JPH03151658A - Cooling sheet - Google Patents
Cooling sheetInfo
- Publication number
- JPH03151658A JPH03151658A JP29083789A JP29083789A JPH03151658A JP H03151658 A JPH03151658 A JP H03151658A JP 29083789 A JP29083789 A JP 29083789A JP 29083789 A JP29083789 A JP 29083789A JP H03151658 A JPH03151658 A JP H03151658A
- Authority
- JP
- Japan
- Prior art keywords
- sheet
- heat
- conductive filler
- heat dissipation
- thermally conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001816 cooling Methods 0.000 title abstract 3
- 239000011231 conductive filler Substances 0.000 claims abstract description 31
- 239000011159 matrix material Substances 0.000 claims abstract description 14
- 239000011347 resin Substances 0.000 claims abstract description 14
- 229920005989 resin Polymers 0.000 claims abstract description 14
- 229910052582 BN Inorganic materials 0.000 claims abstract description 12
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims abstract description 12
- 230000017525 heat dissipation Effects 0.000 claims description 34
- 229920002379 silicone rubber Polymers 0.000 abstract description 8
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 2
- 229920006124 polyolefin elastomer Polymers 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract 1
- 229910052782 aluminium Inorganic materials 0.000 abstract 1
- 238000005121 nitriding Methods 0.000 abstract 1
- 230000000644 propagated effect Effects 0.000 abstract 1
- 238000000034 method Methods 0.000 description 10
- 239000002994 raw material Substances 0.000 description 7
- 239000004945 silicone rubber Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 229920001971 elastomer Polymers 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 239000012778 molding material Substances 0.000 description 5
- 238000003825 pressing Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 238000007606 doctor blade method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004073 vulcanization Methods 0.000 description 2
- 239000006057 Non-nutritive feed additive Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、トランジスター、コンデンサー等の電子・
電気部品に用いられる放熱シートに関するものである。[Detailed Description of the Invention] [Field of Industrial Application] This invention is applicable to electronic devices such as transistors and capacitors.
This invention relates to heat dissipation sheets used for electrical parts.
従来から、使用時にトランジスター、コンデンサー等の
電子・電気部品から生じる熱が原因で、上記電子・電気
部品の寿命が短くなることから、この対策として熱伝導
性および密着性に優れた放熱シートを上記電子・電気部
品に接着し、さらに上記放熱シートの他面に放熱フィン
を取り付け、放熱シートを介して熱を放熱フィンへ伝え
放熱するという方法が採用されている。上記放熱シート
は、通常、シリコーンゴムと、熱伝導性フィラーとを用
いてシート状に形成することにより得られる。上記熱伝
導性フィラーとしては、窒化ボロン等の粒子状、板状、
針状等の形状を有するものが用いられる。そして、上記
放熱シートは、通常、上記原料を用いて例えば下記の３
通りの方法により作製される。第１の方法は、シリコー
ンゴムと熱伝導性フィラーの窒化ボロンとを配合、混合
して通常のゴム材料と同様にロール、カレンダー。Traditionally, heat generated from electronic and electrical components such as transistors and capacitors during use has shortened the lifespan of these electronic and electrical components. A method has been adopted in which the heat dissipation sheet is adhered to electronic/electrical components, and a heat dissipation fin is attached to the other surface of the heat dissipation sheet, and heat is transferred to the heat dissipation fin through the heat dissipation sheet to radiate the heat. The above-mentioned heat dissipation sheet is usually obtained by forming a sheet using silicone rubber and a thermally conductive filler. The above-mentioned thermally conductive filler may be in the form of particles such as boron nitride, plate-like,
Those having a needle-like shape or the like are used. The above-mentioned heat dissipation sheet is usually made using the above-mentioned raw materials, for example, the following three materials.
It is made by the following method. The first method is to blend and mix silicone rubber and thermally conductive filler boron nitride, and then roll and calender the mixture in the same way as ordinary rubber materials.
押出機等によりシート状に成形しプレスして加硫すると
いう方法である。第２の方法は、上記原料を混合し溶剤
に希釈した後、ドクターブレード法に従ってシート状に
形成し乾燥してプレスして加硫するという方法である。This method involves forming the material into a sheet using an extruder or the like, pressing it, and vulcanizing it. The second method is to mix the above raw materials, dilute them in a solvent, form them into a sheet according to the doctor blade method, dry them, press them and vulcanize them.
第３の方法は、上記シリコーンゴム１００重量部（以下
「部」と略す）に対して熱伝導性フィラーが２００部以
上配合されているという熱伝導性フィラー高充填配合物
を用いる製法であって、上記原料をニーグー等の密閉式
混練機に掛は混合して粉末状ゴム材料に形成し、これを
所定のシート成形用金型に一定量充填しプレスして加硫
するという方法である。The third method is a manufacturing method using a highly-filled mixture of thermally conductive fillers, in which 200 parts or more of thermally conductive fillers are blended with 100 parts by weight (hereinafter referred to as "parts") of the silicone rubber. In this method, the above raw materials are mixed in an internal kneading machine such as a Ni-Goo to form a powdered rubber material, and a certain amount of this is filled into a predetermined sheet molding die, pressed, and vulcanized.
しかしながら、上記各製法により作製された放熱シート
は厚み方向の放熱性があまり良くない。However, the heat dissipation sheets produced by each of the above manufacturing methods do not have very good heat dissipation properties in the thickness direction.
本発明者らは、その原因について研究を重ねた結果、つ
ぎのような結論を見出した。すなわち、上記放熱シート
では、いずれも、配合原料の熱伝導性フィラーが、第７
図に示すように、得られる放熱シー）１ａの長手方向に
それ自体の長袖を合わせた状態で配向している。そして
、このように熱伝導性フィラー３ａが配向すると、熱伝
導性フィラー３ａが相互に接触して、いわば放熱シート
１ａの長手方向に連続したかのような状態となり、放熱
シー）１ａの長手方向に熱が伝達されやすく、逆に厚み
方向（矢印Ｆ方向）には熱が伝達し難くなる。その結果
１．上記放熱シー）１ａを電子・電気部品に接着して用
いても、発生した熱が放熱シートｌａを介して放熱フィ
ンまで効果的に伝達されず電子・電気部品の短命化が促
進されるようになる。As a result of repeated research into the cause, the present inventors found the following conclusion. That is, in all of the above heat dissipation sheets, the thermally conductive filler of the blended raw materials is the seventh
As shown in the figure, the obtained heat dissipation sheet 1a is oriented in the longitudinal direction with its own long sleeve. When the thermally conductive fillers 3a are oriented in this way, the thermally conductive fillers 3a come into contact with each other and become in a state as if they were continuous in the longitudinal direction of the heat dissipation sheet 1a, so that the heat dissipation sheet 1a Heat is easily transferred in the thickness direction (direction of arrow F), and conversely, heat is difficult to be transferred in the thickness direction (direction of arrow F). The result 1. Even if the above heat dissipation sheet 1a is used by adhering it to electronic/electrical components, the generated heat will not be effectively transferred to the heat dissipation fins via the heat dissipation sheet la, which will promote the shortening of the lifespan of the electronic/electrical components. Become.
この発明は、このような事情に鑑みなされたもので、熱
伝導性に優れた放熱シートの提供をその目的とする。The present invention was made in view of the above circumstances, and an object of the present invention is to provide a heat dissipation sheet with excellent thermal conductivity.
上記の目的を達成するため、この発明の放熱シートは、
マトリックス樹脂中に熱伝導性フィラーが分布している
放熱シートであって、上記熱伝導性フィラーが厚み方向
に直立状態で配向しているという構成をとる。In order to achieve the above object, the heat dissipation sheet of this invention
This is a heat dissipation sheet in which a thermally conductive filler is distributed in a matrix resin, and the thermally conductive filler is oriented in an upright state in the thickness direction.
すなわち、この発明の放熱シートは、マトリックス樹脂
中に分布された熱伝導性フィラーが、シートの厚み方向
に直立状態で配向しているため、熱伝導がシートの厚み
方向に効果的に伝導される。したがって、この発明の放
熱シートを電子・電気部品に用いると発生する熱が放出
され、上記部品の長寿命化が図られる。That is, in the heat dissipation sheet of the present invention, the thermally conductive filler distributed in the matrix resin is oriented in an upright manner in the thickness direction of the sheet, so that heat is effectively conducted in the thickness direction of the sheet. . Therefore, when the heat dissipation sheet of the present invention is used for electronic/electrical parts, the generated heat is released, and the life of the said parts can be extended.
つぎに、この発明の詳細な説明する。Next, this invention will be explained in detail.
この発明の放熱シートは、マトリックス樹脂と、熱伝導
性フィラーとを用いてシート状に成形することにより得
られる。The heat dissipation sheet of the present invention is obtained by molding a matrix resin and a thermally conductive filler into a sheet shape.
上記マトリックス樹脂としては、シリコーンゴム、ポリ
オレフィン系エラストマー等があげられる。Examples of the matrix resin include silicone rubber and polyolefin elastomer.
上記熱伝導性フィラーとしては、窒化ボロン。The thermally conductive filler mentioned above is boron nitride.
窒化アルミニウム、アルミナ等があげられ、なかでも、
第６図に示すような、結晶形状が六方晶形の上記窒化ボ
ロン１２を用いるのが好ましい。上記窒化ボロン１２と
しては、その厚みｂと長袖長さａの比がａ ／ ｂ ＝
２０〜１００のものを用いるのが好適である。そして
、上記のような結晶形状を有する窒、化ボロン１２では
、熱は長軸ａ方向に伝達されやすい。Aluminum nitride, alumina, etc. are mentioned, among which,
It is preferable to use the boron nitride 12 having a hexagonal crystal shape as shown in FIG. As for the boron nitride 12, the ratio of its thickness b to long sleeve length a is a/b=
It is suitable to use 20 to 100. In the boron nitride 12 having the above-mentioned crystal shape, heat is easily transmitted in the direction of the long axis a.
上記マトリックス樹脂と熱伝導性フィラーの配合割合は
、通常、マトリックス樹脂１００部に対して熱伝導性フ
ィラーを１００〜５００部の割合範囲に設定するのが好
適である。The mixing ratio of the matrix resin and the thermally conductive filler is usually preferably set in a range of 100 to 500 parts of the thermally conductive filler to 100 parts of the matrix resin.
また、この発明の放熱シートの成形材料には、上記マト
リックス樹脂および熱伝導性フィラー以外に、必要に応
じて硬化剤、加工助剤等その他の添加剤を適宜配合する
ことができる。Further, in addition to the matrix resin and the thermally conductive filler, other additives such as a curing agent and a processing aid may be appropriately blended into the molding material of the heat dissipating sheet of the present invention, as required.
この発明の放熱シートは、例えば下記の２つの方法によ
り製造することができる。第１の方法は、まず、上記各
成分原料を配合し混練して混練物を作製し、この混線物
を押出機に投入し、第２図に示すように、矢印Ｂ方向に
押出する。そして、押し出されたシート成形用弾性体１
１を所定厚みｄの一点鎖線Ｘに沿ってスライスし、この
スライスされたシート成形用金型体１１を厚みｄ方向に
プレスして加硫する方法である。The heat dissipation sheet of the present invention can be manufactured, for example, by the following two methods. In the first method, first, the above-mentioned raw materials are mixed and kneaded to prepare a kneaded material, and this mixed material is put into an extruder and extruded in the direction of arrow B as shown in FIG. Then, the extruded sheet-forming elastic body 1
1 is sliced along the dashed line X with a predetermined thickness d, and the sliced sheet mold body 11 is pressed in the direction of the thickness d and vulcanized.
第２の方法は、上記各成分原料の配合割合においてマト
リックス樹脂１００部に対して熱伝導性フィラーが２０
０部以上配合されているという熱伝導性フィラー高充填
配合物を用いる場合の製造方法である。すなわち、上記
各成分原料を配合してニーグー等の混練機に掛けて混練
することにより熱伝導性フィラー外周にマトリックス樹
脂がコーティングされた状態の粉末ゴム状成形材料を作
製する。つぎに、第３図に示すような、所定厚みもの予
備金型４，５に上記粉末ゴム状成形材料７を投入（斜線
部分）し、常温下で圧縮用型６で矢印Ｃ方向に圧縮する
ことによりシート状に予備成形する。上記圧縮により熱
伝導性フィラーがシート厚みｔ方向に配向される。そし
て、予備成形されたシートを上記予備金型４，５から取
り出し、第４図に示すような加硫用金型８．９に載置し
て圧縮用型１０により矢印り方向に予備成形シート１１
をプレス、加硫することにより製造することができる。In the second method, 20 parts of the thermally conductive filler is added to 100 parts of the matrix resin in the blending ratio of the above-mentioned raw materials.
This is a manufacturing method when using a highly-filled blend of thermally conductive filler, in which 0 parts or more of the heat conductive filler is blended. That is, the above-mentioned raw materials for each component are blended and kneaded using a kneader such as a Ni-Goo to prepare a powdered rubber-like molding material in which the outer periphery of the thermally conductive filler is coated with a matrix resin. Next, the powdered rubber-like molding material 7 is put into preliminary molds 4 and 5 of a predetermined thickness as shown in FIG. By this, it is preformed into a sheet shape. The compression causes the thermally conductive filler to be oriented in the direction of the sheet thickness t. Then, the preformed sheet is taken out from the preliminary molds 4 and 5, placed on a vulcanization mold 8.9 as shown in FIG. 11
It can be manufactured by pressing and vulcanizing.
このようにして得られる放熱シート１は、第１図に示す
ように、マトリックス樹脂２中に配合された熱伝導性フ
ィラー３がシートの厚み方向に直立状態で配向されてい
るため、矢印Ａ方向の熱伝導性に優れている。As shown in FIG. 1, the heat dissipating sheet 1 obtained in this manner has the thermally conductive filler 3 blended in the matrix resin 2 oriented in an upright state in the thickness direction of the sheet, so that has excellent thermal conductivity.
以上のように、この発明の放熱シートは、熱伝導性フィ
ラーがシートの厚み方向に直立状態で配向されているた
め、シートの厚み方向の熱伝導性に優れている。したが
って、この発明の放熱シートの片面を電子・電気部品に
接着して用いると、上記電子・電気部品から発生した熱
がこの放熱シートを通過し、他面に設けられた放熱フィ
ンから効果的に放出される。このため、このような電子
・電気部品を用いた製品の長寿命化が実現される。As described above, the heat dissipation sheet of the present invention has excellent thermal conductivity in the thickness direction of the sheet because the thermally conductive filler is oriented in an upright state in the thickness direction of the sheet. Therefore, when one side of the heat dissipation sheet of the present invention is used by adhering it to an electronic or electrical component, the heat generated from the electronic or electrical component passes through this heat dissipation sheet and is effectively emitted from the heat dissipation fin provided on the other surface. released. Therefore, the lifespan of products using such electronic/electrical components can be extended.
つぎに、実施例について比較例と併せて説明する。Next, examples will be described together with comparative examples.
〔実施例１〕
シリコーンゴム１００部と窒化ボロン１５０部および硬
化剤１部を配合し混練してシート成形材料を作製した。[Example 1] 100 parts of silicone rubber, 150 parts of boron nitride, and 1 part of a hardening agent were mixed and kneaded to prepare a sheet molding material.
そして、第５図に示すように、上記シート成形材料を押
出機に投入し矢印Ｅ方向に押し出すことにより縦断面長
方形のシート成形用弾性体１３を得た。つぎに、押し出
されたシート成形用弾性体１３を一点鎖線Ｙに沿って厚
みｅ ０゜５ｍｍにスライスした。この厚みｅ Ｏ，５
ｎｕｎのスライスされた弾性体を厚みｅ方向に圧力１５
０ ｋｇ／ｃｄｔ（ゲージ圧）でプレスして加硫（条件
：１７０°Ｃ×１５分）することにより目的とする放熱
シートを得た。Then, as shown in FIG. 5, the sheet-molding material was put into an extruder and extruded in the direction of arrow E to obtain an elastic body 13 for sheet-molding having a rectangular longitudinal section. Next, the extruded sheet-forming elastic body 13 was sliced along the dashed line Y to a thickness e of 0.5 mm. This thickness e O, 5
Apply pressure 15 to the sliced elastic body of nun in the thickness e direction.
The desired heat dissipation sheet was obtained by pressing and vulcanizing at 0 kg/cdt (gauge pressure) (conditions: 170°C x 15 minutes).
〔実施例２〕
シリコーンゴム１００部と窒化ボロン３００部を配合し
ニーダ−で混練して窒化ボロン外表面にゴム成分がコー
ティングされた状態の粉末状ゴムを作製した。つぎに、
第３図に示すような、厚みｔ ０．５ ｍｍの予備金型
４．５に上記粉末状ゴム成分７を投入し、常温下、圧縮
型６で矢印Ｃ方向に予備圧縮することにより予備成形し
た。そして、予備成形されたシートを上記予備金型４．
５から取り出し、第４図に示すような加硫用金型８，９
に載置して矢印り方向に圧力１５０ｋｇ／ＣＴＭ（ゲー
ジ圧）でプレスし加硫（条件：１７０°Ｃ×１５分）す
ることにより目的とする放熱シートを得た。[Example 2] 100 parts of silicone rubber and 300 parts of boron nitride were mixed and kneaded in a kneader to produce a powdered rubber in which the outer surface of boron nitride was coated with a rubber component. next,
The powdered rubber component 7 is put into a preliminary mold 4.5 having a thickness of t 0.5 mm as shown in FIG. did. Then, the preformed sheet is placed in the preliminary mold 4.
Vulcanization molds 8 and 9 as shown in FIG.
The target heat dissipating sheet was obtained by pressing in the direction of the arrow at a pressure of 150 kg/CTM (gauge pressure) and vulcanizing (conditions: 170°C x 15 minutes).
〔比較例１〕
実施例１と同様にして縦断面長方形のシート成形用弾性
体１３を得た。つぎに、押し出されたシート成形用弾性
体１３を、第５図に示すように、押し出し方向に平行（
実施例１のスライス方向に対して垂直）に二点鎖線Ｚに
沿って厚みｆ Ｏ，５ｍｍにスライスした。この厚みｆ
ｏ、５ｍｍのスライスされた弾性体を厚みｆ方向に圧力
１５０ ｋｇ／ｃ＋ｆｌ （ゲージ圧）でプレスして加
硫（条件：１７０°ｃ×１５分）することにより放熱シ
ートを得た。このようにして得られた放熱シートは、第
７図に示すように、熱伝導性フィラーが長手方向に沿っ
て配向されたものであった。[Comparative Example 1] In the same manner as in Example 1, an elastic body 13 for sheet molding having a rectangular longitudinal section was obtained. Next, as shown in FIG. 5, the extruded sheet-forming elastic body 13 is
The sample was sliced to a thickness of 5 mm (perpendicular to the slicing direction in Example 1) along the two-dot chain line Z. This thickness f
A heat dissipation sheet was obtained by pressing and vulcanizing (conditions: 170°C x 15 minutes) a sliced elastic body of 5 mm in thickness f direction at a pressure of 150 kg/c+fl (gauge pressure). The thus obtained heat dissipation sheet had a thermally conductive filler oriented along the longitudinal direction, as shown in FIG.
〔比較例２〕
シリコーンゴム１００部と、窒化ホウ素１５０部を用い
て配合、混合し、これを溶剤（飢−ヘキサン）にて２２
５重量％に希釈した後、ドクターブレード法によりシー
ト状に形成乾燥して加硫することにより放熱シートを得
た。[Comparative Example 2] 100 parts of silicone rubber and 150 parts of boron nitride were blended and mixed, and this was mixed with a solvent (starved hexane) for 22 hours.
After diluting to 5% by weight, the mixture was formed into a sheet by a doctor blade method, dried and vulcanized to obtain a heat dissipation sheet.
以上のようにして得られた実施例品および比較例品のそ
れぞれの厚み方向の熱伝導率および熱抵抗を測定し熱伝
導性を評価した。その結果を下記の表に示した。The thermal conductivity and thermal resistance in the thickness direction of each of the example products and comparative example products obtained as described above were measured to evaluate the thermal conductivity. The results are shown in the table below.
（余 白 ） ０ 熱伝導性フィラー(Left white) 0 thermally conductive filler
Claims (2)
ている放熱シートであつて、上記熱伝導性フィラーが厚
み方向に直立状態で配向していることを特徴とする放熱
シート。(1) A heat dissipation sheet in which a thermally conductive filler is distributed in a matrix resin, the heat dissipating sheet being characterized in that the thermally conductive filler is oriented in an upright manner in the thickness direction.
）記載の放熱シート。(2) Claim (1) wherein the thermally conductive filler is boron nitride
) The heat dissipation sheet described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290837A JPH0638460B2 (en) | 1989-11-08 | 1989-11-08 | Heat dissipation sheet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1290837A JPH0638460B2 (en) | 1989-11-08 | 1989-11-08 | Heat dissipation sheet |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03151658A true JPH03151658A (en) | 1991-06-27 |
| JPH0638460B2 JPH0638460B2 (en) | 1994-05-18 |
Family
ID=17761131
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1290837A Expired - Lifetime JPH0638460B2 (en) | 1989-11-08 | 1989-11-08 | Heat dissipation sheet |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0638460B2 (en) |
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140538A (en) * | 1992-10-28 | 1994-05-20 | Nec Corp | Quad-flat-package type ic |
| WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
| JPH0883990A (en) * | 1994-09-09 | 1996-03-26 | Shinano Polymer Kk | Thermal conduction element and heat-dissipating structure using it |
| JPH1126661A (en) * | 1997-07-01 | 1999-01-29 | Denki Kagaku Kogyo Kk | Radiation spacer |
| JP2000294698A (en) * | 1999-04-02 | 2000-10-20 | Denki Kagaku Kogyo Kk | Heat conductive spacer |
| JP2000344919A (en) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | Production of thermo-conductive silicone molding product |
| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| EP1109218A2 (en) * | 1999-12-17 | 2001-06-20 | Polymatech Co., Ltd. | Heat conducting mold and manufacturing method thereof |
| US6649012B2 (en) * | 1999-12-17 | 2003-11-18 | Polymatech Co., Ltd. | Adhesion method and electronic component |
| EP1184899A3 (en) * | 2000-08-31 | 2004-04-07 | Polymatech Co., Ltd. | Heat conductive adhesive film and manufacturing method thereof and electronic component |
| US6831031B2 (en) | 2001-08-17 | 2004-12-14 | Polymatech Co., Ltd. | Thermally conductive sheet |
| US7018701B2 (en) * | 2002-06-06 | 2006-03-28 | Fuji Polymer Industries Co., Ltd. | Thermally conductive sheet and method for manufacturing the same |
| WO2008085999A1 (en) * | 2007-01-10 | 2008-07-17 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
| JP2015122499A (en) * | 2013-12-23 | 2015-07-02 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Oriented flexible heat-conducting material, forming process and application thereof |
| WO2017065113A1 (en) * | 2015-10-13 | 2017-04-20 | リンテック株式会社 | Semiconductor device and composite sheet |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006332305A (en) * | 2005-05-26 | 2006-12-07 | Matsushita Electric Ind Co Ltd | Method of manufacturing thermal conductive sheet |
| JP5184543B2 (en) | 2007-09-26 | 2013-04-17 | 三菱電機株式会社 | Thermally conductive sheet and power module |
| JP2012040811A (en) * | 2010-08-20 | 2012-03-01 | Techno Polymer Co Ltd | Orientation direction control method of anisotropic filler, molding, and its manufacturing method |
| US11742258B2 (en) | 2020-05-15 | 2023-08-29 | Dexerials Corporation | Thermally conductive sheet and method for manufacturing thermally conductive sheet |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742921A (en) * | 1980-08-27 | 1982-03-10 | Teijin Ltd | Spinning method of polyester fiber |
| JPS62154410A (en) * | 1985-12-25 | 1987-07-09 | 信越化学工業株式会社 | Heat conductive insulating sheet |
| JPS62240538A (en) * | 1986-04-11 | 1987-10-21 | 株式会社 ユニツクス | Heat-dissipating and endothermic material and manufacture thereof |
| JPH0572755A (en) * | 1991-09-12 | 1993-03-26 | Fuji Photo Film Co Ltd | Electrophotographic sensitive body |
-
1989
- 1989-11-08 JP JP1290837A patent/JPH0638460B2/en not_active Expired - Lifetime
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5742921A (en) * | 1980-08-27 | 1982-03-10 | Teijin Ltd | Spinning method of polyester fiber |
| JPS62154410A (en) * | 1985-12-25 | 1987-07-09 | 信越化学工業株式会社 | Heat conductive insulating sheet |
| JPS62240538A (en) * | 1986-04-11 | 1987-10-21 | 株式会社 ユニツクス | Heat-dissipating and endothermic material and manufacture thereof |
| JPH0572755A (en) * | 1991-09-12 | 1993-03-26 | Fuji Photo Film Co Ltd | Electrophotographic sensitive body |
Cited By (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06140538A (en) * | 1992-10-28 | 1994-05-20 | Nec Corp | Quad-flat-package type ic |
| WO1995002313A1 (en) | 1993-07-06 | 1995-01-19 | Kabushiki Kaisha Toshiba | Heat dissipating sheet |
| US5660917A (en) * | 1993-07-06 | 1997-08-26 | Kabushiki Kaisha Toshiba | Thermal conductivity sheet |
| JPH0883990A (en) * | 1994-09-09 | 1996-03-26 | Shinano Polymer Kk | Thermal conduction element and heat-dissipating structure using it |
| JPH1126661A (en) * | 1997-07-01 | 1999-01-29 | Denki Kagaku Kogyo Kk | Radiation spacer |
| JP2000294698A (en) * | 1999-04-02 | 2000-10-20 | Denki Kagaku Kogyo Kk | Heat conductive spacer |
| JP2000344919A (en) * | 1999-06-02 | 2000-12-12 | Denki Kagaku Kogyo Kk | Production of thermo-conductive silicone molding product |
| JP4545247B2 (en) * | 1999-06-02 | 2010-09-15 | 電気化学工業株式会社 | Method for producing thermally conductive silicone molded body |
| JP2000355654A (en) * | 1999-06-15 | 2000-12-26 | Denki Kagaku Kogyo Kk | Heat-conductive silicone molding and its use |
| EP1109218A3 (en) * | 1999-12-17 | 2003-04-02 | Polymatech Co., Ltd. | Heat conducting mold and manufacturing method thereof |
| JP2001172398A (en) * | 1999-12-17 | 2001-06-26 | Polymatech Co Ltd | Thermal conduction molded product and its production method |
| US6649012B2 (en) * | 1999-12-17 | 2003-11-18 | Polymatech Co., Ltd. | Adhesion method and electronic component |
| EP1109218A2 (en) * | 1999-12-17 | 2001-06-20 | Polymatech Co., Ltd. | Heat conducting mold and manufacturing method thereof |
| EP1184899A3 (en) * | 2000-08-31 | 2004-04-07 | Polymatech Co., Ltd. | Heat conductive adhesive film and manufacturing method thereof and electronic component |
| US6831031B2 (en) | 2001-08-17 | 2004-12-14 | Polymatech Co., Ltd. | Thermally conductive sheet |
| US7018701B2 (en) * | 2002-06-06 | 2006-03-28 | Fuji Polymer Industries Co., Ltd. | Thermally conductive sheet and method for manufacturing the same |
| JP2010515807A (en) * | 2007-01-10 | 2010-05-13 | モメンティブ パフォーマンス マテリアルズ インコーポレイテッド | Thermal interface material and manufacturing method thereof |
| WO2008085999A1 (en) * | 2007-01-10 | 2008-07-17 | Momentive Performance Materials Inc. | Thermal interface materials and methods for making thereof |
| JP2015122499A (en) * | 2013-12-23 | 2015-07-02 | 華為技術有限公司Ｈｕａｗｅｉ Ｔｅｃｈｎｏｌｏｇｉｅｓ Ｃｏ．，Ｌｔｄ． | Oriented flexible heat-conducting material, forming process and application thereof |
| WO2017065113A1 (en) * | 2015-10-13 | 2017-04-20 | リンテック株式会社 | Semiconductor device and composite sheet |
| JP2017076656A (en) * | 2015-10-13 | 2017-04-20 | リンテック株式会社 | Semiconductor device and composite sheet |
| CN108235784A (en) * | 2015-10-13 | 2018-06-29 | 琳得科株式会社 | Semiconductor device and composite sheet |
| CN108235784B (en) * | 2015-10-13 | 2021-05-25 | 琳得科株式会社 | Semiconductor device and composite sheet |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0638460B2 (en) | 1994-05-18 |
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