JPH0313749U - - Google Patents
Info
- Publication number
- JPH0313749U JPH0313749U JP1989075880U JP7588089U JPH0313749U JP H0313749 U JPH0313749 U JP H0313749U JP 1989075880 U JP1989075880 U JP 1989075880U JP 7588089 U JP7588089 U JP 7588089U JP H0313749 U JPH0313749 U JP H0313749U
- Authority
- JP
- Japan
- Prior art keywords
- cooling
- solder
- heat transfer
- heat
- solder sheet
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73253—Bump and layer connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075880U JPH0313749U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1989075880U JPH0313749U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0313749U true JPH0313749U (enrdf_load_stackoverflow) | 1991-02-12 |
Family
ID=31616851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1989075880U Pending JPH0313749U (enrdf_load_stackoverflow) | 1989-06-27 | 1989-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0313749U (enrdf_load_stackoverflow) |
-
1989
- 1989-06-27 JP JP1989075880U patent/JPH0313749U/ja active Pending
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