JPH0313763U - - Google Patents
Info
- Publication number
- JPH0313763U JPH0313763U JP1989075070U JP7507089U JPH0313763U JP H0313763 U JPH0313763 U JP H0313763U JP 1989075070 U JP1989075070 U JP 1989075070U JP 7507089 U JP7507089 U JP 7507089U JP H0313763 U JPH0313763 U JP H0313763U
- Authority
- JP
- Japan
- Prior art keywords
- mold
- lead frame
- positioning
- molding
- jig
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000465 moulding Methods 0.000 claims description 5
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000004065 semiconductor Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075070U JPH0755007Y2 (ja) | 1989-06-27 | 1989-06-27 | Ｌｅｄ成形用治具 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075070U JPH0755007Y2 (ja) | 1989-06-27 | 1989-06-27 | Ｌｅｄ成形用治具 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0313763U true JPH0313763U (es) | 1991-02-12 |
| JPH0755007Y2 JPH0755007Y2 (ja) | 1995-12-18 |
Family
ID=31615324
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989075070U Expired - Lifetime JPH0755007Y2 (ja) | 1989-06-27 | 1989-06-27 | Ｌｅｄ成形用治具 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0755007Y2 (es) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225911A (ja) * | 1999-01-11 | 2000-08-15 | Takata Corp | 膝支持装置 |
| JP2007030733A (ja) * | 2005-07-28 | 2007-02-08 | Nippon Plast Co Ltd | エアバッグ装置 |
| JP2017045771A (ja) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | パワー半導体モジュールの製造方法及びパワー半導体モジュール |
-
1989
- 1989-06-27 JP JP1989075070U patent/JPH0755007Y2/ja not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000225911A (ja) * | 1999-01-11 | 2000-08-15 | Takata Corp | 膝支持装置 |
| JP2007030733A (ja) * | 2005-07-28 | 2007-02-08 | Nippon Plast Co Ltd | エアバッグ装置 |
| JP2017045771A (ja) * | 2015-08-24 | 2017-03-02 | 京セラ株式会社 | パワー半導体モジュールの製造方法及びパワー半導体モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0755007Y2 (ja) | 1995-12-18 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| EXPY | Cancellation because of completion of term |