JP2731433B2 - Electromigration-preventing brazing material and electronic parts brazed with external leads - Google Patents
Electromigration-preventing brazing material and electronic parts brazed with external leadsInfo
- Publication number
- JP2731433B2 JP2731433B2 JP1273320A JP27332089A JP2731433B2 JP 2731433 B2 JP2731433 B2 JP 2731433B2 JP 1273320 A JP1273320 A JP 1273320A JP 27332089 A JP27332089 A JP 27332089A JP 2731433 B2 JP2731433 B2 JP 2731433B2
- Authority
- JP
- Japan
- Prior art keywords
- electromigration
- brazing material
- brazing
- brazed
- external leads
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
- Lead Frames For Integrated Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、電子部品のろう付けに用いるエレクトロマ
イグレーション防止性ろう材及びこのろう材で外部リー
ドをろう付けした電子部品に関する。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electromigration-preventing brazing material used for brazing an electronic component, and an electronic component having an external lead brazed with the brazing material.
（従来技術とその課題） 従来、ICパッケージ等の電子部品と外部リード等との
ろう付けには一般にAgCu28wt％、AgCu15wt％が多く用い
られている。(Prior art and its problems) Conventionally, 28% by weight of AgCu and 15% by weight of AgCu are generally used for brazing electronic parts such as IC packages to external leads.
これらろう付けにおいては、近年の小型化、高密度化
にともない、リード間隔が狭くなるについて、使用時の
電圧及び使用雰囲気中の湿気により、ろう材成分のヒゲ
状、デンドライト状生成物が生成、成長し隣りのリード
と短絡する、いわゆるエレクトロマイグレーションが生
じて短絡が発生し機能を損なう頻度が高くなっている。In these brazings, with the recent miniaturization and high density, the lead interval is becoming narrower, and due to the voltage at the time of use and the humidity in the use atmosphere, a whisker-like and dendrite-like product of the brazing material component is generated. The so-called electromigration that grows and short-circuits with an adjacent lead, that is, a short-circuit occurs and the function is impaired more frequently.
（発明の目的） 本発明は、上記課題を解決すべくなされたもので、マ
イグレーションの発生を防止でき、強固で安定したろう
付け強度の得られるろう材を提供し、さらにはマイグレ
ーションの生じ難い電子部品を提供するものである。(Object of the Invention) The present invention has been made in order to solve the above-mentioned problems, and provides a brazing material which can prevent the occurrence of migration, can provide a strong and stable brazing strength, and furthermore, has an electron which hardly causes migration. Provide parts.
（発明の構成） 本発明のエレクトロマイグレーション防止性ろう材
は、電子部品のパッケージングにおいて外部リードのろ
う付けに用いられるろう材であって、Pd3〜15wt％、Ni3
〜15wt％、Ge及びGaのうち少なくとも１種類を合計で５
〜20wt％及び残部AuのAu合金であり、かつ上記エレクト
ロマイグレーションテストにおいて短絡するまでの時間
が2.5時間以上であることを特徴とする。(Structure of the Invention) The electromigration-preventing brazing material of the present invention is a brazing material used for brazing external leads in the packaging of electronic components.
~ 15wt%, at least one of Ge and Ga is 5 in total
It is characterized in that it is an Au alloy of about 20 wt% and the balance of Au, and that a time until a short circuit occurs in the electromigration test is 2.5 hours or more.
また、本発明の外部リードをろう付けした電子部品
は、上記したろう材により外部リードをろう付けして成
ることを特徴とするものである。The electronic component according to the present invention, wherein the external lead is brazed, is characterized in that the external lead is brazed with the above-mentioned brazing material.
（作用） 上記のように構成された本発明のエレクトロマイグレ
ーション防止性ろう材においては、いずれもAuを主成分
とすることでエレクトロマイグレーションを防止できる
もので、Pd及びNiそれぞれ３〜15wt％加えるのは、ろう
付け強度及び濡れ性を得る為である。ここでPd及びNiが
3wt％未満ではろう付け強度が得られず、15wt％を超え
るエレクトロマイグレーションが発生し、またNi15wt％
を超えると融点が高くなり好ましくないからである。(Effect) In the electromigration preventing brazing material of the present invention configured as described above, any of which can prevent electromigration by using Au as a main component, each of Pd and Ni is added at 3 to 15 wt%. Is to obtain brazing strength and wettability. Where Pd and Ni
If less than 3 wt%, brazing strength cannot be obtained, electromigration exceeding 15 wt% occurs, and Ni15 wt%
If the melting point exceeds the above range, the melting point becomes high, which is not preferable.
また更に、Ge及びGaのうち少なくとも１種類を合計で
５〜20wt％加えるのは、融点を下げる為で5wt％未満で
は効果が期待できず、20wt％を超えると加工性に問題が
発生するからである。Further, the addition of at least one of Ge and Ga in a total amount of 5 to 20% by weight is intended to lower the melting point, so that an effect of less than 5% by weight cannot be expected, and a problem of workability occurs if it exceeds 20% by weight. It is.
（実施例） 以下に実施例と従来例について説明し、本発明の効果
を明瞭にならしめる。(Examples) Examples and conventional examples will be described below to clarify the effects of the present invention.
表に示す材料組織のろう材を作成し、これら材料での
エレクトロマイグレーションの程度及びろう付け強度を
試験し、以下の結果を得た。Brazing materials having the material structures shown in the table were prepared, and the degree of electromigration and the brazing strength of these materials were tested. The following results were obtained.
なお、エレクトロマイグレーションは、以下のWater
Drop Test（マイグレーション加速試験）により行っ
た。これは第１図のように、ガラス板３の上に前記ろう
材からなる板１、１をその間隔が約1mmになるように、
平行に配置し、その間に純水を保持しつつこのろう材の
板１、１間に5Vの直流電圧を印加し、マイグレーション
が発生して短絡するまでの時間を測定した。 In addition, electromigration is the following Water
It was performed by Drop Test (migration acceleration test). This, as shown in FIG. 1, places the plates 1 and 1 made of the brazing material on a glass plate 3 so that the distance between them is about 1 mm.
A 5 V DC voltage was applied between the brazing plates 1 and 1 while holding the pure water between them, and the time required for migration to occur and short-circuiting was measured.
ろう付け強度は、材質FeNi42％、寸法2t×5W×50lと
材質FeNi42％、寸法2t×5W×50lをろう付け後のろう付
け強度（kg/mm2）及び１％NaCl溶液中で100時間放置後
のろう付け強度を測定した。Brazing strength material FeNi42%, dimension 2t × 5W × 50 l and material FeNi42%, 100 hours left dimension 2t × 5W × 50 l brazing strength after brazing (kg / mm 2) and in 1% NaCl solution The subsequent brazing strength was measured.
（発明の効果） 以上の説明から明らかなように本発明のエレクトロマ
イグレーション防止性ろう材は強固で安定したろう付け
強度で、マイグレーションも生じにくいという優れた効
果を有するもので、ICパッケージ等の電子部品のろう付
けに好適である。また、電子部品に外部リードをろう付
けする際に本発明のろう材を使用すれば、外部リードは
強固で安定したろう付け強度でろう付けされ、さらにマ
イグレーションを生じにくい電子部品とすることができ
る。(Effects of the Invention) As is clear from the above description, the electromigration-preventing brazing material of the present invention has a strong and stable brazing strength and has an excellent effect that migration does not easily occur. Suitable for brazing parts. Further, when the brazing material of the present invention is used when brazing an external lead to an electronic component, the external lead is brazed with a strong and stable brazing strength, and furthermore, it is possible to obtain an electronic component that does not easily cause migration. .
第１図はエレクトロマイグレーションの試験方法を模式
的に示す説明図である。FIG. 1 is an explanatory view schematically showing a test method of electromigration.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭64−31591（ＪＰ，Ａ) 特開 平３−66493（ＪＰ，Ａ) 特開 平３−138095（ＪＰ，Ａ) 特開 平３−138096（ＪＰ，Ａ) ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-64-31591 (JP, A) JP-A-3-66493 (JP, A) JP-A-3-138095 (JP, A) JP-A-3-315 138096 (JP, A)
Claims (2)
ードのろう付けに用いられるろう材であって、Pd3〜15w
t％、Ni3〜15wt％、Ge及びGaのうち少なくとも１種類を
合計で５〜20wt％及び残部AuのAu合金であり、かつ下記
エレクトロマイグレーションテストにおいて短絡するま
での時間が2.5時間以上であることを特徴とするエレク
トロマイグレーション防止性ろう材。 〔エレクトロマイグレーション〕 ガラス板上に、上記ろう材からなる二枚の板を1mmの間
隔で平行に配置し、その間に純水を保持しつつ上記二枚
のろう材の間に5Vの直流電流を印加し、エレクトロマイ
グレーションが発生して短絡するまでの時間を測定す
る。1. A brazing material used for brazing external leads in the packaging of electronic components, comprising Pd3 to 15w.
t%, Ni3 to 15 wt%, at least one of Ge and Ga is a total of 5 to 20 wt% and the balance Au is an Au alloy, and the time until a short circuit in the following electromigration test is 2.5 hours or more. An electromigration preventing brazing material characterized by the following: (Electromigration) On a glass plate, two plates made of the above brazing material are arranged in parallel at an interval of 1 mm, and a DC current of 5 V is applied between the two brazing materials while holding pure water therebetween. The voltage is applied, and the time until electromigration occurs and short-circuit is measured.
ろう付けして成ることを特徴とする外部リードをろう付
けした電子部品。2. An electronic component to which an external lead is brazed, wherein the external lead is brazed by the brazing material according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1273320A JP2731433B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1273320A JP2731433B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03138094A JPH03138094A (en) | 1991-06-12 |
| JP2731433B2 true JP2731433B2 (en) | 1998-03-25 |
Family
ID=17526242
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1273320A Expired - Lifetime JP2731433B2 (en) | 1989-10-20 | 1989-10-20 | Electromigration-preventing brazing material and electronic parts brazed with external leads |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2731433B2 (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6431591A (en) * | 1987-07-27 | 1989-02-01 | Mitsubishi Heavy Ind Ltd | Gold filler metal for brazing |
-
1989
- 1989-10-20 JP JP1273320A patent/JP2731433B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH03138094A (en) | 1991-06-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3671815B2 (en) | Solder composition and soldered article | |
| JP3220635B2 (en) | Solder alloy and cream solder | |
| JP3761678B2 (en) | Tin-containing lead-free solder alloy, cream solder thereof, and manufacturing method thereof | |
| JP3684811B2 (en) | Solder and soldered articles | |
| JP4240356B2 (en) | Pb-free solder composition and soldered article | |
| JPH0784631B2 (en) | Copper alloy for electronic devices | |
| JP2731435B2 (en) | Electromigration-preventing brazing material and electronic parts brazed with external leads | |
| JPH08132277A (en) | Leadless solder | |
| JP2731434B2 (en) | Electromigration-preventing brazing material and electronic parts brazed with external leads | |
| JP2731433B2 (en) | Electromigration-preventing brazing material and electronic parts brazed with external leads | |
| JP2714560B2 (en) | Copper alloy with good direct bonding properties | |
| JP2727021B2 (en) | Electromigration prevention brazing material | |
| JP2000096167A (en) | Titanium - nickel target material, electrode material and packaging component | |
| JPH05128910A (en) | Conductor paste | |
| JP3090549B2 (en) | Bonding wire for semiconductor device | |
| JP3074626B2 (en) | Pt alloy ultrafine wires for semiconductor devices | |
| JP3423387B2 (en) | Solder alloy for electronic components | |
| JP2001025891A (en) | Lead-free solder | |
| JP2000169922A (en) | Molybdenum-nickel target material, electrode material, and packaging component | |
| JP7032687B1 (en) | Solder alloys, solder pastes, solder balls, solder preforms, and solder fittings | |
| JP3700668B2 (en) | Solder and soldered articles | |
| JPH0819892A (en) | Lead free soldering alloy | |
| JP2000169957A (en) | Vanadium-nickel target material, electrode material, and packaging component | |
| JP2686548B2 (en) | Brazing material | |
| JPH02251155A (en) | Gold alloy thin wire for semiconductor elements and bonding method thereof |