Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229910020994 Sn-Zn Inorganic materials 0.000 description 1
- 229910009069 Sn—Zn Inorganic materials 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】
本発明は金属芯印刷配線板に関し、特に金属芯
と導体回路との電気的接続部の改良に関するもの
である。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a metal core printed wiring board, and more particularly to an improvement in the electrical connection between the metal core and a conductor circuit.
金属芯印刷配線板において、導体回路の一部と
金属芯を電気的に接続することは、金属芯そのも
のをアース電位とする場合、或は電気回路の一部
として利用する場合に極めて有効である。このよ
うな場合、従来は、例えばアルミニウム板を金属
芯とする場合を例に採れば、表面の絶縁層をエン
ドミルで除去し、その露出したアルミニウム面に
アルミニウム線を用いてワイヤボンデイングする
方法が一般に採用されている。 In a metal core printed wiring board, electrically connecting a part of the conductor circuit and the metal core is extremely effective when the metal core itself is at ground potential or when used as part of an electric circuit. . In such cases, the conventional method, for example when using an aluminum plate as a metal core, is to remove the surface insulating layer with an end mill and then wire bond the exposed aluminum surface using aluminum wire. It has been adopted.
しかしながら、この方法は導体回路面とエンド
ミルによる窪みとの間に段差を生じるためワイヤ
ボンドの安定性が不十分になり易く、またボンデ
イングワイヤは一般に線径が小さいから金属芯印
刷配線板が好んで用いられるパワーハイブリツド
ICなどの大電流回路には適用し難い欠点がある。 However, this method creates a step between the conductor circuit surface and the recess made by the end mill, which tends to result in insufficient wire bond stability, and bonding wires generally have a small wire diameter, so metal core printed wiring boards are preferred. Power hybrid used
There is a drawback that it is difficult to apply to large current circuits such as ICs.
さらに、絶縁層をエンドミルを用いて除去する
ため、周辺の絶縁層に剥離を生じ易く、周辺の回
路に悪影響を与える慮れもある。またさらに、金
属芯として用いられる金属は必ずしもアルミニウ
ム線のボンデイングが容易な金属とは限らないも
ので、この種の従来方法は汎用性に欠ける欠点も
ある。 Furthermore, since the insulating layer is removed using an end mill, the surrounding insulating layer is likely to peel off, which may adversely affect the surrounding circuitry. Furthermore, the metal used as the metal core is not necessarily a metal that can be easily bonded to an aluminum wire, and this type of conventional method also has the disadvantage of lacking in versatility.
本発明は、上述の欠点を解消するため成された
もので、その目的は、金属芯印刷配線板における
導体回路と金属芯との電気的接続をSn−Pb系半
田を用いて欠陥なく容易に行ない得、金属芯のヒ
ートシンク性の保持、軽量化が計れると共に、通
電容量の大きな場合でも、安定した電気的接続が
得られる金属芯印刷配線板を提供することにあ
る。 The present invention has been made in order to eliminate the above-mentioned drawbacks, and its purpose is to easily and defect-free electrical connection between a conductor circuit and a metal core in a metal core printed wiring board using Sn-Pb solder. It is an object of the present invention to provide a metal core printed wiring board that can maintain the heat sink properties of the metal core, reduce its weight, and provide stable electrical connection even when the current carrying capacity is large.
本発明は、金属芯の上に絶縁層を介して導体回
路を設けた金属芯印刷配線板において、前記金属
芯は芯用金属上に半田付け性の良い金属を貼り合
せて成り、前記導体回路と前記金属芯を接続すべ
き個所に、前記導体回路と前記絶縁層を貫通する
貫通孔、および前記金属芯を貫通するガス抜き孔
を設けて成ることを特徴とする金属芯印刷配線板
である。 The present invention provides a metal core printed wiring board in which a conductor circuit is provided on a metal core via an insulating layer, wherein the metal core is formed by laminating a metal with good solderability on the core metal, and the conductor circuit is A metal core printed wiring board characterized in that a through hole penetrating the conductor circuit and the insulating layer and a gas vent hole penetrating the metal core are provided at a location where the conductor circuit and the metal core are to be connected. .
以下、本発明を図面を用いて実施例により説明
する。 Hereinafter, the present invention will be explained by examples using the drawings.
第１図は本発明の金属芯印刷配線板の実施例を
示す平面図で、第２図は第１図に示すＡ−A′断
面を示す図である。図において、１は金属芯で、
例えばアルミニウム、鋼（鉄）板等の芯用金属２
上に絶縁層３を介して、例えば銅、スズめつき銅
板等のSn−Pb系半田による半田付け性の良い金
属４を貼り合せたものである。５は、例えばポリ
イミド、ポリエステル、ポリアミドイミド等より
成る絶縁層、６は銅等より成る導体箔、７はその
上に施された絶縁フイルム（又はレジストイン
キ）である。導体箔６はエツチング又はめつき等
により導体回路が形成されている。８はランド
（例、銅）で金属芯の金属４と電気的に接続され
る。 FIG. 1 is a plan view showing an embodiment of the metal core printed wiring board of the present invention, and FIG. 2 is a cross-sectional view taken along the line A-A' shown in FIG. In the figure, 1 is a metal core,
For example, core metal 2 such as aluminum, steel (iron) plate, etc.
A metal 4 having good solderability with Sn--Pb solder, such as copper or tin-plated copper plate, is bonded thereon through an insulating layer 3. 5 is an insulating layer made of polyimide, polyester, polyamideimide, etc., 6 is a conductive foil made of copper or the like, and 7 is an insulating film (or resist ink) applied thereon. A conductor circuit is formed on the conductor foil 6 by etching or plating. 8 is a land (eg, copper) that is electrically connected to the metal 4 of the metal core.
この接続のために、ランド８と金属４を接続す
べき個所に、導体箔６と絶縁層５を貫通する貫通
孔９が設けられている。さらにこの個所の金属芯
１には、それを貫通するガス抜き孔１０が設けら
れている。このガス抜き孔１０は後でランド８
（例、銅）と金属芯１の半田付け性の良い金属４
（例、銅）とを、Sn−Pb系半田により半田付けす
る際、半田フラツクスおよびそのくぼみに滞留す
るガスによる半田付け不良を防止するもので、こ
れによりフラツクスの排出やガスの外部への放散
が行なわれ、導体回路と金属芯の欠陥のない健全
な電気的接続が得られる。 For this connection, a through hole 9 passing through the conductive foil 6 and the insulating layer 5 is provided at the location where the land 8 and the metal 4 are to be connected. Further, the metal core 1 at this location is provided with a gas vent hole 10 passing through it. This gas vent hole 10 will be connected to the land 8 later.
(e.g. copper) and metal core 1 with good solderability metal 4
When soldering (e.g., copper) with Sn-Pb solder, it prevents soldering defects due to solder flux and gas remaining in the recesses. This prevents flux from being discharged and gas from dissipating to the outside. This results in a defect-free and sound electrical connection between the conductor circuit and the metal core.
このように構成された本発明による金属芯印刷
配線板を作成するには、絶縁フイルム５に導体箔
６（例、銅）を接着した板に導体回路を形成し、
必要により該導体上に絶縁フイルム７（又はレジ
ストインキ）を施した印刷配線板（例えばフレキ
シブル印刷配線板）を作成し、導体回路の金属芯
１と接続すべき個所に、貫通孔９を設ける。別に
芯用金属２上に絶縁層３を介して半田付け性の良
い金属４を貼り合せて金属芯１を作成し、上記印
刷配線板の裏面にこれを重ね合せ、接着した後、
ガス抜き孔１０を設ける。ここでガス抜き孔１０
は通常雄雌金型にて施され、この孔開けピンの打
抜き寿寿命等から直径0.8mm以上が好ましいが、
通常0.5mm以上あればガス抜き孔としての働き
は充分である。 In order to create the metal-core printed wiring board according to the present invention configured as described above, a conductor circuit is formed on a board in which a conductor foil 6 (e.g., copper) is bonded to an insulating film 5;
If necessary, a printed wiring board (for example, a flexible printed wiring board) is prepared by applying an insulating film 7 (or resist ink) on the conductor, and through-holes 9 are provided at locations to be connected to the metal core 1 of the conductor circuit. Separately, a metal core 1 with good solderability is pasted onto the core metal 2 via an insulating layer 3 to create a metal core 1, and this is superimposed on the back side of the printed wiring board and bonded.
A gas vent hole 10 is provided. Here, gas vent hole 10
This is usually done using male and female dies, and a diameter of 0.8 mm or more is preferable from the perspective of the punching life of this hole pin.
Normally, a hole of 0.5 mm or more is sufficient to function as a gas vent hole.
しかる後、導体回路（例、銅）と金属芯１の半
田付け性の良い金属４（例、銅）をSn−Pb系半
田により半田付けする。この場合、半田付けは銅
同志できわめて容易であり、この際発生するガス
やフラツクスはガス抜き孔１０を通じて容易に放
散又は排除されるので、欠陥のない（健全な）半
田付けが得られる。 Thereafter, the conductor circuit (eg, copper) and the metal 4 (eg, copper) with good solderability of the metal core 1 are soldered using Sn--Pb solder. In this case, soldering is extremely easy between copper and copper, and the gas and flux generated at this time are easily dissipated or eliminated through the gas vent hole 10, so that defect-free (sound) soldering can be obtained.
従来アルミニウムと銅との接合にアルミニウム
用半田を用いて行なう方法がある。この半田は、
ＡとPbとの粒間腐食を避けるためPbを含まな
いCd−Zn系、Sn−Zn系の半田になるが、アルミ
ニウムとの半田付け方法には、半田をアルミニウ
ム上で溶融させた後、ブラツシングしないと付き
が悪いという問題がある。従つて例えばアルミニ
ウム芯に直接半田付けしようとすれば上述のよう
なむつかしさがあるが、本発明においては、上述
のように、例えば銅同志の半田付けであるので、
Sn−Pb系半田を用いてきわめて容易に半田付け
ができ、かつ従来のような接触又は粒間腐食の問
題がない。 Conventionally, there is a method of bonding aluminum and copper using solder for aluminum. This solder is
In order to avoid intergranular corrosion between A and Pb, Cd-Zn or Sn-Zn solder is used, which does not contain Pb. Otherwise, there is a problem of poor adhesion. Therefore, if you try to solder directly to an aluminum core, for example, it will be difficult as mentioned above, but in the present invention, as mentioned above, for example, since soldering is performed between copper and copper,
Soldering is extremely easy using Sn--Pb solder, and there is no problem of contact or intergranular corrosion as in the prior art.
実施例 １：
ポリイミドフイルム（厚さ25μm）上にウレタ
ン系耐熱接着剤（厚さ30μm）を介して銅箔（厚
さ35μm）を施したものから導体回路を形成し、
その回路上にソルダーレジストインキの絶縁を施
したフレキシブル印刷配線板を作成し、その裏面
にエポキシ系耐熱接着剤（厚さ30μm）を施し、
その上にゴミ、ホコリよけのポリエステル又はポ
リプロピレンフイルムのセパレーターを施したも
のの、上記フレキシブル印刷配線板の2.5mmの
ランドの中心に1.8mmの該配線板を貫通する孔
を開けた。Example 1: A conductor circuit was formed from a polyimide film (thickness 25 μm) coated with copper foil (thickness 35 μm) via urethane heat-resistant adhesive (thickness 30 μm).
A flexible printed wiring board was created with insulation using solder resist ink on the circuit, and an epoxy heat-resistant adhesive (thickness: 30 μm) was applied to the back side.
A separator made of polyester or polypropylene film to prevent dirt and dust was applied thereon, and a 1.8 mm hole was made at the center of the 2.5 mm land of the flexible printed wiring board to penetrate the wiring board.
別にアルミニウム（厚さ0.8mm）上に耐熱接着
剤（厚さ30μm）を介して銅箔（厚さ35μm）を施
した金属芯を作成し、この上に上記フレキシブル
印刷配線板を重ね合せ、加熱加圧下で接着した
後、上記1.8mmの貫通孔の中心部に、1.2mmの
上記金属芯を貫通するガス抜き孔を開けた。 Separately, a metal core was prepared by applying copper foil (thickness: 35μm) to aluminum (thickness: 0.8mm) via heat-resistant adhesive (thickness: 30μm), and the above flexible printed circuit board was placed on top of this and heated. After bonding under pressure, a gas vent hole was made in the center of the 1.8 mm through hole to penetrate the 1.2 mm metal core.
しかる後、この上を６，４半田（Pb60％，
Sn40％）のフローソルダー槽内を通し、半田付
けを施した結果、導体回路と金属芯の銅箔との間
に半田付けによる健全な電気的接続が得られた。 After that, apply 6.4 solder (Pb60%,
As a result of soldering through a flow solder bath containing Sn40%), a sound electrical connection was obtained between the conductor circuit and the copper foil of the metal core by soldering.
実施例 ２：
実施例１と同様に作成したフレキシブル印刷配
線板の裏面に実施例１と同様に耐熱接着剤を施
し、セパレーターを施したものの、フレキシブル
印刷配線板の2.0mmのランドの中心に1.4mmの
該配線板を貫通する孔を開けた。Example 2: A heat-resistant adhesive was applied to the back side of a flexible printed wiring board prepared in the same manner as in Example 1, and a separator was applied in the same manner as in Example 1. A hole of mm was drilled through the wiring board.
別にアルミニウム（厚さ0.5mm）上に耐熱接着
剤（厚さ30μm）を介して銅箔（厚さ35μm）を施
した金属芯を作成し、この上に上記フレキシブル
印刷配線板を重ね合せ、加熱加圧下で接着した
後、上記1.4mmの貫通孔の中心部に、0.8mmの
上記金属芯を貫通するガス抜き孔を開けた。 Separately, a metal core was created by applying copper foil (thickness: 35 μm) on aluminum (thickness: 0.5 mm) via heat-resistant adhesive (thickness: 30 μm), and the above flexible printed wiring board was placed on top of this and heated. After bonding under pressure, a 0.8 mm gas vent hole was made in the center of the 1.4 mm through hole, passing through the metal core.
しかる後、この上を６，４半田のフローソルダ
ー槽内を通し、半田付けを施した結果、導体回路
と金属芯の銅箔との間に半田付けによる健全な電
気的接続が得られた。 以上述べたように、本発
明は、金属芯印刷配線板において、前記金属芯は
芯用金属上に半田付け性の良い金属を貼り合せて
成り、前記導体回路と前記金属芯を接続すべき個
所に、前記導体回路と前記絶縁層を貫通する貫通
孔、および前記金属芯を貫通するガス抜き孔を設
けて成るため、前記貫通孔により導体回路（例、
銅）と金属芯の半田付け性の良い金属（例、銅）
との接続は半田付けの良い金属（同志）となり、
Sn−Pb系半田による半田付けがきわめて容易で
あり、又前記ガス抜き孔により、半田付け不良の
原因となる半田フラツクスや発生ガスを排除する
ので、半田付けによる健全な電気的接続が得られ
る効果がある。 Thereafter, this was passed through a flow solder tank containing 6,4 solder and soldered. As a result, a sound electrical connection was obtained between the conductive circuit and the copper foil of the metal core by soldering. As described above, the present invention provides a metal core printed wiring board in which the metal core is formed by laminating a metal with good solderability on a core metal, and where the conductor circuit and the metal core are to be connected. is provided with a through hole penetrating the conductor circuit and the insulating layer, and a gas vent hole penetrating the metal core.
Copper) and metals with good solderability (e.g. copper) and metal cores
The connection will be a metal (comrade) with good soldering,
Soldering with Sn-Pb-based solder is extremely easy, and the gas vent holes eliminate solder flux and generated gas that can cause soldering defects, resulting in a sound electrical connection by soldering. There is.
又本発明は、芯として、上述のように、例えば
アルミニウムのような芯用金属を用いるため、金
属芯のヒートシンク性の保持、軽量化が計れると
共に、プラスチツクス芯に比べ、加工性、機械的
強度にすぐれる利点がある。 Furthermore, as mentioned above, the present invention uses a core metal such as aluminum as the core, so the heat sink properties of the metal core can be maintained and the weight can be reduced, and the processability and mechanical strength are improved compared to plastic cores. It has the advantage of being strong.
又本発明は、導体回路と金属芯の半田付け性の
良い金属を直接広い面で半田付けできるもので、
例えばパワーハイブリツドICなどの通電容量の
大きな場合でも、安定した電気的接続が得られる
利点がある。 In addition, the present invention allows the conductor circuit and the metal core with good solderability to be directly soldered on a wide surface.
For example, it has the advantage of providing stable electrical connection even when the current carrying capacity is large, such as in a power hybrid IC.
第１図は本発明の金属芯印刷配線板の実施例を
示す平面図で、第２図は第１図に示すＡ−A′断
面を示す図である。
１……金属芯、２……芯用金属、３，５……絶
縁層（絶縁フイルム）、４……半田付け性の良い
金属、６……導体箔、７……絶縁フイルム、８…
…ランド、９……貫通孔、１０……ガス抜き孔。
FIG. 1 is a plan view showing an embodiment of the metal core printed wiring board of the present invention, and FIG. 2 is a cross-sectional view taken along the line A-A' shown in FIG. DESCRIPTION OF SYMBOLS 1... Metal core, 2... Metal for core, 3, 5... Insulating layer (insulating film), 4... Metal with good solderability, 6... Conductor foil, 7... Insulating film, 8...
... land, 9 ... through hole, 10 ... gas vent hole.
Claims (1)
た金属芯印刷配線板において、前記金属芯は芯用
金属上に半田付け性の良い金属を貼り合せて成
り、前記導体回路と前記金属芯を接続すべき個所
に、前記導体回路と前記絶縁層を貫通する貫通
孔、および前記金属芯を貫通するガス抜き孔を設
けて成ることを特徴とする金属芯印刷配線板。 ２ 芯用金属がアルミニウムであり、半田付け性
の良い金属が銅である特許請求の範囲第(1)項記載
の金属芯印刷配線板。 ３ ガス抜き孔が直径0.5mm以上である特許請求
の範囲第１項又は第２項記載の金属芯印刷配線
板。[Claims] 1. In a metal core printed wiring board in which a conductor circuit is provided on a metal core via an insulating layer, the metal core is formed by laminating a metal with good solderability on a core metal, A metal core printed wiring characterized in that a through hole penetrating the conductor circuit and the insulating layer and a gas vent hole penetrating the metal core are provided at a location where the conductor circuit and the metal core are to be connected. Board. 2. The metal core printed wiring board according to claim (1), wherein the core metal is aluminum and the metal with good solderability is copper. 3. The metal core printed wiring board according to claim 1 or 2, wherein the gas vent hole has a diameter of 0.5 mm or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243782A JPS58128785A (en) | 1982-01-27 | 1982-01-27 | Metal core printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1243782A JPS58128785A (en) | 1982-01-27 | 1982-01-27 | Metal core printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS58128785A JPS58128785A (en) | 1983-08-01 |
| JPH0315357B2 true JPH0315357B2 (en) | 1991-02-28 |
Family
ID=11805269
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1243782A Granted JPS58128785A (en) | 1982-01-27 | 1982-01-27 | Metal core printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58128785A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61166560U (en) * | 1985-04-01 | 1986-10-16 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717170B2 (en) * | 1976-12-23 | 1982-04-09 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717170U (en) * | 1980-06-30 | 1982-01-28 |
-
1982
- 1982-01-27 JP JP1243782A patent/JPS58128785A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5717170B2 (en) * | 1976-12-23 | 1982-04-09 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS58128785A (en) | 1983-08-01 |
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