JPH03133761A - Carrier tape for semiconductor device - Google Patents

Abstract

PURPOSE:To precisely place a semiconductor device at a regular position in a cavity on a carrier tape by a method wherein needle-like or linear protrusions are projected from the brims of a stand, and the distance between the protrusions is so designed that the protrusions hold the base of the mold part of the semiconductor device. CONSTITUTION:A large number of cavities 1 each having a size corresponding to a semiconductor device to be placed are provided in the center of a lengthy tape at regular intervals, and each cavity 1 consists of a stand 2 and grooves 3 and 4 on both right and left sides of the stand. The size of the stand 2 corresponds to the size of the base of a mold part of the semiconductor device to be placed, and the height of the stand 2 is so designed that the level of the mold part on the stand is lower than the level of a brim 7. As linear protrusions 11 and 12 are provided along both lengthwise sides of the stand 2, the semiconductor device can be precisely fixed at a regular position in the cavity with regard to the perpendicular direction to the length. As the distance between the linear protrusions 11 and 12 is so designed that the base of the mold is held by both protrusions, the base of the mold is fitted between them and precisely fixed on the stand.

Description

Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a semiconductor device having a shape consisting of a mold part and a lead, particularly a DIP type semiconductor device, such as a normal DIP (dual in-line package), a 5-DIP (shrink package), etc. This product is related to carrier tapes for storing DIP), 5K-DIP (skinny DIP), QFP (quad flat package), PLCC (plastic leaded chip carrier), etc., and is particularly useful for transporting DIP type semiconductor devices, etc. The present invention relates to a semiconductor device carrier tape that is free from deformation and damage and is suitable for automatically mounting semiconductor devices within the tape with a robot hand.

[Prior Art] In a DIP type semiconductor device, as shown in FIG. 3, a vertically long rectangular parallelepiped mold part A containing a semiconductor and leads B drawn out from both sides of the mold part A are all shaped like crab legs downward. It has a curved shape.

Conventionally, as shown in Figure 6 of Japanese Utility Model Application Publication No. 59-101499, a plastic sheet table is provided with a large number of cavity recesses for housing DIP type semiconductor devices, and the cavities hold a mold portion for the semiconductor device. A carrier tape for a DIP type semiconductor device is known, which includes a supporting pedestal and grooves on both sides of the pedestal.

A large number of semiconductor device leads are accommodated in the pedestal of the cavity of this carrier tape, and another lid tape is superposed on top of the leads. Both edges are joined with an adhesive, the cavity is closed with a lid tape, and after a large number of semiconductor devices are stored and packaged in the cavity, the carrier tape is wound around the cavity and the semiconductor device is transported in the form of a reel. When using this, insert the carrier tape into the automatic mounting machine, and while peeling off the lid tape,
A robot hand takes out the semiconductor device from the cavity, inserts it into a predetermined position of the electronic device, and mounts it.

However, when semiconductor devices are stored in these carrier tapes for semiconductor devices, the size of the cavity requires some space for insertion during packaging, so the semiconductor device may move laterally within the cavity. Cheap.

When a semiconductor device moves within a cavity, a robot hand grips the semiconductor device and automatically attaches it to an electronic device.
The drawback is that the automatic mounting does not work smoothly because the position of the robot's grip shifts.

[Problems to be Solved by the Invention] An object of the present invention is to provide a semiconductor device carrier tape that allows semiconductor devices to be accurately housed in a predetermined position within a cavity of the carrier tape to facilitate smooth automatic mounting. That is.

[Means for Solving the Problem] As a result of extensive research, the present inventors have developed a pedestal that fits into the shape of the bottom of the semiconductor device in order to store the semiconductor device in a fixed position within the cavity of the carrier tape. The present invention was completed by devising a method for achieving this by providing the following.

That is, the present invention provides a plastic tape in which a number of cavities are provided at regular intervals in which a semiconductor device having a shape consisting of a mold part and a lead is housed, and the cavities support the bottom surface of the mold of the semiconductor device at the center. It consists of a pedestal and a recessed reed storage part arranged toward the side edge of the pedestal, and a point-like or linear protrusion protruding from the surface of the pedestal is provided on the side line of the upper surface of the pedestal, and the protrusion and the The present invention provides a carrier tape for a semiconductor device, characterized in that the intervals between the protrusions are formed so as to securely sandwich the bottom surface of a molded portion of a semiconductor device.

The present invention will be explained in more detail with reference to drawings of embodiments. However, the present invention is not limited to the specific embodiments of the examples.

A carrier tape for a semiconductor device according to an exemplary embodiment of the present invention has a structure shown in FIG.

In this example, a tape of 16X, which corresponds to the size of the semiconductor device to be stored, is placed in the center of a long plastic sheet tape.
A large number of 30 mm recessed cavities 1 are provided at regular intervals, and each cavity 1 consists of a pedestal 2 and recessed grooves 3.4 provided on both left and right sides of the pedestal, and the dimensions of this pedestal 2 are 6.6 mm.
The height of the pedestal 2 is set as 30.0 mm to match the bottom surface of the mold part of the semiconductor device to be stored, and the height of the pedestal 2 is 3.5 mm with respect to the thickness of the mold part of the semiconductor device to be stored.
The height is lower than the side edge 7 by 0 mm. Therefore, the top surface of the semiconductor device mold protrudes from the top surface of the carrier tape by 0.5 mm, and when the lid tape is attached,
Since the lid tape presses this protrusion, it is pressed against the base 2 with a weak force.

In this embodiment, the structure of the cavity pedestal 2, which is a feature of the present invention, includes linear protrusions 11 and 12 along the left and right longitudinal side edges of the pedestal 2, as shown in FIG. With this structure, the semiconductor device can be accurately fixed at a fixed position in the cavity in the direction perpendicular to the longitudinal direction.

The distance between the left and right linear protrusions 11 and 12 is set so that the bottom surface of the mold of the semiconductor device is just held between the same protrusions.

Therefore, the bottom surface of the mold of the semiconductor device fits into the surface formed between the two protrusions and the top surface of the pedestal, and is accurately fixed onto the pedestal.

Since the inner surfaces of these protrusions 11 and 12 are inclined,
When dropped from above, the inclined surface guides it to the correct position on the pedestal.

The height of the protrusion from the pedestal surface is limited by the connection of the lead wires of the semiconductor device, and is very small, and in the case of the pedestal shown in FIG. 1, the height is about 0.3 to 1.3 mm. Appropriate.

Furthermore, in the present invention, instead of the linear protrusions, dotted protrusions can be provided on the left and right corner side edges of the base.

Three or more point-like protrusions are required, divided into left and right opposite edges.

Due to the effect of this protrusion, the position of the semiconductor device is accurately fixed in the width direction of the pedestal.

Furthermore, as another aspect of the shape of the pedestal, it can have the shape shown in FIGS. 2(a) and 2(b) when viewed in side cross section.

As shown in Figure 2(a), there are grooves 13 and 14 between the pedestal and the protrusion.
By providing a shape in which the surfaces on both sides of the pedestal are missing, when the bottom surface of the mold of the semiconductor device is fitted, the corner edges will catch on the surface of the pedestal, as shown in Figure 4 (a). This prevents the mold from being installed obliquely, and allows the bottom surface of the mold to be accurately fitted horizontally to the pedestal as shown in FIG. 4(b).

In addition, when the center of the pedestal is recessed and consists of two rails 15 and 16, as shown in Fig. 2 Cb'), in addition to the above advantages, the bottom surface of the mold of the semiconductor device is supported by the two line contacts. Therefore, it has the effect of being able to hold it horizontally rather than surface contact.

Guide holes 8 are provided at regular intervals on both side edges 7 of the carrier tape of this embodiment, and gears are fitted into these holes to accurately move the carrier tape into automatic packaging equipment and automatic loading equipment. be able to.

After storing the semiconductor device in the cavity of the carrier tape during automatic packaging, cover the lid film tape with a width narrower than the width of the guide hole 8, and adhere the lid film tape and the carrier tape at both side edges 7 using a pressure-sensitive adhesive. do.

When the semiconductor device is housed in the carrier tape of this embodiment, the bottom surface of the mold of the semiconductor device rests on the pedestal 2.
The reed is housed in the recessed grooves on both sides, and the tip of the reed is suspended in the air.

The upper surface of the housed semiconductor device slightly protrudes from the side edge 7 of the carrier tape, and when the lid tape is placed over this, the semiconductor device is pressed against the pedestal 2 with a weak force and fixed in the cavity. be done.

For the carrier tape of the present invention having a square mold part such as PLCC, the effect of the present invention can be obtained by using a pedestal having protrusions on all sides as shown in FIG.

The carrier tape for semiconductor devices of the present invention can be manufactured into a precise shape by vacuum forming, pressure forming or press forming a thermoplastic sheet.

As the thermoplastic resin, for example, thermoplastics such as polypropylene, polyethylene, polystyrene, polyvinyl chloride, polyvinylidene chloride, saponified ethylene vinyl sulfate copolymer, polyester, and nylon can be used.

Further, sheets to which an antistatic agent is added are preferable from the viewpoint of dustproofing, and in particular, sheets to which a conductive substance such as carbon black is added to impart conductivity to the sheet can be suitably used.

[Effects of the Invention] The present invention has a great advantage in that the semiconductor device can be fixed and maintained straight at the center of the pedestal in the cavity, so that it can be smoothly mounted by the robot hand of the automatic mounting machine.

In particular, the carrier tape for semiconductor devices of the present invention has the advantage that even semiconductor devices that are shorter than the length of the cavity, for example, half the length, will not be stored obliquely.
The robot hand can be operated smoothly.

With the carrier tape of the present invention, the mold part of the semiconductor device can be firmly fixed, the lead part of the semiconductor device can be packaged with it suspended in the groove part, and it can be wrapped in that state, so the lead part can be wrapped while being transported. It has the advantage of not bending.

[Brief explanation of the drawing]

FIG. 1 is a drawing showing the structure of a carrier tape for a semiconductor device according to an embodiment of the present invention, in which (a) is a plan view, (b) is a side sectional view, and FIGS. ) is a side sectional view of the base of the carrier tape of another example, and FIG.
3(a) is a vertical side view, FIG. 3(b) is a horizontal side view, and FIG. ), (b
) is an explanatory diagram showing the effects of the embodiment of the present invention,
FIG. 5 is a plan view of a carrier tape for a PLCC type semiconductor device of the present invention. Symbols in the figure are: 1; semiconductor device storage cavity; 2; pedestal; 3.4; concave groove; 7; side edge; 8; guide hole; 11
．． 12: protruding portion, A: mold portion of the semiconductor device, B: lead.

Claims (1)

[Scope of Claims] 1. A plastic tape having a number of cavities arranged at regular intervals in which a semiconductor device having a shape of a mold part and leads is housed, the cavities supporting the bottom surface of the mold of the semiconductor device in the center. The pedestal is made up of a pedestal and a recessed reed storage part arranged in the direction of the side edge of the pedestal, and a point-like or linear protrusion protruding from the surface of the pedestal is provided on the side edge of the upper surface of the pedestal, and the protrusion and a carrier tape for a semiconductor device, characterized in that the intervals between the protrusions are formed so as to securely sandwich the bottom surface of a molded portion of the semiconductor device. 2 Claim 1 in which a groove is provided between the protrusion and the side edge of the pedestal
The carrier tape for semiconductor devices described above. 3. The carrier tape for a semiconductor device according to claim 1, wherein the pedestal comprises a linear protrusion.