JPH03138096A - Brazing material for electronic parts - Google Patents
Brazing material for electronic partsInfo
- Publication number
- JPH03138096A JPH03138096A JP27332289A JP27332289A JPH03138096A JP H03138096 A JPH03138096 A JP H03138096A JP 27332289 A JP27332289 A JP 27332289A JP 27332289 A JP27332289 A JP 27332289A JP H03138096 A JPH03138096 A JP H03138096A
- Authority
- JP
- Japan
- Prior art keywords
- brazing
- electronic parts
- brazing material
- strength
- stable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005219 brazing Methods 0.000 title claims abstract description 30
- 239000000463 material Substances 0.000 title abstract description 12
- 229910052732 germanium Inorganic materials 0.000 claims abstract description 4
- 229910052738 indium Inorganic materials 0.000 claims abstract description 4
- 229910052733 gallium Inorganic materials 0.000 claims abstract description 3
- 229910001020 Au alloy Inorganic materials 0.000 claims abstract 3
- 239000000945 filler Substances 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 238000013508 migration Methods 0.000 abstract description 6
- 230000005012 migration Effects 0.000 abstract description 6
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 229910002555 FeNi Inorganic materials 0.000 description 2
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011780 sodium chloride Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は、電子部品のろう付けに用いるろう材に関する
。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a brazing material used for brazing electronic components.
（従来技術とその課題）
従来、ＩＣパッケージ等の電子部品と外部ＩＪ−ド等と
のろう付けには一般にＡ ｇ Ｃｕ ２８ｗｔ％、Ａ
ｇ Ｃｕ １５ｗｔ％が多く用いられている。(Prior art and its problems) Conventionally, A g Cu 28wt%, A g Cu 28 wt%, A
g Cu 15wt% is often used.
これらろう付げにおいては、近年の小型化、高密度化に
ともない、リード間隔が狭くなるについて、使用時の電
圧及び使用雰囲気中の湿気により、ろう相成分のヒゲ状
、デンドライト状生成物が生成、成長し隣りのリードと
短絡する、いわゆるエレクトロマイグレーションが生じ
て短絡が発生し機能を損なう頻度が高（なっている。In these brazing processes, as the lead spacing becomes narrower due to miniaturization and higher density in recent years, whisker-like and dendrite-like products of the wax phase component are generated due to the voltage during use and the humidity in the use atmosphere. , so-called electromigration, which grows and short-circuits with neighboring leads, occurs, resulting in short-circuits and loss of functionality.
（発明の目的）
本発明は、上記課題を解決すべ（なされたもので、マイ
グレーションの発生を防止でき、強固で安定したろう付
は強度の得られるろう材を提供するものである。(Objective of the Invention) The present invention has been made to solve the above-mentioned problems, and provides a brazing material that can prevent migration and provide strong and stable brazing strength.
（発明の構成）
本発明のろう材は、Ａｇ１Ｏ〜３５ｗｔ％、Ｉｎ、Ｇｅ
及びＧａのうち少な（とも１種類を合計で３〜１５ｗｔ
％及び残部ＡｕのＡｕ合金から成ることを特徴とするも
のである。(Structure of the Invention) The brazing filler metal of the present invention contains Ag1O to 35wt%, In, Ge
and a small amount of Ga (each type is 3 to 15 wt in total)
% and the balance is Au.
（作用）
上記のように構成された本発明のろう材においては、Ａ
ｕを主成分とすることでエレクトロマイグレーションを
防止できるもので、Ａｇを１０〜３５ｗｔ％加えるのは
、゛ろう付は強度を得る為である。(Function) In the brazing material of the present invention configured as described above, A
Electromigration can be prevented by having u as the main component, and the reason why 10 to 35 wt% of Ag is added is to obtain strength during brazing.
ここでＡｇが１０ｗｔ％未満ではろう付は強度が得られ
ず、Ａｇ３５ｗｔ％を超えるとエレクト口マイグレ−ジ
ョンが発生するからである。This is because if the Ag content is less than 10 wt%, brazing strength cannot be obtained, and if the Ag content exceeds 35 wt%, electric port migration will occur.
またＩｎ、Ｇｅ及びＧａのうち少なくとも１種類を合計
で３〜１５ｗｔ％加えるのは、融点を下げる為でａｗｔ
％未満では、効果が期待できず、１５ｗｔ％を超えると
加工性に問題が発生するからである。Also, the reason why at least one of In, Ge, and Ga is added in a total of 3 to 15 wt% is to lower the melting point.
If it is less than 15 wt%, no effect can be expected, and if it exceeds 15 wt%, problems will occur in workability.
（実施例）
以下に実施例と従来例について説明し、本発明の効果を
明瞭にならしめる。(Example) Examples and conventional examples will be described below to clearly demonstrate the effects of the present invention.
表に示す材料組織のろう材を作成し、これら材料でのエ
レクトロマイグレーションの程度及びろう付は強度を試
験し、以下の結果を得た。Brazing materials having the material structure shown in the table were prepared, and the degree of electromigration and brazing strength of these materials were tested, and the following results were obtained.
（以下余白）
（以下余白）
なお、エレクトロマイグレーションは、以下のＷａｔｅ
ｒ Ｄｒｏｐ Ｔｅ５ｔ （マイグレーション加速試
験）により行った。これは第１図のように、ガラス板３
の上に前記ろう材からなる板ｌ、■をその間隔が約１ｍ
ｍになるように、平行に配置し、その間に純水を保持し
つつこのろう材の板ｌ、１間に５ｖの直流電圧を印加し
、マイグレーションが発生して短絡するまでの時間を測
定した。(Hereafter the margin) (Hereafter the margin) Electromigration is the following Wate
r Drop Te5t (migration accelerated test). This is the glass plate 3 as shown in Figure 1.
Place the plates l and ■ made of the brazing filler metal on top with a spacing of about 1 m.
A DC voltage of 5V was applied between the brazing filler metal plates L and 1 while pure water was held between them, and the time until migration occurred and a short circuit occurred was measured. .
ろう付は強度は、材質ＦｅＮｉ４２％、寸法５ＷＸ１ｔ
Ｘ５０１と材質ＦｅＮｉ４２％、寸法５Ｗ×１１ｘ５０
１をろう付は後のろう付は強度（ｋｇ／ｎｖ＋ｆ）及び
１％ＮａＣ１溶液中で１００時間放置後のろう付は強度
を測定した。The strength of brazing is 42% FeNi, and the dimensions are 5W x 1t.
X501 and material FeNi 42%, dimensions 5W x 11 x 50
The strength (kg/nv+f) of brazing after brazing No. 1 and the strength (kg/nv+f) of brazing after standing in a 1% NaCl solution for 100 hours were measured.
（発明の効果）
以上の説明から明らかなように本発明のろう材は強固で
安定したろう付は強度で、マイグレーションも生じに（
いという優れた効果を有するもので、ＩＣパッケージ等
の電子部品のろう付けに好適である。(Effects of the Invention) As is clear from the above explanation, the brazing material of the present invention has a strong and stable brazing strength, and does not cause migration (
It has an excellent effect of being flexible and is suitable for brazing electronic components such as IC packages.
第１図はエレクトロマイグレーションの試験方法を模式
的に示す説明図である。FIG. 1 is an explanatory diagram schematically showing an electromigration test method.
Claims (1)
少なくとも１種類を合計で３〜１５ｗｔ％及び残部Ａｕ
のＡｕ合金から成ることを特徴とする電子部品用ろう材
。1) 10 to 35 wt% of Ag, a total of 3 to 15 wt% of at least one of In, Ge, and Ga, and the balance is Au
A brazing filler metal for electronic parts, characterized in that it is made of an Au alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1273322A JP2731435B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1273322A JP2731435B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03138096A true JPH03138096A (en) | 1991-06-12 |
| JP2731435B2 JP2731435B2 (en) | 1998-03-25 |
Family
ID=17526268
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1273322A Expired - Lifetime JP2731435B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2731435B2 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010010833A1 (en) * | 2008-07-24 | 2010-01-28 | 田中貴金属工業株式会社 | Au-Ga-In BRAZING FILLER METAL |
| JP2014097521A (en) * | 2012-11-14 | 2014-05-29 | Sumitomo Metal Mining Co Ltd | Au-Ag-Ge TYPE SOLDER ALLOY |
| JP2015208777A (en) * | 2014-04-30 | 2015-11-24 | 住友金属鉱山株式会社 | BALL-LIKE Au-Ag-Ge BASED SOLDER ALLOY, ELECTRONIC COMPONENT SEALED USING THE BALL-LIKE Au-Ag-Ge BASED SOLDER ALLOY, AND DEVICE MOUNTED WITH THE ELECTRONIC COMPONENT |
| JP2016033992A (en) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | Semiconductor device manufacturing method, bonding material and bonding material formation method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151992A (en) * | 1982-03-05 | 1983-09-09 | Citizen Watch Co Ltd | Gold brazing material |
| JPS6431592A (en) * | 1987-07-27 | 1989-02-01 | Mitsubishi Heavy Ind Ltd | Gold filler metal for brazing |
| JPS6462296A (en) * | 1987-08-29 | 1989-03-08 | Tokuriki Honten Kk | Gold brazing alloy |
-
1989
- 1989-10-20 JP JP1273322A patent/JP2731435B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58151992A (en) * | 1982-03-05 | 1983-09-09 | Citizen Watch Co Ltd | Gold brazing material |
| JPS6431592A (en) * | 1987-07-27 | 1989-02-01 | Mitsubishi Heavy Ind Ltd | Gold filler metal for brazing |
| JPS6462296A (en) * | 1987-08-29 | 1989-03-08 | Tokuriki Honten Kk | Gold brazing alloy |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010010833A1 (en) * | 2008-07-24 | 2010-01-28 | 田中貴金属工業株式会社 | Au-Ga-In BRAZING FILLER METAL |
| CN102083582A (en) * | 2008-07-24 | 2011-06-01 | 田中贵金属工业株式会社 | Au-Ga-In brazing filler metal |
| JP5421915B2 (en) * | 2008-07-24 | 2014-02-19 | 田中貴金属工業株式会社 | Au-Ga-In brazing material |
| US9604317B2 (en) | 2008-07-24 | 2017-03-28 | Tanaka Kikinzoku Kogyo K.K. | Au—Ga—In brazing material |
| JP2014097521A (en) * | 2012-11-14 | 2014-05-29 | Sumitomo Metal Mining Co Ltd | Au-Ag-Ge TYPE SOLDER ALLOY |
| JP2015208777A (en) * | 2014-04-30 | 2015-11-24 | 住友金属鉱山株式会社 | BALL-LIKE Au-Ag-Ge BASED SOLDER ALLOY, ELECTRONIC COMPONENT SEALED USING THE BALL-LIKE Au-Ag-Ge BASED SOLDER ALLOY, AND DEVICE MOUNTED WITH THE ELECTRONIC COMPONENT |
| JP2016033992A (en) * | 2014-07-31 | 2016-03-10 | 富士電機株式会社 | Semiconductor device manufacturing method, bonding material and bonding material formation method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2731435B2 (en) | 1998-03-25 |
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