JPH03145187A - Electrodeposition coating device of flexible board - Google Patents
Electrodeposition coating device of flexible boardInfo
- Publication number
- JPH03145187A JPH03145187A JP28353089A JP28353089A JPH03145187A JP H03145187 A JPH03145187 A JP H03145187A JP 28353089 A JP28353089 A JP 28353089A JP 28353089 A JP28353089 A JP 28353089A JP H03145187 A JPH03145187 A JP H03145187A
- Authority
- JP
- Japan
- Prior art keywords
- electrodeposition
- flexible substrate
- flexible board
- threshold
- insulator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004070 electrodeposition Methods 0.000 title claims abstract description 41
- 238000000576 coating method Methods 0.000 title claims abstract description 16
- 239000011248 coating agent Substances 0.000 title claims abstract description 14
- 229920002120 photoresistant polymer Polymers 0.000 claims abstract description 10
- 239000012212 insulator Substances 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 42
- 239000011888 foil Substances 0.000 claims description 10
- 239000002184 metal Substances 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 7
- 238000000034 method Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000002950 deficient Effects 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000002659 electrodeposit Substances 0.000 description 3
- 238000001259 photo etching Methods 0.000 description 2
- 241000723436 Chamaecyparis obtusa Species 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000001450 anions Chemical class 0.000 description 1
- 150000001732 carboxylic acid derivatives Chemical class 0.000 description 1
- 150000001768 cations Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 208000031513 cyst Diseases 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は、フープ状の絶縁フィルムに金属箔を接着して
なるフレキシブル基板やフープ状の金属箔からなるフレ
キシブル基板用の電着塗装装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a flexible substrate formed by bonding a metal foil to a hoop-shaped insulating film, and an electrodeposition coating device for a flexible substrate formed from a hoop-shaped metal foil. It is something.
［従来の技術］
電着塗装は電導物の一般的塗装の他、表面の防錆処理な
どに広く用いられてきたが、近年、プリント基板製造に
おいて、各種レジスト、特にフォトレジストの塗布方式
として利用が始まった。ドライフィルムを使ったフォト
エツチングに較べ、フォトレジストの電着塗装方式によ
るフォトエツチングは以下の様な利点を有する。[Prior art] Electrodeposition coating has been widely used for general coating of conductive materials as well as surface rust prevention treatment, but in recent years it has been used as a coating method for various resists, especially photoresists, in the manufacture of printed circuit boards. has begun. Compared to photoetching using a dry film, photoetching using a photoresist electrodeposition coating method has the following advantages.
（１） レジスト膜厚が薄い為、ファインパターンに
対応できる。(1) Because the resist film is thin, it can be used for fine patterns.
（２） 工程の自動化が行い易いので製造コストの低
減ができる。(2) Manufacturing costs can be reduced because the process can be easily automated.
以上のメリットは、リジット基板のみならず、フレキシ
ブル基板製造においてもあてはまる。そこで７．レキシ
プル基板用の電着槽として図５に示す様な檜が一般的に
知られている。The above advantages apply not only to rigid substrate manufacturing but also to flexible substrate manufacturing. So 7. A Hinoki cypress as shown in FIG. 5 is generally known as an electrodeposition tank for lexiple substrates.
［発明が解決しようとする課題］
しかし、前述のフレキシブル基板用の電着槽で均一な膜
厚および膜特性を持ったし、シストを電着塗装しようと
すれば、フレキシブル基板の搬送と電着な同時に行わな
い、いわゆるタクト方式による電着な行なわなければな
らない。それは、２つの工程を同時に行うと、フレキシ
ブル基板の入槽部付近において急激にレジストが付着す
るため、膜が不均一に析出し、レジストの外観がしま模
様を呈したり、あるいは、局所に大電流が流れ、レジス
トが変質してしまうからで、レジストが不導体である為
にこの様な現象が起こる。[Problems to be Solved by the Invention] However, if the electrodeposition bath for flexible substrates described above has a uniform film thickness and film characteristics, and if cysts are to be electrodeposited, the transportation of the flexible substrate and the electrodeposition are difficult. Electrodeposition must be carried out by the so-called tact method, rather than at the same time. If the two processes are performed at the same time, the resist will rapidly adhere to the area where the flexible substrate enters the bath, causing the film to deposit unevenly, giving the resist a striped appearance, or causing a large amount of current to be applied locally. flows and changes the quality of the resist. This phenomenon occurs because the resist is a nonconductor.
ところで前記タクト方式による電着では、フレキシブル
基板の搬送と電着を別々に行うため、塗装機としての処
理能力が小さく、また、処理する基板のうち、電着時に
電着液との境目にたる部分が正しく電着されず、不良部
となる課題を有していた。そこで本発明は、このような
課題を解決するもので、その目的とするところは、塗装
能力が大きく、電着不良部の生じ′ないフレキシブル基
板の電着塗装を行うことにある。By the way, in the above-mentioned tact method of electrodeposition, since the transportation of the flexible substrate and the electrodeposition are carried out separately, the processing capacity of the coating machine is small, and the amount of sag at the boundary with the electrodeposition liquid during electrodeposition of the substrate to be processed is small. There was a problem that some parts were not electrodeposited correctly, resulting in defective parts. SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and its purpose is to perform electrodeposition coating on flexible substrates that has a high coating capacity and does not cause defective electrodeposition areas.
〔課題を解決するための手段］
本発明のフレキシブル基板用の電着塗装装置は絶縁フィ
ルムに金属箔を接着してなるフレキシブル基板又は金属
箔からなるフレキシブル基板の金属箔上にフォトレジス
ト又はレジストを電着塗装する装置において、前記フレ
キシブル基板の電着液槽への入槽部と対極の間に、絶縁
体によるしきいを設けたことを特徴とする。[Means for Solving the Problems] The electrodeposition coating device for flexible substrates of the present invention applies a photoresist or resist on a flexible substrate formed by adhering a metal foil to an insulating film, or on the metal foil of a flexible substrate made of metal foil. The apparatus for electrodeposition coating is characterized in that a threshold made of an insulator is provided between a part of the flexible substrate entering the electrodeposition liquid tank and the counter electrode.
［実施例コ
第１図は、本発明の実施例を示すフレキシブル基板用の
電着装置の主要断面図でありて、１は電着液、２は電着
槽、３は絶縁体のしきい、４はフレキシブル基板搬送用
ローラー ５はフレキシブル基板で、アニオン電着では
陽極に、カチオン電着では陰極に接続されている。６は
、対極でフレキシブル基板とは反対の極が接続される。[Example 1] Figure 1 is a main sectional view of an electrodeposition apparatus for flexible substrates showing an example of the present invention, in which 1 is an electrodeposition liquid, 2 is an electrodeposition tank, and 3 is an insulator threshold. , 4 is a roller for conveying a flexible substrate. 5 is a flexible substrate, which is connected to an anode for anion electrodeposition and a cathode for cation electrodeposition. Reference numeral 6 denotes a counter electrode to which the opposite electrode to the flexible substrate is connected.
７は、フレキシブル基板が電着槽へ入ってゆく入槽部付
近のフレキシブル基板を示し、８は、前記入槽部より２
０〜５０ｃｍ入ったところのフレキシブル基板を示す。7 shows the flexible substrate near the bath entry section where the flexible substrate enters the electrodeposition tank, and 8 indicates the flexible substrate 2 from the bath entry section.
The flexible substrate is shown after entering from 0 to 50 cm.
カルボン酸樹脂を有機アミンで中和した、フォトレジス
トの電着塗装では、フレキシブル基板５は陽極に、対極
６は陰極として通電し、電着な行なう。フレキシブル基
板５を搬送した状態で、電着な行う際、絶縁体のしきい
３により、人種部付近のフレキシブル基板７と、対極６
との間の電気抵抗は、絶縁体のしきい３が無い場合と較
べ著しく大きくなり、入槽部付近のフレキシブル基板７
では、実際上、フォトレジストは析出せず、更に進んだ
部分８で、徐々に析出は開始される。またしきい３の形
状は、電着液の電導度等の物性とフレキシブル基板５の
形状より最適化する必要がある。この様にフレキシブル
基板５を通電入槽した際に、これまで問題となっていた
「段付き」と呼ばれる電着物の不均一な析出は、しきい
３により連続的で均一な析出へ変えることができる。In electrodeposition of a photoresist in which a carboxylic acid resin is neutralized with an organic amine, the flexible substrate 5 is used as an anode and the counter electrode 6 is used as a cathode, and electricity is applied to perform the electrodeposition. When carrying out electrodeposition while the flexible substrate 5 is being transported, due to the threshold 3 of the insulator, the flexible substrate 7 near the electrode portion and the counter electrode 6
The electrical resistance between the
In this case, the photoresist does not actually precipitate, and the photoresist gradually starts to precipitate in the further advanced portion 8. Further, the shape of the threshold 3 needs to be optimized based on the physical properties such as the conductivity of the electrodeposition liquid and the shape of the flexible substrate 5. As described above, when the flexible substrate 5 is energized and placed in a bath, the non-uniform deposition of electrodeposit called "stepping", which has been a problem until now, can be changed to continuous and uniform deposition by threshold 3. can.
第２図は第１図の平面図である。FIG. 2 is a plan view of FIG. 1.
第３図は、本発明の別の実施例を示すフレキシブル基板
用の電着装置の主要断面図であり、第４図は、第３図の
平面図である。９は、円筒状の絶縁体で、これにより、
フレキシブル基板の入槽部付近７と対極６の間の電気抵
抗は著しく高くして、通電入槽における入槽部付近７で
の不均一で急激な電着物の析出を防いでいる。FIG. 3 is a main sectional view of an electrodeposition apparatus for a flexible substrate showing another embodiment of the present invention, and FIG. 4 is a plan view of FIG. 3. 9 is a cylindrical insulator, so that
The electrical resistance between the vicinity of the bath entry part 7 of the flexible substrate and the counter electrode 6 is made extremely high to prevent uneven and rapid deposition of electrodeposit near the bath entry part 7 in the energized bath.
［発明の効果］
絶縁フィルムに金属箔を接着してなるフレキシブル基板
又は金属箔からなるフレキシブル基板の金属箔上にフォ
トレジスト又はレジストを電着塗装する装置において、
前記フレキシブル基板の電着液槽への入槽部と対極の間
に絶縁体によるしきいを設げたので、通電入槽による均
一な膜厚の電着が可能となり、塗装能力が大きく、電着
不良部の生じないフレキシブル基板の電着塗装を行うこ
とができる。[Effect of the invention] In an apparatus for electrocoating a photoresist or a resist on a flexible substrate formed by adhering a metal foil to an insulating film or a metal foil of a flexible substrate made of a metal foil,
Since an insulating threshold is provided between the part where the flexible substrate enters the electrodeposition liquid bath and the counter electrode, it is possible to electrodeposit a uniform film thickness using the energized bath, and the coating capacity is large. Flexible substrates can be electrodeposited without producing any defective parts.
第１図は本発明による実施例を示すフレキシブル基板用
の電着装置の主要断面図。
第２図は第１図の平面図。
第３図は本発明による別の実施例を示すフレキシブル基
板用の電着装置の主要断面図。
第４図は第５図の平面図。
第５図は従来例を示す電着装置の主要断面図。
１・・・・・・・・・電着液
２・・・・・・・・・電着槽
５・・・・・・・・・しきい
４・・・・・・・・・フレキシブル基板搬送用ローラー
５・・・・・・・・・フレキシブル基板６・・・・・・
・・・対 極
７・・・・・・・・・人権部付近のフレキシブル基板８
・・・・・・・・・入槽部より２０〜５０ｃｍ入ったと
ころのフレキシブル基板
９・・・・・・・・・円筒状の絶縁体
以上FIG. 1 is a main sectional view of an electrodeposition apparatus for flexible substrates showing an embodiment of the present invention. FIG. 2 is a plan view of FIG. 1. FIG. 3 is a main sectional view of an electrodeposition apparatus for flexible substrates showing another embodiment of the present invention. FIG. 4 is a plan view of FIG. 5. FIG. 5 is a main sectional view of a conventional electrodeposition apparatus. 1... Electrodeposition liquid 2... Electrodeposition tank 5... Threshold 4... Flexible substrate Conveyance roller 5...Flexible substrate 6...
...Counter electrode 7...Flexible circuit board 8 near the Human Rights Department
......Flexible board 9 at a point 20 to 50 cm deeper than the tank entry section...More than a cylindrical insulator
Claims (1)
又は金属箔からなるフレキシブル基板の金属箔上にフォ
トレジスト又はレジストを電着塗装する装置において、 前記フレキシブル基板の電着液槽への入槽部と対極の間
に、絶縁体によるしきいを設けたことを特徴とするフレ
キシブル基板用の電着塗装装置。[Scope of Claims] An apparatus for electrodepositing a photoresist or a resist on a flexible substrate formed by adhering a metal foil to an insulating film or a flexible substrate made of metal foil, comprising: an electrodeposition liquid bath for the flexible substrate; An electrodeposition coating device for flexible substrates, characterized in that a threshold made of an insulator is provided between an entry tank and a counter electrode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28353089A JPH03145187A (en) | 1989-10-31 | 1989-10-31 | Electrodeposition coating device of flexible board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP28353089A JPH03145187A (en) | 1989-10-31 | 1989-10-31 | Electrodeposition coating device of flexible board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03145187A true JPH03145187A (en) | 1991-06-20 |
Family
ID=17666729
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP28353089A Pending JPH03145187A (en) | 1989-10-31 | 1989-10-31 | Electrodeposition coating device of flexible board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03145187A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8234993B2 (en) | 2009-05-26 | 2012-08-07 | Ricoh Company, Limited | Impact detector and packaging container |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS514307U (en) * | 1974-06-26 | 1976-01-13 | ||
| JPS5810476A (en) * | 1981-07-02 | 1983-01-21 | 日東精工株式会社 | Industrial robot |
-
1989
- 1989-10-31 JP JP28353089A patent/JPH03145187A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS514307U (en) * | 1974-06-26 | 1976-01-13 | ||
| JPS5810476A (en) * | 1981-07-02 | 1983-01-21 | 日東精工株式会社 | Industrial robot |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8234993B2 (en) | 2009-05-26 | 2012-08-07 | Ricoh Company, Limited | Impact detector and packaging container |
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