JPH03145799A - Chip electronic component feeder - Google Patents

Abstract

PURPOSE:To enable parts to be easily replenished and to enable the components which are aligned once not to be disturbed by a method wherein an air jetting means which advances chip electronic components into a component aligning slot one by one and a delivery path which guides the component which passes through the component aligning slot to a prescribed unloading position are provided. CONSTITUTION:A block 11' is provided to the lower part of a case 11, the upside of the block 11' forms a tapered space cooperating with a baffle plate 23, and a component aligning chamber 22' is formed under the baffle plate 23. An air introducing hole 19 whose one end is opened outside is provided to the lower part of the block 11', and an air jet nozzle 12 is provided confronting the hole 19. Chip electronic components are put in the case 11 and compressed air is intermittently supplied into the case 11 through the jet nozzle 11. The compressed air reaches to the component aligning chamber 22' through the air introducing hole 19 via an air path 19' and stirs up the components. At this point, only the required number of the electronic components drop into the part aligning chamber 22' passing under the baffle plate 23 as controlled by the baffle plate 23, so that the electronic components can fully be changed in position and delivered to a position 24' correspondent to the position of a suction nozzle passing through a component aligning slot 22.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an electronic component supply device suitable for transporting chip electronic components one by one to a suction nozzle position of an electronic component mounting machine.

[Prior art] An electronic component mounting machine that sucks electronic components supplied one by one up to a suction nozzle position using a suction nozzle at this position, and then mounts the component onto a board on a board table that is movable in XY force directions. In order to supply the electronic component to the position of the -]22 deposition nozzle, for example, a tape type supply device has conventionally been used.

The tape type feeding device is disclosed in, for example, Japanese Patent Application Laid-Open No. 1986-27:146.
As disclosed in Publication No. 8, a carrier tape is intermittently fed through pockets lined up in which chip-shaped electronic components are stored one by one, and the chip electronic components are successively taken out to the removal position. It is designed to be fed, sucked with a suction nozzle, and taken out.

On the other hand, vibration feeders or vibratory feeders are well known without mentioning the literature. This consists of a container that stores the parts and a vibrator that vibrates the container.
Then, when the parts are placed in a container and vibration is applied, the parts orient in a predetermined direction according to their shape, and due to the vibration, they turn white! I [
It is designed to be sent by.

[Problems to be Solved by the Invention] The tape-type feeding device as described above has the advantage of not requiring an alignment operation because the direction of the chip electronic components is fixed; tape pocket 1
- Because the parts are stored in a small space, the number of parts that can be stored is small and it is not easy to replenish parts. In other words, when replenishing parts, it is necessary to stop the electronic component mounting machine and then mount another new tape. However, because the tape mounting mechanism is complicated, it takes time to set a new tape, and it is difficult to replenish parts. Therefore, there is a problem that the operating rate decreases.

On the other hand, since the vibratory feeder can store parts in bulk in a container, parts can be easily replenished.

However, it is difficult to apply this method to a type in which the component supply table moves. In other words, if the parts supply table moves, the vibration transmission mechanism that applies vibration to the containers placed on this table becomes complicated, and if the parts supply table moves, there is a risk that once aligned parts may fall apart. In particular, if even a slight vibration occurs from side to side with respect to the direction of movement of the parts, the parts will become severely disturbed and become unusable.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component supply device that allows components to be easily replenished and that does not cause disturbance to the components once they are aligned.

[Means for Solving the Problems] The chip electronic component supply device of the present invention includes a case having a storage space therein for accommodating chip electronic components in bulk;
A component alignment groove provided in the lower part of the case and having a cross-sectional shape that allows the chip electronic components from the nf storage space to pass through one by one; It is characterized by comprising an air injection means that advances the air into the slot, and a delivery path that guides the chip electronic components that have passed through the component alignment slot to a predetermined component extraction position.

[For production] Chip electronic components are stored in bulk inside the case.

Then, the air is intermittently injected or ejected by the air injection means. Then, the chip electronic components are agitated and placed one by one into the component alignment slot in a predetermined direction, passing through the alignment slot and delivered to the component removal position at the end of the delivery path. At this position, the electronic component placement machine's suction nozzle picks up the
mounted on the board.

When the number of electronic components in the case decreases, remove the lid of the case and replenish the electronic components.

Embodiment FIG. 2 shows an electronic component mounting machine equipped with an electronic component supply device according to an embodiment of the present invention.

On the pedestal 1 are an XY table 3 that is movable in the XY force directions, a component supply table 10 that is movable in the X direction (direction perpendicular to the paper), a substrate transport device 2, and a drive device that drives various members. There is a machine room 8 housing the machine, an operation panel 9, etc. Note that numeral 5 indicates an index table.

As shown in FIG. 3, the Intex table 5 rotates in the M1 direction and is equipped with 12 suction nozzles 30 around it. Then, the electronic component is picked up at position 6, and is lowered onto the board 4 at position 7. While the index table rotates and the suction nozzle takes different positions, parts are inspected and defective parts are removed.

As shown in FIG. 3, the component supply table 10 is movable in the X direction, that is, in the direction perpendicular to the plane of the paper in FIG. A plurality of cases 11, 11, . . . are placed on this table], 0. Chip electronic components are housed in bulk within this case. In this embodiment, each case 11 is made of a transparent body, so that the state of the internal components can be observed.

An embodiment of the case 11 is shown in FIG.

A block 11' is provided in the lower part of the interior of the case. The upper surface of this block cooperates with the baffle plate 23 to form a tapered narrow space, and below the baffle plate 23 a parts arrangement chamber 22' is formed.

The case 11 has a thin rectangular parallelepiped shape as shown in the plan view of FIG. It is set freely.

An air introduction hole 19 opened to the outside is provided in the lower part of the block 11', and an air injection nozzle 12 is provided opposite to this hole 19. The injection nozzle 12 is connected to an air source 12' located below the component supply table 10. A plurality of cases 11 are provided, and a plurality of nozzles 12 are also provided, but this is not a one-to-one correspondence, and as shown in FIG. 3, the injection nozzles 12, 12,... It is provided near the suction position 6 of the nozzle. The cases 11, 11... move in the X direction together with the component supply table 10, but the nozzle 1
．． 2.12... are fixedly provided.

Below the electronic component arrangement chamber 22', component alignment slots 22 formed in the block 11' are connected, and the slots 22 are connected to a delivery groove (delivery path) 24, and the delivery groove 24 is a suction groove. Position 24' corresponding to position 6 of nozzle 30 has been reached.

46 is a presser plate.

Furthermore, air from the air introduction hole 19 is intermittently injected into the component alignment slot 22 via an air passage 19'. The component alignment slot 22 and the delivery groove 24 have cross-sectional dimensions such that chip electronic components can pass therethrough one by one.

Next, the operation of the above embodiment will be explained. A chip electronic component is placed in a case 11, and compressed air is intermittently supplied from an injection nozzle 12. The compressed air passes through the air passage 19' from the air introduction hole 19 and reaches the component arrangement chamber 22', where it disturbs the electronic components. At this time, the baffle plate 23 prevents the chip electronic components passing under the baffle plate 23 from exceeding the required amount into the alignment chamber 22'.
Since the electronic components do not fall into the room, the electronic components can sufficiently change direction in the alignment chamber, and are reliably delivered one by one through the component alignment slot 22 to the position 24' corresponding to the suction nozzle position 6.

The air used to disturb or align the electronic components is exhausted to the outside through an air vent hole 20 formed in the upper part of the case.

The parts arriving at the position 24' corresponding to the suction nozzle position 6 are suctioned by the suction nozzle 30. When the index table 5 is rotated clockwise in FIG. 3, the position and orientation of the parts in the attracted state is inspected, corrected, angularly displaced, etc. at positions 13, 14° and 14'. Then, at position 7, it is mounted on the board 4 fixed to the XY child table. Note that processes such as eliminating defective parts are also performed at the nozzle positions after position 7, but since these processes are well known, detailed explanation will be omitted.

During the above operation, as shown in FIG. 3, the component supply table is moved such that the case containing a predetermined component among the plurality of cases 11 containing different electronic components comes to the suction nozzle position 6. 1o appropriately in the X direction.

Then, air is intermittently injected from the injection nozzle 12 only in cases in this vicinity as described above. This prepares the parts for alignment. The injection timing of compressed air is synchronized with the timing of the suction nozzle and the component supply table. When the number of parts in the case 11 is reduced, the lid 21 can be removed and parts can be replenished into the case 11.

To explain the flow of the electronic component supply operation in more detail with reference to FIG. 4, the board 4 is fixed on the XY child table (
101). Then, indexing is performed (102), and the parts supply table 1o is moved according to the index (102).
03), the component is sucked into the suction nozzle to correct its position and orientation 104), and the component is mounted on the board-L (105).

The case 11 housing the electronic components moves together with the component supply table (106), and the injection of compressed air from the air source is completed just before the case stops at the suction position (106).
7).

The injection timing of compressed air will be further explained with reference to FIG. There is. In addition, in 1a, the "low" position is the stop time, in "b", the "low" position is the injection time, and in 1c, the "low" position is the injection time.
The "low" position indicates the adsorption time.

As is clear from the above-mentioned FIG. 5, the injection starts just before the case 1 placed on the parts supply table starts the stop operation, and the injection ends when the part supply table stops. In addition, the suction of the parts is performed in Part 1] After the product supply table 10 has stopped and the injection of compressed air has ended, the actual suction operation is started.

Although Fig. 5 shows the exact operation timing,
Even if there is slight variation in timing, there is no problem in terms of performance.

FIG. 6 shows another embodiment of the parts supply device of the present invention. Portions similar to those shown in FIGS. 1, 2, and 3 are given the same reference numerals to avoid redundant explanation. According to this embodiment, the second component alignment chamber 40 is connected to the spiral component alignment groove 4.
It is formed in the center of 1. Compressed air is also intermittently injected into this chamber 40 via the air passage 19''. The supplied parts are blown away by air, aligned, enter the slot 22, and reach the second parts arrangement chamber 40. Here, similarly, the parts are aligned while dancing due to the action of air and enter the spiral-shaped part alignment slot 41 one by one. The parts that have entered the spiral alignment slot 41 are transported through the slot 41 by compressed air, but air vent holes 44, 44 are provided above the slot 41. , it is pumped by compressed air to approximately this position, after which it moves by inertia and then falls by gravity. At the position A-A just before the gravitational effect disappears, as shown in FIG. , the part is moved upward again in the spiral groove 41 by this air pressure. Proceed in the same manner below.

Finally, it is supplied through the delivery groove 24 to a position 24' corresponding to the suction nozzle position 6.

In another embodiment shown in FIG. 8, the delivery passage 24 is constructed obliquely so that the parts slide down under the action of gravity.

9 to 11 show examples of means for detecting the alignment state of electronic components 100 on the above-mentioned delivery groove path 24 and removing those that are improperly aligned. Electronic components sent to the delivery passage or groove 24 1. In the case of OO, the recognition camera 5]- determines whether the front side is the front side, the polarity is determined, and the alignment state is determined at a position before the position to be suctioned by the suction nozzle 30, and defective products based on the determination are suctioned by the suction nozzle 52. Been”
Hold it to one side and it will be lifted. Then, a blow-off nozzle 53 provided horizontally blows it into a box (not shown) and removes it. Note that the operations of the suction nozzle 52 and the blowing nozzle 53 are synchronized with the signal from the recognition camera. In addition, the blown defective products can be returned to the case 11 later.

]-2 and 13 show a plan view and a side sectional view of an embodiment of the electronic component terminal position 24' of the delivery groove 24. According to this embodiment, a U-shaped elastic rubber 61 in plan view is provided at a position 24' corresponding to the suction nozzle position 6 to ensure that the electronic component and OO are stopped.

The impact of the part being sent by air or by gravity is absorbed by the elastic rubber 61, and the part will stop exactly at this position. In another embodiment shown in FIG. 14, a vacuum hole 62 is provided at the end of the delivery groove 24. By suctioning air through the vacuum hole 62, the electronic component is suctioned and fixed to the end wall surface of the groove, allowing for more accurate positioning. If vacuum holes are provided on both sides, it can be fixed even more securely.

[Effects of the Invention] As detailed above, according to the present invention, chip electronic components can be stored in bulk (that is, in pieces) in the case of an electronic component supply device, and can be reliably supplied to the suction nozzle position. Therefore, it is easier to replenish chip electronic components compared to tape-type supply, and the operating rate of the electronic component mounting machine can be improved. Additionally, since there is no tape, the cost of chip electronic components is also reduced by the amount of tape. Furthermore, compared to tape, it can store more parts, reducing the number of times parts need to be replenished. In particular, with tape-type feeding, dust is generated when cutting the empty tape with a cutter, and when parts are mounted on the board, the dust can cause short circuits or disconnections in the circuit. In the present invention, this problem is completely eliminated, and the reliability of mounting parts is greatly improved.

In addition, even if the parts supply table moves, there is no particular difficulty in applying it, as in a vibrating feeder, which requires a vibrator. Since the air source and the injection nozzle can be connected with a flexible hose, there is no problem even if the injection nozzle is placed on the parts supply table 1-, and the structure is simple and the supply device is highly reliable. I am talented.

[Brief explanation of the drawing]

FIG. 1 is a longitudinal cross-sectional view showing an embodiment of the chip electronic component supply device of the present invention, FIG. 2 is a side view of a chip electronic component mounting machine using the electronic component supply device, and FIG. 3 is the main part thereof. FIG. 4 is a flowchart 1-1 showing the operation of this embodiment.
Fig. 5 is a compressed air injection timing diagram, Fig. 6 is a longitudinal cross-sectional view of a chip electronic component supply device according to another embodiment, Fig. 7 is a cross-sectional view taken along line A-H in Fig. 6, and Fig. 8 is a delivery Figures 9 to 1 are cross-sectional views showing other embodiments of the inspection/removal means; Figure 9 is a plan view thereof, Figure 10 is a side sectional view thereof, and Figure 11 The figure is a cross-sectional view of the main part, and Figures 12 and 13 show an example of the fixing means at the extraction position.
(1 side and a side sectional view; FIG. 14 is a side sectional view showing an example of other fixing means. Chamber 24, delivery path 40, second component alignment chamber 41... spiral component alignment slot 4, board 7, mounting position pull 12... injection nozzle 22, component alignment slot 30... suction nozzle (one other person) Figure 3

Claims (1)

[Scope of Claims] 1. A case having a storage space therein for accommodating chip electronic components in bulk, and a cross-sectional shape provided at the bottom of the case through which chip electronic components from the storage space can pass one by one. a component alignment slot having a component alignment slot; an air injection means for advancing the chip electronic components one by one from the storage space into the component alignment slot; A chip electronic component supply device characterized by comprising a delivery path leading to a take-out position. 2. The chip electronic component supply device according to claim 1, wherein the component alignment slot includes a spiral slot. 3. The component alignment slot consists of a spiral slot and a chute-shaped slot extending from the bottom of the storage space to the center area of the spiral slot, and the outer end of the spiral slot is continuous with the delivery path. Claim: wherein the air injection means is configured to inject air into an opening of the chute-shaped slot to the storage space, a central area of the spiral slot, and an intermediate position of the spiral slot. 2. The chip electronic component supply device according to 2. 4. The component alignment slot is a chute-shaped slot extending from the bottom of the storage space to the delivery path, and the air injection means is configured to inject air into the opening of the component alignment slot to the storage space. The chip electronic component supply device according to claim 1, wherein 5. The chip electronic component supply device according to claim 1, 2, 3 or 4, wherein the case and the component alignment slot are made of a transparent material. 6. The chip electronic component supply device according to claim 1, wherein the delivery path is provided with means for inspecting the alignment of the chip electronic components and removing poorly aligned chip electronic components. 7 A plurality of the chip electronic component supply devices are installed on the component supply table, and the component supply table is arranged so that the component take-out position is brought to a position where the suction nozzle of the chip electronic component mounting machine descends to suck the chip electronic component. The chip according to any one of claims 1 to 6, wherein the air injection means intermittently injects air in synchronization with the operations of the suction nozzle and the component supply table. Electronic component supply equipment. 8. The chip according to claim 7, wherein the air injection is simultaneously performed not only to the chip electronic component supply device brought to the suction nozzle lowered position but also to several other chip electronic component supply devices. Electronic component supply equipment.