JPH07137786A - Storing container - Google Patents

Abstract

PURPOSE:To simplify packing and unpacking operations, reduce the size of a storing container and recycle it. CONSTITUTION:A storing container is provided with a plurality of nearly flat trays 11 and a storing tube 21 for stacking these trays therein in such a manner that they can be freely moved in the axial direction. The tray 11 is formed with the upper surface capable of mounting and positioning at least one QFP.ICI in the horizontal direction and with the lower surface kept close to the QFP.ICI mounted on the tray 11 below. Since even QFP.ICI can be stored in the storing tube 21 by stacking the trays 11 with QFP.IC1 mounted thereon in a number of tiers, the operation of taking QFP.IC1 in and out the storing tube 21 can be minimized and the equipment or running costs arising from QFP.IC1 handling can be reduced. At the time of unpacking, since the tray and the storing tube 21 are not damaged, they can be recycled.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a storage container, and more particularly to a storage container for safely storing a large number of semiconductor devices, and for example, a semiconductor integrated circuit device (hereinafter referred to as QFP IC) equipped with a quad flat package. () Related to what is effective in storing.

[0002]

2. Description of the Related Art Generally, a stick-shaped magazine is used for storing a semiconductor integrated circuit device having a single in-line package and a semiconductor integrated circuit device having a small outline package. In other words, since these semiconductor integrated circuit devices (hereinafter referred to as ICs) do not have outer leads protruding from the front and rear of the package, the front and rear surfaces of the semiconductor integrated circuit devices are abutted against each other in a magazine formed in a slender cylindrical shape, and are formed in a single column. Stored side by side.

However, in a QFP IC or the like in which outer leads are provided on four sides of a package, if the outer leads of adjacent ICs are abutted against each other if they are stored in a magazine in a single column. , Cannot be stored in the magazine.

Therefore, a tray or a carrier tape is used in a QFP / IC or the like in which outer leads are projected on four sides of the package. That is, the tray has a large number of storage recesses on a flat plate having a relatively large area, and the recesses are recessed in the shape of a grid, and each recess has one QFP / IC.
It is configured to be stored individually.

In the carrier tape, a large number of storage recesses (embossed portions) are arranged in the main body tape and are integrally formed by embossing.
QFP / IC stored in the recess after the cover tape was welded to the tape body after storing one FP / IC
Is configured to be covered.

As an example where the magazine is described,
Japanese Utility Model Publication No. 51-24192, Japanese Utility Model Publication No. 52-2687.
No. 3, gazette. Examples of the tray are described in Japanese Utility Model Publication No. 64-53091 and Japanese Utility Model Publication No. 51-24192.
There is a gazette. Examples of the carrier tape are disclosed in JP-A-62-171858 and JP-A-62-2.
There is a Japanese Patent Publication No. 49444.

[0007]

However, in the method of storing the QFP / IC in which the tray is used, since the storage recesses are arranged in a checkerboard pattern, the QFP / IC is stored in each storage recess of the tray. When the product is stored or taken out, the delivery device has a complicated structure and needs to operate with high precision, so that there is a problem that equipment cost and running cost increase.

Also, a QFP in which a carrier tape is used
In the method of storing the IC, the carrier tape is bulky and unrecyclable because the packing work, unpacking work, and transportation work are performed while the tape is wound on the reel. There is a problem that it is possible.

An object of the present invention is to provide a storage container which can easily perform packing work and unpacking work, can be suppressed in bulk, and can be recycled.

The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

[0011]

The typical ones of the inventions disclosed in the present application will be outlined below. That is, it is provided with a tray formed in a substantially flat plate shape, and a storage cylinder configured to store a plurality of the trays in parallel with each other so as to be movable back and forth in the direction of the cylinder center. , A plurality of trays having the same identity are prepared, and each tray is configured such that at least one main surface of each tray can be placed with the article positioned in the lateral direction, and the other main surface is adjacent. It is characterized in that it is configured to be close to an article placed on a tray.

[0012]

According to the above-described means, the articles to be stored are placed on the tray, the trays are stacked in multiple stages, and the trays are stored in the storage cylinder. Since the articles can be stored, the operation of taking articles in and out of the storage cylinder can be suppressed to a minimum movement. As a result, it is possible to reduce the facility cost and running cost of the device for handling the items to be stored.

Since neither the tray nor the storage cylinder is damaged during unpacking, the tray can be recycled, the material cost can be reduced, and resource saving can be promoted.

By connecting the upper tray and the lower tray with a connecting device, the trays are stacked in multiple stages, and are automatically executed when the tray is stored in the storage cylinder and the tray is removed from the storage cylinder. Therefore, it is possible to easily realize efficient automation of the work of storing and taking out articles from the storage container.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 is a partially omitted perspective view showing a storage container according to an embodiment of the present invention, FIG. 2 is an exploded perspective view thereof, and FIG. Is.

In this embodiment, the storage container according to the present invention is configured to store a large number of semiconductor integrated circuit devices (QFP / IC) 1 having a quad flat package. QFP / IC1 as a stored item
Is a resin-sealed package main body 2 formed of a resin into a substantially square flat plate shape by a resin molding method such as transfer molding, and 4 of the package main body 2.
The package main body 2 is provided with the outer leads 3 that are arranged on the respective side surfaces of the sheet and project outward, and are bent and formed in a so-called gull wing shape.
A pellet (not shown) in which an integrated circuit is formed is resin-sealed in the inside of. The integrated circuit formed in the pellet has a bonding wire (not shown) bridged between the electrode pad of the pellet and an inner lead (not shown) integrally connected to each outer lead 3. The outer leads 3 are electrically drawn to the outside of the package body 2 via the ().

A storage container 10 for storing the QFP / IC 1 is composed of a tray, a storage cylinder and a connecting device. The tray 11 includes a main body 12, and the main body 12
Is made of a resin such as vinyl chloride and is integrally molded into a substantially square flat plate shape by an appropriate means such as an extrusion molding method. The main body 12 is formed in a substantially square shape whose one side is larger than the maximum width of the QFP / IC 1 as the object to be stored, and the thickness of the main body 12 is within a range in which a predetermined rigidity can be maintained. Formed to be thin.

On the upper surface of the tray main body 12, supporting portions 13 formed in a square frame shape having a constant height are arranged concentrically with the main body 12 and project vertically upward.
The inner diameter of the support portion 13 is QFP.I as an object to be stored.
The outer lead 3 is formed to have a diameter substantially equal to the outer diameter of the resin-sealed package body 2 in C1, and the height of the outer lead 3 can be floated from the upper surface of the body 12 while the resin-sealed package body 2 is placed. Formed at height. Further, the inner and outer wall surfaces of the support portion 13 are each inclined so as to become gradually thinner as going upward.

A window hole 14 is concentrically arranged in the tray body 12 and opened in a square shape so that the inside diameter of the window hole 14 is smaller than the outside diameter of the package body 2 of the QFP IC. It is set.

On the lower surface of the tray body 12, a positioning portion 15 formed in a square frame shape having a constant height is provided so as to project downward in the vertical direction, and the positioning portion 15 supports the supporting portion 13.
And the windows 14 are concentrically arranged.
The positioning portion 15 is formed such that the inner diameter thereof is substantially equal to the outer diameter of the package body 2, and the height thereof is set so that the lower end side of the positioning portion 15 is located below the upper end surface of the package body 2 when stacked. ing. Further, the inner and outer wall surfaces of the positioning portion 15 are each inclined so as to become gradually thinner as they go downward.

At the four corners of the upper surface and the lower surface of the tray body 12, an upper abutting portion 16 and a lower abutting portion 17 are arranged so as to correspond to each other and integrally project in the vertical direction. The abutting portions 16 and 17 are each formed in a cylindrical shape so that they can abut each other. A male fitting portion 18 and a female fitting portion 19 are integrally formed on the upper surface and the lower surface of the upper butting portion 16 and the lower butting portion 17 so that they can be fitted to each other.

The storage cylinder 21 has a main body 22. This storage cylinder main body 22 is made of resin such as vinyl chloride,
It is integrally molded into a substantially square tubular shape by an appropriate method such as extrusion molding. The inner shape of the storage tube main body 22 is formed in a similar shape slightly larger than the outer shape of the tray main body 12. The thickness of the cylinder wall of the storage cylinder main body 22 is set to a value that can maintain a predetermined rigidity, and is formed so as to be equal throughout.

The storage cylinder 21 is attached to one side wall of the main body 22,
An escape portion 23 for escaping the connecting device described later is integrally formed in a substantially channel type steel shape. That is, the escape portion 23 is arranged so as to be present in the central portion of one side wall of the cylinder main body 22 in a direction parallel to the cylinder center, and is bulged so as to project outward in the radial direction. It is formed into a channel-shaped steel shape. The width and depth of the escape portion 23 are set to be as small as possible within a range that can accommodate the connecting device described later.

In the present embodiment, the connecting device 31 comprises a connecting belt and a pin joint. Connecting belt 3
2 includes a main body 33, and the belt main body 33 is integrally formed into a belt shape having a constant width and a constant thickness by using a resin having an appropriate flexibility such as vinyl chloride. A large number of male brackets 35 of the pin joint 34 are arranged on the belt body 33 at equal intervals in the length direction and project in the right angle direction. The pitch of each bracket 35 is set to be equal to the distance between the upper end of the upper abutting portion 16 and the lower end of the lower abutting portion 17 in the tray 11. A pin insertion hole 36 is formed in the bracket 35 in the width direction of the belt body 33.

On the other hand, the female bracket 37 of the pin joint 34
A pair of members are integrally provided on one side surface of the tray body 12 so as to form a female portion 38. That is, the female portion 3 of the pin joint 34 is provided on one side of the tray body 12.
8 in the widthwise center so that the pair of brackets 3
Nos. 7 and 37 are projected symmetrically with a space therebetween, and the interval between both brackets 37 and 37 is the bracket 3 on the belt side.
The width is set to be substantially equal to the width of 5. Further, pin insertion holes 39, 39 are formed in both brackets 37, 37 so as to be aligned with each other.

The pin 40 of the pin joint 34 is formed so as to be inserted into the pin insertion hole 36 on the belt side and the pin insertion hole 39 on the tray side. Then, the pin 40 is inserted between the insertion holes 36 and 39 of the male side bracket 35 on the belt side and the female side brackets 37 and 37 on the tray side while the male side bracket 35 on the belt side is inserted into the female portion 38. As a result, the tray 11 is rotatably pin-joined to the connecting belt 32. In this manner, the plurality of trays 11 are coupled to the coupling belt 32 by the pin joints 34, respectively, so that the coupled trays 11 are coupled to each other via the coupling device 31.

Next, the Q of the QFP / IC1 according to the above configuration
A method of storing the FP / IC in the storage container 10 and its operation will be described.

QFP / IC storage container 1 having the above-mentioned configuration
When 0 is used, a large number of sets having the same constitution are manufactured and prepared. Further, the tray 11 is prepared by manufacturing a large number of trays having the same configuration for one storage cylinder 21.

The QFP according to the above-described structure is provided in the storage container 10.
When the IC1 is housed, the package main body 2 of the QFP IC1 is placed on the support portion 13 in a state where the open end of the outer lead 3 is directed downward, that is, in the normal surface mounting state of the QFP IC1. It is placed and placed on the tray 11. At this time, the package body 2 is fitted into the support portion 13. By fitting the package body 2 and the supporting portion 13, the QFP / IC 1 is placed on the tray 11 in a state of being positioned in an appropriate posture without being eccentric.

After the QFP IC1 is placed on a tray 11, another tray 11 is stacked on the tray 11. At this time, the four abutting portions 17 integrally projecting on the lower surface of the upper tray 11 are connected to the four abutting portions 16 projecting on the upper surface of the lower tray 11 so as to respectively correspond to these. Each is butt-matched. At this time, the male and female fitting portions 18 and 1 of the upper and lower abutting portions 16 and 17 are
9 and 9 are fitted together. By this fitting, the upper and lower trays 11 and 11 are properly aligned.

In this way, the QFP.I
When another tray 11 is properly aligned and stacked on the tray 11 on which C1 is placed, the inner peripheral surface of the positioning portion 15 projecting on the lower surface of the upper tray 11 becomes the lower tray. The outer peripheral surface of the package body 2 of the QFP / IC 1 positioned on the support portion 13 of 11 is closely faced. And the main body 1 of the upper tray 11
Since the lower surface of 2 is close to the package body 2, QFP
The IC1 is in a state in which lateral and vertical movements are restricted.

Here, since the inner peripheral surface of the positioning portion 15 is formed as an inclined surface, the package body 2 of the QFP IC 1 and the support portion 13 are not fitted to each other, and the package body 2 is placed at the center of the tray 11. In the case where the package body 2 is eccentrically accommodated, the upper shoulder portion of the package body 2 follows the inclined surface of the positioning portion 15, so that the package body 2 is automatically aligned with the support portion 13. The package body 2 and the supporting portion 13 are automatically fitted together.

As a result, the QFP IC1 is restricted from moving in the lateral direction on the tray 11 by fitting the package body 2 and the supporting portions 13 and moving in the vertical direction on the supporting portion 13 and the upper tray. Since the state is regulated by the lower surface of 11, the internal free movement in the stored state is stopped.

In this way, the QFP IC1 is restricted from floating in the housed state between the upper tray 11 and the lower tray 11, so that the outer lead 3 is bent and the package body 2 is damaged. The occurrence of will be prevented before it happens.

As described above, each tray 11 has a QFP.
The connecting belt 32 is appropriately connected to each tray 11 by the pin joint 34 while the ICs 1 are placed and before or after the trays 11 are being stacked. By this coupling, the upper tray 11 is sequentially connected to the lower tray 11 via the connecting belt 32.

During or before and after being connected and stacked in multiple stages, the tray 11 group is sequentially inserted into the storage cylinder 21 from one opening end of the storage cylinder main body 22. Will be stored. At this time, the outer peripheral surface of the tray main body 12 is made to follow the inner peripheral surface of the storage cylinder main body 22, and the coupling device 31 is accommodated in the escape portion 23 of the storage cylinder 21. In this storage state, the tray 11 group is slidable in the storage cylinder 21 in the cylinder center direction (see FIG. 3).

Next, the operation of taking out the QFP / IC1 stored in the storage container 10 at the time of mounting the QFP / IC1 on a printed wiring board (not shown) will be described.

As shown in FIG. 3, the storage container 10
Is installed at a predetermined position so that one end opening of the storage cylinder 21 faces upward. Then, the vacuum suction head 50 of the handling device is lowered along the tube center line of the storage cylinder 21, and the uppermost QFP / IC1 stored in the storage container 10 is moved.
Adsorbed on. The sucked QFP IC1 is sucked and held by the vacuum suction head 50, picked up from the uppermost tray 11, transferred to a predetermined mounting place by a handling device, and put down.

In the storage container 10, when the QFP / IC 1 is picked up from the uppermost tray 11, the connecting belt 32 is pulled up with respect to the storage cylinder 21. The pulled-up belt 32 is inverted downward along the outer surface of the escape portion 23 of the storage cylinder 21. As shown in FIG. 3, when the belt 32 is inverted, the empty tray 11
Is sequentially rotated from 90 degrees to 180 degrees around the joint 34, and is automatically taken out of the storage cylinder 21.

At the same time, when the connecting belt 32 is pulled up, the tray 11 at the next stage is pulled up to the uppermost position of the storage cylinder 21. Therefore, the vacuum suction head 50 can suck and hold the QFP / IC1 on the tray 11 which is pulled up to the next uppermost position. That is, the vacuum suction head 50 can always perform the suction holding operation at substantially the same position. Therefore, the operation of the handling device is minimized, and the structure and control thereof can be easily configured, and as a result, the equipment cost and running cost can be reduced.

After that, by repeating the above operation, the QFP / IC 1 is sequentially taken out from the storage cylinder 21, and the empty tray 11 is automatically taken out from the storage cylinder 21. During this operation, the connecting belt 3
It is desirable that the lifting operation of 2 and the operation of the handling device are controlled in synchronization with each other.

According to the above-mentioned embodiment, the following effects can be obtained. (1) The QFP / IC1 is placed on the tray 11, the trays 11 are stacked in multiple stages, and are sequentially stored in the storage cylinder 21 to store even the QFP / IC1 that cannot be butt-joined side by side. Since it can be stored in the cylinder 21, the QFP for the storage cylinder 21
It is possible to suppress the movement of the IC1 in and out with a minimum movement. As a result, it is possible to reduce the facility cost and running cost of the QFP / IC handling device and the like.

(2) By connecting the upper tray 11 and the lower tray 11 by the connecting device 31, the trays 11 are stacked in multiple stages and stored in the storage cylinder 21, and from the storage cylinder 21 to the tray 11. Since the work of taking out the QFP / IC1 can be automatically executed, the work of storing the QFP / IC1 in the storage container 10 and the work of taking out the QFP / IC1 can be more efficiently automated.

(3) Since the tray 11, the storage cylinder 21 and the connecting belt 32 are not damaged during unpacking, they can be recycled, material costs can be reduced, and resource saving can be promoted. it can.

FIG. 4 is an exploded perspective view showing another embodiment of the present invention, and FIG. 5 is a partially cut front view showing a state of use thereof.

The second embodiment is different from the first embodiment in the structure of the connecting device. That is, the connecting device 31A includes a joint mounting portion 32A, and a male side joint 33A and a female side joint 34A are provided at right angles on the lower surface and the upper surface of the mounting portion 32A, respectively. The mounting portion 32A is the tray body 1
2 is formed so as to project outward in the radial direction at the center of one side surface of 2 and has a rectangular plate shape. Mounting part 32A
A bracket 35A projects downward in the right-angled direction at the center of the lower surface of the bracket, and female fitting portions 36A project in a concave hemisphere shape on both sides of the bracket 35A. A pair of brackets 37A, 37A are provided at both ends on the upper surface of the mounting portion 32A so as to project upward in the right-angle direction, and a female portion 38A is formed between the brackets 37A, 37A. Male fitting portions 39A, 39A are recessed in a convex hemispherical shape on the opposing surfaces of the brackets 37A, 37A.

In the second embodiment, when the upper tray 11 and the lower tray 11 are connected, the female portion 38A of the female joint 34A of the lower tray 11 is connected to the male joint 33A of the upper tray 11. Bracket 35A
Are fitted, and the male fitting portions 39A, 39A on both sides are fitted to the female fitting portions 36A, 36A on both sides, respectively.

In this state, the upper tray 11 and the lower tray 11 are rotatably pin-coupled by the lower joint 33A and the upper joint 34A. Then, the trays 11 connected by the pin connection are stacked in multiple stages (see FIG. 5).

Next, when mounting the QFP / IC1 on the printed wiring board, etc., the Q stored in the storage container 10
The operation of removing the FP / IC1 will be described.

As shown in FIG. 5, the storage container 10
Is installed at a predetermined position so that one end opening of the storage cylinder 21 faces upward. Then, the vacuum suction head 50 of the handling device is lowered along the tube center line of the storage cylinder 21, and the uppermost QFP / IC1 stored in the storage container 10 is moved.
Adsorbed on. The sucked QFP IC1 is sucked and held by the vacuum suction head 50, picked up from the uppermost tray 11, transferred to a predetermined mounting place by a handling device, and put down.

When the QFP / IC 1 is picked up from the uppermost tray 11 in the storage container 10, the empty tray 11 is pulled up to the storage cylinder 21.
The tray 11 that has been pulled up is inverted downward along the outer surface of the escape portion 23 of the storage cylinder 21. As shown in FIG. 5, when inverted, the tray 11 will be fitted with fittings 33A, 34.
Sequentially rotated from 90 degrees to 180 degrees around A,
The storage cylinder 21 is automatically taken out.

When the empty tray 11 is inverted, the tray 11 at the next stage is pulled up to the uppermost position of the storage cylinder 21. Therefore, the vacuum suction head 50 moves the QF on the tray 11 that is pulled up to the next uppermost position.
P · IC1 can be adsorbed and held. That is, the vacuum suction head 50 can always perform the suction holding operation at substantially the same position. Therefore, the operation of the handling device can be minimized, and the structure and the control thereof can be easily configured, and as a result, the equipment cost and the running cost can be reduced.

After that, by repeating the above operation, the QFP / IC 1 is sequentially taken out from the storage cylinder 21, and the empty tray 11 is automatically taken out from the storage cylinder 21. Empty tray 11 during this operation
It is desirable to control so that the pulling-up operation and the work of the handling device are synchronized.

Although the invention made by the present inventor has been specifically described based on the embodiments, the invention is not limited to the embodiments and various modifications can be made without departing from the scope of the invention. Needless to say.

For example, the tray 11 has one QFP / IC1.
The configuration is not limited to placing individual pieces, and a plurality of pieces may be placed as shown in FIG.

In addition, when the tray 11 is put in or taken out of the storage cylinder 21, a QFP / IC
Since it can be automatically executed by alternately carrying out 1 and the tray 11, the connecting device for connecting the trays may be omitted.

In the above description, the invention made by the present inventor is a field of application which is the background of the invention.
・ I explained the case of applying it to the IC storage technology.
It is not limited to this, but QFI / IC and QFJ
The present invention can be applied to semiconductor devices such as ICs, SOPs, ICs, SIPs, ICs, and general storage technology for small articles such as electronic components such as transistors and electronic devices. In particular, the present invention can be applied to an article that cannot use a magazine, such as a QFP / IC having outer leads protruding from four sides of the package, to obtain an excellent effect.

[0058]

The effects obtained by the typical ones of the inventions disclosed in the present application will be briefly described as follows.

By placing the articles to be stored on the tray, stacking the trays in multiple stages, and storing the articles in the storage cylinder, even articles that cannot be stored in the magazine can be stored in the storage cylinder. It is possible to suppress the movement of the articles in and out of the cylinder with a minimum movement.
As a result, it is possible to reduce the facility cost and running cost of the device for handling the items to be stored.

At the time of unpacking, neither the tray nor the storage cylinder is damaged, so that it can be recycled, the material cost can be reduced, and resource saving can be promoted.

[Brief description of drawings]

FIG. 1 is a partially omitted perspective view showing a storage container according to an embodiment of the present invention.

FIG. 2 is an exploded perspective view thereof.

FIG. 3 is a partially cut front view showing a partially omitted view for explaining the method of use.

FIG. 4 is an exploded perspective view showing another embodiment of the present invention.

FIG. 5 is a partially cutaway partially cut front view showing a usage state thereof.

FIG. 6 is a perspective view showing a modified example of the tray.

[Explanation of symbols]

1 ... QFP / IC, 2 ... Resin-sealed package body, 3 ...
Outer leads, 10 ... QFP / IC storage container, 11 ...
Tray, 12 ... Main body, 13 ... Support part, 14 ... Window hole, 15
... Positioning part, 16 ... Upper side abutting part, 17 ... Lower side abutting part,
18 ... Male fitting portion, 19 ... Female fitting portion, 21 ... Storage tube, 22
... storage cylinder main body, 23 ... escape portion, 31, 31A ... connecting device, 32 ... connecting belt, 32A ... joint mounting portion, 33 ... belt main body, 33A ... male side joint, 34 ... pin joint, 34A
... Female joint, 35, 35A ... Male bracket, 36 ... Pin insertion hole, 36A ... Female fitting portion, 37, 37A ... Female bracket, 38, 38A ... Female portion, 39 ... Pin insertion hole, 39
A ... Male fitting part, 40 ... Pin, 50 ... Vacuum suction head.

─────────────────────────────────────────────────── ─── Continuation of the front page (51) Int.Cl. ⁶ Identification code Internal reference number FI Technical indication H01L 21/68 U H05K 13/02

Claims (4)

[Claims] 1. A tray having a substantially flat plate shape,
A plurality of these trays are arranged in parallel with each other so as to be stacked back and forth in the direction of the cylinder center and stored, and a plurality of trays having the same identity are prepared, Each tray is configured such that one main surface thereof can be placed with at least one article positioned laterally thereon, and the other main surface is configured to be adjacent to an article placed on an adjacent tray. A storage container characterized by being present. 2. A tray according to claim 1, wherein adjacent trays are connected to each other so as to be rotatable about an axis parallel to the article mounting surface. Storage container. 3. The storage container according to claim 2, wherein the trays are configured to be connected by a flexible belt. 4. The storage container according to claim 2, wherein the trays are configured to be connected by pin joints that engage with each other.