JPH03147355A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH03147355A JPH03147355A JP28310789A JP28310789A JPH03147355A JP H03147355 A JPH03147355 A JP H03147355A JP 28310789 A JP28310789 A JP 28310789A JP 28310789 A JP28310789 A JP 28310789A JP H03147355 A JPH03147355 A JP H03147355A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- lead frame
- frame
- center
- wire bonding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000004065 semiconductor Substances 0.000 title claims description 6
- 230000017525 heat dissipation Effects 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 15
- 230000001788 irregular Effects 0.000 claims description 11
- 238000005520 cutting process Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 238000002788 crimping Methods 0.000 claims 2
- 239000000725 suspension Substances 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000009751 slip forming Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、放熱板を備えた半導体装置の製造方法に関し
、特にリードフレームに放熱板を接続したものを用いる
場合の両者の接続方法の改良に関するものである。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a method for manufacturing a semiconductor device equipped with a heat sink, and in particular to an improvement in the method of connecting the two when using a lead frame with a heat sink connected to the lead frame. It is related to.
（従来の技術）
従来、放熱板を有する半導体装置においては、その製造
過程において、例えば第１０図に示すようにリードフレ
ーム１の連結部２から延出した細長い吊りピン３の先端
に、アイランドを兼ねた放熱板４をカシメ接続している
。この吊りピン３は、放熱板４上に回路チップＣを搭載
して樹脂封止を行なった後に行なわれるアウターリード
５の切断過程において、アウターリード５と共に切断さ
れる。(Prior Art) Conventionally, in the manufacturing process of a semiconductor device having a heat sink, an island is formed at the tip of a long and thin hanging pin 3 extending from a connecting portion 2 of a lead frame 1, as shown in FIG. A heat sink 4 which also serves as a heat sink is connected by caulking. The hanging pins 3 are cut together with the outer leads 5 in the process of cutting the outer leads 5 after the circuit chip C is mounted on the heat sink 4 and sealed with resin.
ところが、この方法による場合には、リードフレーム１
の多ピン化が進んで吊りピン３か細くなると、吊りピン
３と放熱板４とのカシメ接続が困難になる。However, when using this method, lead frame 1
As the number of pins increases and the hanging pins 3 become thinner, it becomes difficult to connect the hanging pins 3 and the heat sink 4 by caulking.
（発明が解決しようとする課題）
従って、本発明は、その製造過程において、リードフレ
ームに放熱板を接続する方法であって、リードフレーム
の多ピン化にかかわりなく、これに放熱板を容易に接続
することができる方法を提供することをｔａｇとしてい
る。(Problems to be Solved by the Invention) Therefore, the present invention provides a method for connecting a heat sink to a lead frame in the manufacturing process, and it is possible to easily connect a heat sink to the lead frame regardless of the number of pins of the lead frame. The tag is to provide a way to connect.
（課題を解決するための手段）
上記課題を解決するため、本発明においては、リードフ
レーム１１と別個に、放熱板２４を支持する放熱板フレ
ーム２１を形成し、リードフレー１−１１と放熱板フレ
ーム２１とを適当な部位でカシメ接続するようにした。(Means for Solving the Problems) In order to solve the above problems, in the present invention, the heat sink frame 21 that supports the heat sink 24 is formed separately from the lead frame 11, and the lead frame 1-11 and the heat sink The frame 21 is connected by caulking at an appropriate location.
放熱板フレーム２１は、中央に位置する肉厚の放熱板２
４と、この放熱板２４との間に間隔をおいて、放熱板２
４の四囲を囲む連結部２２と、この連結部２２と放熱板
２４の四偶とを連結する吊りピン２３とを有する構造と
した。そして、この放熱板フレーム２１は、放熱板２４
を構成すべき肉厚部３２の両側に、肉薄部３３を有する
異形断面帯板３１を打ち抜くことにより形成する。リー
ドフレーム１１と放熱板フレーム２１との接続は以下の
ように行なう。即ち。The heat sink frame 21 includes a thick heat sink 2 located in the center.
4 and this heat sink 24, and the heat sink 2
The structure has a connecting part 22 surrounding the four sides of the heat dissipating plate 24, and a hanging pin 23 connecting the connecting part 22 and the four joints of the heat dissipation plate 24. Then, this heat sink frame 21 includes a heat sink 24
It is formed by punching out irregular cross-section strips 31 having thinner portions 33 on both sides of the thicker portion 32 that is to form the thinner portions. The lead frame 11 and the heat sink frame 21 are connected as follows. That is.
リードフレーム１１の中央部の所定位置に放熱板２４を
配置して、リードフレーム１１と放熱フレーム２１とを
重ね、両者を連結部２２のような、吊りピン２３部以外
の十分なカシメ面積を有する部位においてカシメ接続す
る。その後１回路チップＣを搭載してワイヤボンディン
グをした後に、リード１５と共に吊りピン２３を切断し
て放熱板フレーム２１から放熱板２４を切り離す。A heat dissipation plate 24 is arranged at a predetermined position in the center of the lead frame 11, and the lead frame 11 and the heat dissipation frame 21 are overlapped to have a sufficient caulking area such as the connection part 22 other than the hanging pin 23 part. Connect by caulking at the part. After that, one circuit chip C is mounted and wire bonded, and then the hanging pins 23 are cut together with the leads 15 to separate the heat sink 24 from the heat sink frame 21.
（作 用）
本発明においては、放熱板フレーム２１が連結部１２．
２２のような比較的面積の大きな部分でリードフレーム
１１にカシメ接続される。従って。(Function) In the present invention, the heat sink frame 21 is connected to the connecting portion 12.
It is caulked and connected to the lead frame 11 at a relatively large area portion such as 22. Therefore.
カシメ接続のために十分に大きな面積を確保することが
できる。リードフレーム１１が多ピン化しても、リード
フレーム１１及び放熱板フレーム２１の連結部１２．２
２の面積にはまったく影響がない。異形断面帯板３１と
して、肉厚部の厚さが可及的に大きく、肉薄部の厚さが
可及的に小さいものを用いれば、放熱効率の良好な、大
きな放熱板２４が得られるにもかかわらす、吊りピン２
３の部分は肉薄であるから切断作業は容易である。A sufficiently large area can be secured for caulking connection. Even if the lead frame 11 has many pins, the connecting portion 12.2 between the lead frame 11 and the heat sink frame 21
There is no effect on the area of 2. If the irregular cross-section band plate 31 is made of a material whose thick part is as large as possible and whose thin part is as small as possible, a large heat sink 24 with good heat radiation efficiency can be obtained. Hanging pin 2
Since the portion 3 is thin, the cutting operation is easy.
（実施例）
本発明の一実施例を図面について説明する。第１図はリ
ードフレームと放熱板フレームの重合状態のｒＪｉ而図
面第２図は第１図ＩＩ−ＩＩ断面図、第３図は第１図ｒ
ｎ −ｍ断面図、第４図はり−１−フレームの平面図、
第５図は放熱板フレームの平面図、第６図は第５図ＶＩ
−Ｖｌ断面図、第７図は異形断面帯板のｉｆ１面図、第
８図は第７図■−■断面図、第９図は第７図■−■断面
図である。(Example) An example of the present invention will be described with reference to the drawings. Figure 1 is a diagram of the overlapping state of the lead frame and heat sink frame. Figure 2 is a sectional view taken along line II-II of Figure 1. Figure 3 is a cross-sectional view of Figure 1.
NM sectional view, Figure 4 beam-1-frame plan view,
Figure 5 is a plan view of the heat sink frame, Figure 6 is Figure 5 VI
-Vl sectional view, FIG. 7 is an if1 side view of the irregular cross-sectional strip, FIG. 8 is a sectional view taken along line 7 in FIG. 7, and FIG. 9 is a sectional view taken along line 7 in FIG. 7.
図示の実施例においては、多数のリート】５を有するリ
ードフレーム］、１と、放熱板２４を有する放熱板フレ
ーム２１とを別個に形成し、これらを第１図ないし第３
図に示すように重合し、互いに側方のボス部２５におい
てカシメ接続する。In the illustrated embodiment, a lead frame 1 having a large number of REETs 5 and a heat sink frame 21 having a heat sink 24 are separately formed and
As shown in the figure, they overlap and are connected to each other by caulking at the side boss portions 25.
第４図に示すように、リードフレーム１１は、長尺帯板
上に多数が連続形成されている。リードフレーム１１は
、四囲の連結部１−２から中央に向けて多数のリード１
５を延出させて成り、リード１５の先端に囲まれた中央
部には放熱板配置用の空間部１６を備えると共に、両側
方には放熱板フレーム２１のカシメ用ボス部２５を嵌合
させる孔】７を備えている。As shown in FIG. 4, a large number of lead frames 11 are continuously formed on a long strip plate. The lead frame 11 has a large number of leads 1 extending from the connecting parts 1-2 on the four sides toward the center.
5 is extended, and the central part surrounded by the tips of the leads 15 has a space 16 for arranging the heat sink, and the caulking bosses 25 of the heat sink frame 21 are fitted on both sides. It has holes】7.
第５図ないし第７図に示すように、放熱板フレーム２１
は、中央に位置する肉厚の放熱板２４と。As shown in FIGS. 5 to 7, the heat sink frame 21
and a thick heat sink 24 located in the center.
この放熱板２４との間に間隔をおいて、放熱板２４の四
囲を囲む連結部２２と、この連結部２２と放熱板２４の
四偶とを連結する吊りピン２３とを有し、両側方にはリ
ードフレーム１１の孔１７に嵌合するボス部２５を備え
でいる。しかして、この放熱板フレーム２］−は、第８
図、第９図に示す長尺の異形断面帯板３１上に連続して
多数形成される。この異形断面帯板３１は、放熱板２４
を植成すべき肉厚部３２の両側に、吊りピン２３を植成
すべき肉薄部３３を有し、肉厚部３２、肉薄部３３が長
手方向に延長している。放熱板フレーム２１は、この異
形断面帯板３１を打ち抜くことにより形成される。It has a connecting part 22 that surrounds the four circumferences of the heat sink 24 with an interval between it and the heat sink 24, and a hanging pin 23 that connects the connecting part 22 and the four joints of the heat sink 24, and is provided with a boss portion 25 that fits into the hole 17 of the lead frame 11. Therefore, this heat sink frame 2]- is the eighth
A large number of strips are successively formed on the elongated strip plate 31 of irregular cross section shown in FIGS. This irregular cross-section strip plate 31 is connected to the heat sink 24
On both sides of the thick part 32 where the suspension pin 23 is to be implanted, there is a thin part 33 where the hanging pin 23 is to be implanted, and the thick part 32 and the thin part 33 extend in the longitudinal direction. The heat sink frame 21 is formed by punching out this irregular cross-section strip plate 31.
リードフレーム〕１と放熱板フレーム２１との接続は以
上のように行なう。即ち、第１図ないし第ご３図に示す
ように、リードフレーム１１の中央部の空間］−６内の
所定位置に放熱板２４を配置して、リードフレーム１１
と放熱フレーム２１とを１（ね、連結部１２．２２にあ
る孔１７とボス部２５とを嵌合させ、ボス部２５を圧縮
して両者をカシメ止めする。その後、回路チップＣを搭
載してワイヤボンディングをした後に、リード１５と共
に吊りピン２３を切断して放熱板フレーム２１から放熱
板２４を切り離す。The connection between the lead frame] 1 and the heat sink frame 21 is performed as described above. That is, as shown in FIGS. 1 to 3, the heat dissipation plate 24 is placed at a predetermined position within the space [-6] in the center of the lead frame 11.
and the heat dissipation frame 21 (see, fit the hole 17 in the connecting part 12.22 and the boss part 25, compress the boss part 25, and caulk them together. Then, mount the circuit chip C. After wire bonding is performed, the hanging pins 23 and the leads 15 are cut to separate the heat sink 24 from the heat sink frame 21.
この実施例では、放熱板フレーム２１が連結部１２．２
２上の孔１７とボス部２５の部位でカシメ接続が行なわ
れる。この部位は、比較的面積が大きいからカシメに必
要なスペースを容易に確保することができる。従って、
カシメ接続のために１−分に大きな面積を確保すること
ができる。り一ドフレーム１１が多ピン化しても、リー
ドフレーム〕１及び放熱板フレーム２１の連結部１２，
２２の面積にはまったく影響がない。また、異形断面帯
板３１の肉厚部３２の厚さが大きいものを採用すれば、
放熱効率の良好な、大きな放熱板２４が得られる。この
場合にも、吊りピン２３の部分は肉薄であるから切断作
業には支障を来さない。In this embodiment, the heat sink frame 21 is connected to the connecting portion 12.2.
A caulking connection is made between the hole 17 on the top 2 and the boss portion 25. Since this portion has a relatively large area, the space necessary for caulking can be easily secured. Therefore,
A large area can be secured within 1 minute for caulking connections. Even if the lead frame 11 has many pins, the connection part 12 between the lead frame] 1 and the heat sink frame 21,
The area of 22 is not affected at all. Furthermore, if the thickness of the thick portion 32 of the irregular cross-section strip plate 31 is large,
A large heat dissipation plate 24 with good heat dissipation efficiency can be obtained. In this case as well, since the hanging pin 23 is thin, it does not interfere with the cutting operation.
なお、上記実施例では、リードフレーム】１と放熱板フ
レーム２１とをカシメ接続したが、接続方法はこれに限
定されるものではない。例えば、両者の連結部１２．２
２において接着剤にて接続する方法も考えられる。In the above embodiment, the lead frame 1 and the heat sink frame 21 are connected by caulking, but the connection method is not limited to this. For example, the connection part 12.2 between the two
In step 2, a method of connecting with adhesive may also be considered.
（発明の効果）
以上のように本発明においては、リードフレーム１１と
別個に、放熱板２４を支持する放熱板フレーム２１を形
成し、リードフレーム】−１と放熱板フレーム２】とを
適当な部位でカシメ接続、接着剤による接続等の適宜の
方法で接続するようにした。放熱板フレーム２１は、中
央に位置する肉厚の放熱板２４と、この放熱板２４との
間に間隔をおいて、放熱板２４の四囲を囲む連結部２２
と、この連結部２２と放熱板２４の四偶とを連結する吊
すピン２３とを有する構造とした。そして、この放熱板
フレーム２１．は、放熱板２４を構成すべき肉厚部３２
の両側に、肉薄部３３を有する異形断面帯板３１を打ち
抜くことにより形成する。リードフレーム１１と放熱板
フレーム２１との接続は以下のように行なう。即ち、リ
ードフレーム１】の中央部の所定位置に放熱板２４を配
置して、リードフレーム１１と放熱フレーｔ１２１とを
東ね。(Effects of the Invention) As described above, in the present invention, the heat sink frame 21 that supports the heat sink 24 is formed separately from the lead frame 11, and the lead frame ]-1 and the heat sink frame 2] are connected in an appropriate manner. The parts are connected by an appropriate method such as caulking or adhesive. The heat sink frame 21 includes a thick heat sink 24 located at the center, and connecting portions 22 surrounding the heat sink 24 at intervals between the thick heat sink 24 and the heat sink 24.
and a hanging pin 23 that connects the connecting portion 22 and the four pairs of heat sinks 24. This heat sink frame 21. is the thick portion 32 that constitutes the heat sink 24
It is formed by punching out irregular cross-section strips 31 having thinned portions 33 on both sides of the plate. The lead frame 11 and the heat sink frame 21 are connected as follows. That is, the heat dissipation plate 24 is placed at a predetermined position in the center of the lead frame 1, and the lead frame 11 and the heat dissipation plate t121 are aligned to the east.
両者を連ム１１部】、２，２２のような、吊りピン２３
部以外の十分な接続面積を有する部位において接続する
。その後、回路チップＣを搭載してワイヤボンディング
をした後に、リート１５と共に吊りピン２３を切断して
放熱板フレー１５２１から放熱板２４を切り離す。この
ため、リードフレーＡ％ ］１の多ピン化にかかわりな
く、これに放熱板２４を容易に接続することができると
いう効果を奏する。A hanging pin 23 such as 11 parts], 2, 22 that connects both
Connect at a location other than the section that has sufficient connection area. Thereafter, after mounting the circuit chip C and performing wire bonding, the hanging pins 23 are cut together with the leat 15 to separate the heat sink 24 from the heat sink fly 1521. Therefore, regardless of the number of pins on the lead fly A% ]1, the heat sink 24 can be easily connected to the lead fly.
第１図ないし第７図は本発明の一実施例を示すもので、
第１図はリードフレームと放熱板フレームの重合状態の
平面図、第２図は第］図ＩＩ −ＩＮ断面図、第３図は
第１図ＩＩＩ −ＩＩＩ断面図、第４図はリードフレー
ムの平面図、第５図は放熱板フレームの平面図、第６図
は第５図Ｖｌ−ＶＩ断面図、第７図は異形断面帯板の平
面図、第８図は第７図■−■断面図、第９図は第７図Ｌ
Ｘ−ＩＫ断面図であり、第１０図は従来の放熱板の接続
構造を示す概略的断面図である。
１．１・・・リードフレーム、１２・・・連結部。
１５・・・リード、２１・・・放熱板フレーム、２２・
・・連結部、２３・・・吊りピン、２４・・・放熱板、
３１・・・異形断面帯板、３２・・・肉厚部、３３・・
・肉薄部。1 to 7 show an embodiment of the present invention,
Figure 1 is a plan view of the overlapping state of the lead frame and heat sink frame, Figure 2 is a sectional view taken from Figure II-IN, Figure 3 is a sectional view taken from Figure 1 III-III, and Figure 4 is a sectional view of the lead frame. A plan view, FIG. 5 is a plan view of the heat sink frame, FIG. 6 is a sectional view taken along line Vl-VI in FIG. Figure 9 is Figure 7 L
FIG. 10 is a schematic cross-sectional view showing a conventional heat sink connection structure. 1.1...Lead frame, 12...Connection part. 15... Lead, 21... Heat sink frame, 22...
...Connection part, 23... Hanging pin, 24... Heat sink,
31... Irregular cross-section strip plate, 32... Thick part, 33...
・Thin wall area.
Claims (3)
出させたリードフレームの中央部に、別体のアイランド
兼用放熱板を接続し、このアイランド上に回路チップを
搭載し、この回路チップと前記リードとの間のワイヤボ
ンディングを行なつた後に、前記リードフレームと放熱
板とを切り離す工程を含む方法において、 前記放熱板を構成すべき肉厚部の両側に肉薄部を有する
異形断面帯板を打ち抜くことにより、中央に位置する肉
厚の放熱板と、この放熱板との間に間隔をおいて放熱板
の四囲を囲む連結部と、この連結部と前記放熱板の四偶
とを連結する吊りピンとを有する放熱板フレームを形成
し、 前記リードフレームの中央部の所定位置に前記放熱板を
配置して、リードフレームと前記放熱フレームとを重ね
、両者を前記吊りピン部以外の十分な接続面積を有する
部位において接続し、ワイヤボンディングの後に吊りピ
ンを切断して放熱板フレームから放熱板を切り離すこと
を特徴とする半導体装置の製造方法。(1) Connect a separate heat sink that also serves as an island to the center of a lead frame with a large number of leads extending from the connecting parts of the four sides toward the center, and mount a circuit chip on this island. The method includes the step of separating the lead frame and the heat sink after wire bonding between the chip and the leads, the method comprising: separating the lead frame and the heat sink after wire bonding between the chip and the leads; By punching out the band plate, a thick heat sink located in the center, a connection part that surrounds the heat sink at intervals between the heat sink, and a connecting part and the four joints of the heat sink are formed. forming a heat sink frame having hanging pins connecting the lead frames, placing the heat sink at a predetermined position in the center of the lead frame, overlapping the lead frame and the heat sink frame, and connecting both with a part other than the hanging pin part. 1. A method of manufacturing a semiconductor device, which comprises connecting at a portion having a sufficient connection area, and cutting a hanging pin after wire bonding to separate a heat sink from a heat sink frame.
出させたリードフレームの中央部に、別体のアイランド
兼用放熱板を接続し、このアイランド上に回路チップを
搭載し、この回路チップと前記リードとの間のワイヤボ
ンディングを行なった後に、前記リードフレームと放熱
板とを切り離す工程を含む方法において、 前記放熱板を構成すべき肉厚部の両側に肉薄部を有する
異形断面帯板を打ち抜くことにより、中央に位置する肉
厚の放熱板と、この放熱板との間に間隔をおいて放熱板
の四囲を囲む連結部と、この連結部と前記放熱板の四偶
とを連結する吊りピンとを有する放熱板フレームを形成
し、 前記リードフレームの中央部の所定位置に前記放熱板を
配置して、リードフレームと前記放熱フレームとを重ね
、両者を前記吊りピン部以外の十分なカシメ面積を有す
る部位においてカシメ接続し、ワイヤボンディングの後
に吊りピンを切断して放熱板フレームから放熱板を切り
離すことを特徴とする半導体装置の製造方法。(2) Connect a separate heat sink that also serves as an island to the center of a lead frame with a large number of leads extending from the connecting parts of the four sides toward the center, and mount a circuit chip on this island. The method includes the step of separating the lead frame and the heat sink after performing wire bonding between the chip and the leads, the method comprising the step of separating the lead frame and the heat sink, the irregular cross-sectional band having thinner parts on both sides of the thick part that should constitute the heat sink. By punching out the plate, a thick heat sink located in the center, a connection part surrounding the heat sink with a space between the heat sink, and a connecting part and the four joints of the heat sink are formed. forming a heat dissipation plate frame having hanging pins to be connected; placing the heat dissipation plate at a predetermined position in the center of the lead frame; overlapping the lead frame and the heat dissipation frame; 1. A method for manufacturing a semiconductor device, which comprises crimping connection at a portion having a large crimping area, and cutting hanging pins after wire bonding to separate a heat sink from a heat sink frame.
出させたリードフレームの中央部に、別体のアイランド
兼用放熱板を接続し、このアイランド上に回路チップを
搭載し、この回路チップと前記リードとの間のワイヤボ
ンディングを行なった後に、前記リードフレームと放熱
板とを切り離す工程を含む方法において、 前記放熱板を構成すべき肉厚部の両側に肉薄部を有する
異形断面帯板を打ち抜くことにより、中央に位置する肉
厚の放熱板と、この放熱板との間に間隔をおいて放熱板
の四囲を囲む連結部と、この連結部と前記放熱板の四偶
とを連結する吊りピンとを有する放熱板フレームを形成
し、 前記リードフレームの中央部の所定位置に前記放熱板を
配置して、リードフレームと前記放熱フレームとを重ね
、両者を前記吊りピン部以外の十分な接着面積を有する
部位において接着剤にて接続し、ワイヤボンディングの
後に吊りピンを切断して放熱板フレームから放熱板を切
り離すことを特徴とする半導体装置の製造方法。(3) Connect a separate heat sink that also serves as an island to the center of the lead frame, which has a large number of leads extending from the connecting parts of the four sides toward the center, and mount a circuit chip on this island. The method includes the step of separating the lead frame and the heat sink after performing wire bonding between the chip and the leads, the method comprising the step of separating the lead frame and the heat sink, the irregular cross-sectional band having thinner parts on both sides of the thick part that should constitute the heat sink. By punching out the plate, a thick heat sink located in the center, a connection part surrounding the heat sink with a space between the heat sink, and a connecting part and the four joints of the heat sink are formed. forming a heat dissipation plate frame having hanging pins to be connected; placing the heat dissipation plate at a predetermined position in the center of the lead frame; overlapping the lead frame and the heat dissipation frame; 1. A method of manufacturing a semiconductor device, which comprises connecting with an adhesive at a portion having a bonding area of 100 to 100 mL, and cutting a hanging pin after wire bonding to separate a heat sink from a heat sink frame.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28310789A JPH0756890B2 (en) | 1989-11-01 | 1989-11-01 | Method for manufacturing semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28310789A JPH0756890B2 (en) | 1989-11-01 | 1989-11-01 | Method for manufacturing semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03147355A true JPH03147355A (en) | 1991-06-24 |
| JPH0756890B2 JPH0756890B2 (en) | 1995-06-14 |
Family
ID=17661312
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28310789A Expired - Lifetime JPH0756890B2 (en) | 1989-11-01 | 1989-11-01 | Method for manufacturing semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756890B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394607A (en) * | 1993-05-20 | 1995-03-07 | Texas Instruments Incorporated | Method of providing low cost heat sink |
| US7091060B2 (en) | 1999-11-23 | 2006-08-15 | Micron Technology, Inc. | Circuit and substrate encapsulation methods |
| US7399657B2 (en) * | 2000-08-31 | 2008-07-15 | Micron Technology, Inc. | Ball grid array packages with thermally conductive containers |
-
1989
- 1989-11-01 JP JP28310789A patent/JPH0756890B2/en not_active Expired - Lifetime
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5394607A (en) * | 1993-05-20 | 1995-03-07 | Texas Instruments Incorporated | Method of providing low cost heat sink |
| US7091060B2 (en) | 1999-11-23 | 2006-08-15 | Micron Technology, Inc. | Circuit and substrate encapsulation methods |
| US7144245B2 (en) | 1999-11-23 | 2006-12-05 | Micron Technology, Inc. | Packages for semiconductor die |
| US7239029B2 (en) | 1999-11-23 | 2007-07-03 | Micron Technology, Inc. | Packages for semiconductor die |
| US7399657B2 (en) * | 2000-08-31 | 2008-07-15 | Micron Technology, Inc. | Ball grid array packages with thermally conductive containers |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0756890B2 (en) | 1995-06-14 |
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