JPH0314063Y2 - - Google Patents
Info
- Publication number
- JPH0314063Y2 JPH0314063Y2 JP1984074510U JP7451084U JPH0314063Y2 JP H0314063 Y2 JPH0314063 Y2 JP H0314063Y2 JP 1984074510 U JP1984074510 U JP 1984074510U JP 7451084 U JP7451084 U JP 7451084U JP H0314063 Y2 JPH0314063 Y2 JP H0314063Y2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- detected
- multilayer printed
- clearance
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 11
- 239000000758 substrate Substances 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7451084U JPS60187558U (ja) | 1984-05-23 | 1984-05-23 | 多層印刷配線板回路の誤配線検出ゲ−ジ |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP7451084U JPS60187558U (ja) | 1984-05-23 | 1984-05-23 | 多層印刷配線板回路の誤配線検出ゲ−ジ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60187558U JPS60187558U (ja) | 1985-12-12 |
JPH0314063Y2 true JPH0314063Y2 (ko) | 1991-03-28 |
Family
ID=30614878
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP7451084U Granted JPS60187558U (ja) | 1984-05-23 | 1984-05-23 | 多層印刷配線板回路の誤配線検出ゲ−ジ |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60187558U (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53109177A (en) * | 1977-03-04 | 1978-09-22 | Tokyo Shibaura Electric Co | Method of detecting pattern position displacement of multilayer printed circuit board |
-
1984
- 1984-05-23 JP JP7451084U patent/JPS60187558U/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS53109177A (en) * | 1977-03-04 | 1978-09-22 | Tokyo Shibaura Electric Co | Method of detecting pattern position displacement of multilayer printed circuit board |
Also Published As
Publication number | Publication date |
---|---|
JPS60187558U (ja) | 1985-12-12 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5498500A (en) | Overlay measurement mark and method of measuring an overlay error between multi patterns in a semiconductor device using the measurement mark | |
KR880005842A (ko) | 다층 인쇄회로 기판의 예비 드릴 공정을 위한 시스템 및 방법 | |
JPH0314063Y2 (ko) | ||
US3591284A (en) | Printed circuit layout means | |
JPH04506728A (ja) | 多層印刷回路基板及びその所定順序での組立て状態検査方法 | |
JP2734367B2 (ja) | 多層プリント配線板およびその製造方法 | |
US4918380A (en) | System for measuring misregistration | |
JPH0391993A (ja) | 多層プリント配線板の内層ずれ測定方法 | |
JPH0418718B2 (ko) | ||
JPH11307890A (ja) | プリント配線板 | |
JPH0238287Y2 (ko) | ||
JPH0126120Y2 (ko) | ||
JPH0135493Y2 (ko) | ||
JP3857404B2 (ja) | プリント配線基板 | |
JPS587654Y2 (ja) | 印刷配線板 | |
JPS63155686A (ja) | 配線基板およびその製造方法 | |
GB1535813A (en) | Multi-layer circuit board | |
JPH0621270Y2 (ja) | プリント配線板 | |
JPH01117777U (ko) | ||
JPH0621657A (ja) | 多層プリント配線板の層編成チェック用パターン | |
JPS59182977U (ja) | 多層印刷配線板 | |
JPH04365395A (ja) | 多層基板 | |
JPH01104770U (ko) | ||
JPH04101497A (ja) | 内層材製造用フィルム及び該フィルムを使用した多層プリント配線板の製造方法 | |
JPH0699334A (ja) | 多層基板の加工位置補正方法 |