JPH03136212A - Surface mounting type network electronic part - Google Patents
Surface mounting type network electronic partInfo
- Publication number
- JPH03136212A JPH03136212A JP27417389A JP27417389A JPH03136212A JP H03136212 A JPH03136212 A JP H03136212A JP 27417389 A JP27417389 A JP 27417389A JP 27417389 A JP27417389 A JP 27417389A JP H03136212 A JPH03136212 A JP H03136212A
- Authority
- JP
- Japan
- Prior art keywords
- insulated substrate
- electrode
- lead terminal
- lead
- end side
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims abstract description 5
- 239000004020 conductor Substances 0.000 claims abstract description 5
- 238000000605 extraction Methods 0.000 claims description 9
- -1 resistors Substances 0.000 claims 1
- 238000005476 soldering Methods 0.000 abstract description 7
- 238000000465 moulding Methods 0.000 abstract description 6
- 229920005989 resin Polymers 0.000 abstract description 4
- 239000011347 resin Substances 0.000 abstract description 4
- 239000000463 material Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 230000002787 reinforcement Effects 0.000 abstract description 3
- 239000007769 metal material Substances 0.000 abstract description 2
- 230000003014 reinforcing effect Effects 0.000 description 7
- 230000001681 protective effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- WOCIAKWEIIZHES-UHFFFAOYSA-N ruthenium(iv) oxide Chemical compound O=[Ru]=O WOCIAKWEIIZHES-UHFFFAOYSA-N 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 241000272168 Laridae Species 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 229920006015 heat resistant resin Polymers 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
Landscapes
- Details Of Resistors (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、抵抗、コンデンサなどの電子部品を複数個同
一パッケージ内に形成した面実装形ネットワーク電子部
品に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a surface-mount network electronic component in which a plurality of electronic components such as resistors and capacitors are formed in the same package.
従来の技術
近年、電子機器の小形、薄形化にともない、抵抗、コン
デンサなどの受動部品を複数個同一パッケージに形成し
たネットワーク電子部品が多く用いられている。しかし
ながら、よシ軽薄短小化の流れからこれらも面実装タイ
プのものが考案されている。BACKGROUND OF THE INVENTION In recent years, as electronic devices have become smaller and thinner, network electronic components in which a plurality of passive components such as resistors and capacitors are formed in the same package are increasingly being used. However, due to the trend towards smaller, lighter, thinner and smaller devices, surface mount type devices have been devised.
その−例を第３図で説明する。An example thereof will be explained with reference to FIG.
これは、特開昭６３−ｔ１００３号公報に見られるもの
で、絶縁基板１の片面に抵抗体２と導体３を形成したネ
ットワーク電子部品を縦形に実装し、外部取出用電極４
とプリント基板６０半田付ランド（図示せず）をクリー
ム半田によるりフロー式半田付や、その他の半田付技法
で取りつけるものである。This is seen in Japanese Patent Application Laid-Open No. 63-t1003, in which a network electronic component with a resistor 2 and a conductor 3 formed on one side of an insulating substrate 1 is vertically mounted, and an external lead electrode 4 is mounted vertically.
and a printed circuit board 60 with soldering lands (not shown) are attached using cream solder, flow soldering, or other soldering techniques.
また、別の従来例を第４図により説明する。第４図に示
すものはネットワークチップと呼ばれている面実装タイ
プネットワークであり、絶縁基板１０両端部に凹部を設
け、そして外部取出用電極４を基板表面と半円形の凹部
の内面に導電材料を焼きつけて形成し、その電極間に抵
抗体２を印刷。Another conventional example will be explained with reference to FIG. The one shown in Fig. 4 is a surface-mount type network called a network chip, in which a recess is provided at both ends of an insulating substrate 10, and an electrode 4 for external extraction is made of conductive material on the surface of the substrate and the inner surface of the semicircular recess. is formed by baking, and a resistor 2 is printed between the electrodes.
焼成し、保護塗装６をほどこした構成となっている。It has a structure in which it is fired and a protective coating 6 is applied.
発明が解決しようとする課題
以上説明した従来の面実装ネットワーク電子部品は以下
に示す欠点を有している。第１は機械的強度の問題であ
り、外部取出用電極がプリント基板の半田付ランドと直
接半田付されるため、プリント基板と絶縁基板の線膨張
係数の違いから、半田付部のクラックが発生しやすい。Problems to be Solved by the Invention The conventional surface-mounted network electronic components described above have the following drawbacks. The first problem is mechanical strength. Since the external electrode is directly soldered to the soldering land of the printed circuit board, cracks occur at the soldered part due to the difference in linear expansion coefficient between the printed circuit board and the insulating board. It's easy to do.
まだ、絶縁基板内に収める素子数を増加すると、絶縁基
板が長くなり、プリント基板が機械的力を受けて曲げら
れる際に絶縁基板が折損する。However, increasing the number of elements housed within an insulating substrate increases the length of the insulating substrate, and the insulating substrate may break when the printed circuit board is bent under mechanical force.
第２は実装性の問題で、第３図のものは実装時の吸着、
搬送時に絶縁基板の表面粗度及び吸着面積を広くとるこ
との困難さから吸着パッドよりの真空洩れが発生し、プ
リント基板への装着に不安定さがあることである。The second problem is mountability, and the one in Figure 3 is the adsorption during mounting,
During transportation, vacuum leakage occurs from the suction pad due to the surface roughness of the insulating substrate and the difficulty of ensuring a large suction area, resulting in instability in attachment to the printed circuit board.
本発明は上記のような従来技術の課題を解消することを
目的としてなされたもので１機械的ストレスに強く、半
田付信頼性、自動実装性に優れだ面実装形ネットワーク
電子部品を提供することを目的としている。The present invention has been made to solve the problems of the prior art as described above. 1. To provide a surface-mount network electronic component that is resistant to mechanical stress and has excellent soldering reliability and automatic mounting performance. It is an object.
課題を解決するだめの手段
本発明は上記課題を解決するため、絶縁基板上に導体、
抵抗体、コンデンサ等の受動部品素子を複数個配置する
とともに、外部取出用電極を絶縁基板の上端部側に設け
、かつその電極に接続したリード端子を先端部が前記絶
縁基板の下端部側にくるように絶縁基板の表裏面に沿っ
て配設し、そのリード端子の先端部をプリント基板等の
接続部分にそのプリント基板等に対して絶縁基板を立設
させた状態で接続したものである。Means for Solving the Problems In order to solve the above problems, the present invention provides conductors on an insulating substrate.
In addition to arranging a plurality of passive component elements such as resistors and capacitors, an electrode for external extraction is provided on the upper end side of the insulating substrate, and a lead terminal connected to the electrode is placed with the tip end on the lower end side of the insulating substrate. The lead terminals are placed along the front and back surfaces of an insulating board, and the tips of the lead terminals are connected to the connecting part of a printed circuit board, etc., with the insulating board standing up against the printed board, etc. .
作用
本発明は前記の構成により従来の面実装形ネットワーク
電子部品の２つの欠点を解決することとなる。第１にリ
ード端子がプリント基板に半田付されている部分から絶
縁基板上の外部取出用電極間が長くとれ、リード端子に
機械的変位を吸収するフレキシビリティが生まれ、線膨
張率の違いによる熱変位による応力やプリント基板が曲
げられることによる応力を緩和し、絶縁基板上の外部取
出用電極とリードの半田付部及びプリント基板との半田
付部の信頼性が高い。第２にモールド成型された整った
外形や、上部に基板厚よりも広い平滑なキャップは実装
機での吸着搬送を安定化し、確実な部品実装が実現され
る。Operation The present invention solves two drawbacks of conventional surface-mounted network electronic components by the above-described structure. First, the distance between the external electrode on the insulating board from the part where the lead terminal is soldered to the printed circuit board is long, giving the lead terminal flexibility to absorb mechanical displacement, and heat generated by the difference in coefficient of linear expansion. It alleviates stress caused by displacement and bending of the printed circuit board, and increases the reliability of the soldered portions of the external electrodes and leads on the insulating substrate and the soldered portions of the printed circuit board. Second, the well-formed molded outer shape and the smooth cap on the top that is wider than the board thickness stabilize the suction and conveyance of the mounting machine, ensuring reliable component mounting.
実施例
以下１本発明による実施例を第１図、第２図の図面を参
照しながら説明する。Embodiment One embodiment of the present invention will be described below with reference to FIGS. 1 and 2.
実施例１
第１図ムは面実装形ネットワーク抵抗器の外観を示す斜
視図で、了は外形を整えるためにモールド成型により形
成した外装樹脂、８は先端部を下端部より引出したリー
ド端子で、このリード端子８によりプリント基板９に立
設された状態で半田付される。第１図Ｂは第１図ムの断
面を拡大した断面図である。１ｏは矩形状の絶縁基板で
、この表面に厚膜抵抗製造プロセスによりムローｐｄ系
。Example 1 Figure 1 is a perspective view showing the external appearance of a surface-mount network resistor, where numeral 8 is an exterior resin formed by molding to adjust the external shape, and numeral 8 is a lead terminal whose tip is pulled out from the bottom. The lead terminals 8 are soldered to the printed circuit board 9 in an erected state. FIG. 1B is an enlarged sectional view of the cross section of FIG. 1o is a rectangular insulating substrate, the surface of which is coated with a Muro PD system using a thick film resistor manufacturing process.
Ｃｕ系などの材料による外部取出用電極１１．補強電極
１２．ＲｕＯ２系などの厚膜抵抗材料で作られた抵抗体
１３及びこれを保護、絶縁する保護コート１４が形成さ
れている。また、外部取出用電極１１は絶縁基板１ｏの
表面の上端部に形成され。External extraction electrode 11 made of Cu-based material or the like. Reinforcement electrode 12. A resistor 13 made of a thick film resistive material such as RuO2-based resistor 13 and a protective coat 14 for protecting and insulating the resistor 13 are formed. Further, the external extraction electrode 11 is formed at the upper end of the surface of the insulating substrate 1o.
そして補強電極１２はその外部取出用電極１１に対応す
る位置で絶縁基板１ｏの裏面に形成されている。ここで
、リード端子８は帯状の良好な半田付性を有する金属材
料から作られるリードフレームからプレス加工により形
成され、上部に絶縁基板１０をはさみこむ弾力性のある
クリップ形状で。The reinforcing electrode 12 is formed on the back surface of the insulating substrate 1o at a position corresponding to the external extraction electrode 11. Here, the lead terminal 8 is formed by pressing from a band-shaped lead frame made of a metal material with good solderability, and has an elastic clip shape with an insulating substrate 10 sandwiched therebetween.
外部取出用電極１１．補強電極１２と接続されるととも
に、絶縁基板１０の表裏面に沿って下端部側より先端部
が引出されている。すなわち、電極。External extraction electrode 11. It is connected to the reinforcing electrode 12, and its tip portion extends from the lower end side along the front and back surfaces of the insulating substrate 10. Namely, electrodes.
抵抗体、保護コートが形成された絶縁基板１ｏの外部取
出用電極１１．補強電極１２が位置する様に挿入する。Externally extending electrode 11 of the insulating substrate 1o on which a resistor and a protective coat are formed. Insert so that the reinforcing electrode 12 is positioned.
その後、リード端子８のクリップ部と外部取出用電極１
１．補強電極１２とを半田接合して洗浄を行い、フラッ
クヌ等の除去を行ってからモールド成型により外装樹脂
子により被覆される。リード端子８の樹脂から出ている
部分は成型後、リードフレームから切りはなされ、リー
ド曲げ加工され、ここが外部接続端子となる。After that, the clip part of the lead terminal 8 and the electrode 1 for external extraction
1. The reinforcing electrode 12 is soldered to the reinforcing electrode 12, and after cleaning and removing flakiness, etc., it is covered with an exterior resin by molding. After molding, the portion of the lead terminal 8 protruding from the resin is cut from the lead frame and subjected to a lead bending process, and becomes an external connection terminal.
このような端子形状から外部取出用電極１１゜補強電極
１２０半田接合位置から金型パーチーシロン面までが長
くとれ、リード端子８のパーチージョン面にはさまれる
部分の熱影響が少なく、全型締りが充分で、パリの少な
い良好な成型が行える。また、スタンドオフ寸法も実施
例の高さ２６５４朋の成型寸法とすれは、約１鵬程度が
得られ、応力を吸収する充分なフレキシビリティを保持
させることができる。さらに、第１図Ｂの構成で補強電
極１２側面にも抵抗体等を印刷し、リード端子８を半田
接合した後、電極１１．１２にまたがる部分を切断すれ
は、より高集積化を図ることもできる。Due to this terminal shape, the distance from the solder joint position of the externally extracted electrode 11° reinforcing electrode 120 to the mold parting surface can be long, and the part sandwiched between the parting surfaces of the lead terminal 8 is less affected by heat, and the entire mold can be clamped. is sufficient to allow good molding with less flaking. Further, the standoff dimension is about 1 inch compared to the molded dimension of the example height 2654 mm, and it is possible to maintain sufficient flexibility to absorb stress. Furthermore, in the configuration shown in FIG. 1B, a resistor or the like is printed on the side surface of the reinforcing electrode 12, and after the lead terminal 8 is soldered and connected, the portion spanning the electrodes 11 and 12 is cut, thereby achieving higher integration. You can also do it.
実施例２
第２図は本発明の他の実施例による面実装形ネットワー
ク抵抗器で、１ｏは絶縁基板で、その表面には実施例１
と同様な位置に抵抗体、電極、保護膜が形成されている
。リード端子１６はプリント基板（図示せず）に実装さ
れかつ半田付けされる先端部ガルウィングベンド１６ａ
を持ち、絶縁基板１ｏに挿入後、その電極部と半田接合
される。Embodiment 2 FIG. 2 shows a surface mount type network resistor according to another embodiment of the present invention, 1o is an insulating substrate, and Embodiment 1 is on the surface thereof.
A resistor, an electrode, and a protective film are formed at the same positions as in the figure. The lead terminal 16 is mounted on a printed circuit board (not shown) and has a gull wing bend 16a at the tip thereof which is soldered.
After being inserted into the insulating substrate 1o, it is soldered to the electrode portion thereof.
フラックヌ等の汚れを洗浄した後、上面が平滑で実装機
での吸着が安定して行える幅をもつ耐熱樹脂製のキャッ
プ１６を接着剤で固定する。本実施例のものは、抵抗体
が外気に露出していることから実施例１に比し、耐湿性
に対してより注意をはらう必要があるが、実装性、応力
に対する半田付部の信頼性については見劣りするもので
なく、高価なモールド成型機や金型を必要としないなど
の利点を持っている。After cleaning stains such as flake, a heat-resistant resin cap 16 with a smooth upper surface and a width that allows stable suction by a mounting machine is fixed with adhesive. In this example, since the resistor is exposed to the outside air, it is necessary to pay more attention to moisture resistance than in Example 1, but the reliability of the soldered part against mounting performance and stress is It is not inferior and has the advantage of not requiring expensive molding machines or molds.
発明の詳細
な説明したように本発明による面実装形ネットワーク部
品は、素子内部の半田付部分、実装部の半田付部分にか
かる応力が緩和される構造であり、信頼性の高い面実装
形ネットワーク電子部品を供給できる。まだ使用する上
でも実装性が高く。As described in detail, the surface mount type network component according to the present invention has a structure in which stress applied to the soldered portion inside the element and the soldered portion of the mounting part is alleviated, and it is a highly reliable surface mount type network component. We can supply electronic parts. It is still easy to implement even when used.
このことは電子機器の小型化、低価格化、故障率の低減
という効果を生み、産業上多大の効果がある。This has the effect of making electronic equipment smaller, lowering prices, and reducing failure rates, which has great industrial effects.
第１図ムは本発明の実施例１による面実装形ネットワー
ク電子部品の外観を示す斜視図、第１図Ｂは第１図ムの
断面図、第２図は本発明の実施例２を示す斜視図、第１
図及び第４図はそれぞれ従来の面実装形ネットワーク電
子部品を示す斜視図である。
９・・・・・・プリント基板、１０・・・・・絶縁基板
、１１・・・・・・外部取出用電極、１２・・・・・・
補強電極、１３・・・・・・抵抗体、８．１５・・・・
・・リード端子。FIG. 1 is a perspective view showing the appearance of a surface-mounted network electronic component according to a first embodiment of the present invention, FIG. 1B is a sectional view of FIG. 1, and FIG. 2 is a perspective view showing a second embodiment of the present invention. Perspective view, 1st
FIG. 4 is a perspective view of a conventional surface-mounted network electronic component. 9...Printed circuit board, 10...Insulating board, 11...External extraction electrode, 12...
Reinforcement electrode, 13...Resistor, 8.15...
...Lead terminal.
Claims (1)
子を複数個配置するとともに、外部取出用電極を絶縁基
板の上端部側に設け、かつその電極に接続したリード端
子を先端部が前記絶縁基板の下端部側にくるように絶縁
基板の表裏面に沿って配設し、そのリード端子の先端部
をプリント基板等の接続部分にそのプリント基板等に対
して絶縁基板を立設させた状態で接続した面実装形ネッ
トワーク電子部品。A plurality of passive components such as conductors, resistors, and capacitors are arranged on an insulating substrate, and an electrode for external extraction is provided on the upper end side of the insulating substrate, and a lead terminal connected to the electrode is connected to the insulating substrate. A state where the insulating board is placed along the front and back surfaces of the insulating board so as to be on the lower end side of the board, and the tip of the lead terminal is connected to the printed board, etc., and the insulating board is set up against the printed board, etc. Surface-mounted network electronic components connected by.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27417389A JP2751476B2 (en) | 1989-10-20 | 1989-10-20 | Surface mount network electronic components |
| DE69024313T DE69024313T2 (en) | 1989-10-20 | 1990-10-19 | Surface mount network device |
| KR1019900016667A KR910008832A (en) | 1989-10-20 | 1990-10-19 | Surface Mount Network Components |
| US07/601,231 US5224021A (en) | 1989-10-20 | 1990-10-19 | Surface-mount network device |
| EP90120119A EP0423821B1 (en) | 1989-10-20 | 1990-10-19 | Surface-mount network device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27417389A JP2751476B2 (en) | 1989-10-20 | 1989-10-20 | Surface mount network electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH03136212A true JPH03136212A (en) | 1991-06-11 |
| JP2751476B2 JP2751476B2 (en) | 1998-05-18 |
Family
ID=17538055
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27417389A Expired - Fee Related JP2751476B2 (en) | 1989-10-20 | 1989-10-20 | Surface mount network electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2751476B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007081228A (en) * | 2005-09-15 | 2007-03-29 | Tdk Corp | Surface mounted electronic component array |
-
1989
- 1989-10-20 JP JP27417389A patent/JP2751476B2/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007081228A (en) * | 2005-09-15 | 2007-03-29 | Tdk Corp | Surface mounted electronic component array |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2751476B2 (en) | 1998-05-18 |
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| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |