JPH03131858A - Metallic mask for printing creamed solder - Google Patents

Metallic mask for printing creamed solder

Info

Publication number
JPH03131858A
JPH03131858A JP1270894A JP27089489A JPH03131858A JP H03131858 A JPH03131858 A JP H03131858A JP 1270894 A JP1270894 A JP 1270894A JP 27089489 A JP27089489 A JP 27089489A JP H03131858 A JPH03131858 A JP H03131858A
Authority
JP
Japan
Prior art keywords
printing
solder
metal mask
metallic mask
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1270894A
Other languages
Japanese (ja)
Inventor
Tomoya Ono
小野　智也
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Niigata Fuji Xerox Manufacturing Co Ltd
Original Assignee
Niigata Fuji Xerox Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Niigata Fuji Xerox Manufacturing Co Ltd filed Critical Niigata Fuji Xerox Manufacturing Co Ltd
Priority to JP1270894A priority Critical patent/JPH03131858A/en
Publication of JPH03131858A publication Critical patent/JPH03131858A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof

Landscapes

  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To prevent the solder bridging at the time of reflow soldering by varying the diameters of bored holes between the front surface and rear surface of the metallic mask and disposing the bored holes zigzag so as not to interfere with each other. CONSTITUTION:The bored holes 1 are disposed to stagger zigzag with respect to the adjacent patterns of patterns 2 for packaging QFP. The possibility that the printed creamed solder does not come into contact with each other is, therefore, eliminated. The diameters of the holes 1 are varied with the front surface 4 and rear surface 4 of the metallic mask 3. The wettability of the cream solder at the time of printing is, therefore, good and the exact printing which is free from thinning and drooping is executed. The generation of the solder bridging at the time of the reflow soldering is prevented in this way.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明はクリーム半田印刷用メタルマスクに関し、特に
ＱＦＰ実装用パターン（長方形）等の微細ピッチパター
ン用のメタルマスクに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a metal mask for cream solder printing, and particularly to a metal mask for fine pitch patterns such as QFP mounting patterns (rectangular).

〔従来の技術〕[Conventional technology]

従来、ＱＦＰ用のクリーム半田印刷のメタルマスクにお
いては、第３図に示すようにＱＦＰ実装パターン２を直
角方向に貫く一直線状に印刷する様くり抜き穴１１の形
状を定めていた。Conventionally, in a cream solder printed metal mask for QFP, the shape of the hollow hole 11 has been determined so as to be printed in a straight line passing through the QFP mounting pattern 2 in the right angle direction, as shown in FIG.

〔発明が解決しようとする課題〕[Problem to be solved by the invention]

上述した従来のメタルマスクにおいては、くり抜き形状
が連続した一直線状であるため、これによりクリーム半
田印刷を行なったものをリフロー半田付すると分割され
たＱＦＰ実用用パターンに対し必ずしも半田が分割せず
に、隣接するパターンにおいて半田ブリッジが発生しや
すいという欠点がある。In the conventional metal mask mentioned above, the hollowed out shape is a continuous straight line, so when reflow soldering is performed on a product printed with cream solder, the solder does not necessarily divide into divided QFP practical use patterns. However, there is a drawback that solder bridges are likely to occur in adjacent patterns.

〔課題を解決するための手段〕[Means to solve the problem]

本発明のクリーム半田印刷用メタルマスクは、メタルマ
スク表面と裏面とで穴径が相違したくり抜き穴を設け、
かつＱＦＰ実装用パターンの隣接パターンに対して交互
に穴位置をずらして穴を千鳥状に配列している。The metal mask for cream solder printing of the present invention has hollow holes with different hole diameters on the front and back sides of the metal mask,
In addition, the holes are arranged in a staggered manner by alternately shifting the hole positions with respect to the patterns adjacent to the QFP mounting pattern.

〔実施例〕〔Example〕

次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.

第１図は本発明のメタルマスクのくり抜き形状を表わし
ている。くり抜き穴１は、ＱＦＰ実装用パターン２の隣
接するパターンに対して千鳥状に配置をずらしているた
めに、印刷されたクリーム半田が互いに接触する恐れが
なく、リフロー半田付時の半田ブリッジを防ぐことがで
きる。FIG. 1 shows the cutout shape of the metal mask of the present invention. Since the cutout holes 1 are staggered with respect to the adjacent patterns of the QFP mounting pattern 2, there is no risk that the printed cream solder will come into contact with each other, thereby preventing solder bridging during reflow soldering. be able to.

第２図はくり抜き穴の断面を表わしているが、メタルマ
スク３の表面４と裏面５とで穴１の径を相違させている
ため（表面４の穴径φ、を裏面５の径φゎよりも小さく
している）印刷時のクリーム半田のぬけ性が良く、かす
れ及びダレのない正確な印刷ができる。Figure 2 shows the cross section of the hollowed hole, but since the diameter of the hole 1 is different between the front side 4 and the back side 5 of the metal mask 3 (the hole diameter φ on the front side 4 is changed to the diameter φ゜ on the back side 5). (smaller than the actual size) The cream solder comes out easily during printing, and accurate printing is possible without blurring or sagging.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明は、くり抜き穴の径をメタル
マスクの表面と裏面とで相違させ、かつくり抜き穴を相
互干渉しないように千鳥状に配置することにより、良好
な印刷状態を得るとともにリフロー半田付時の半田ブリ
ッジを防止するという効果がある。As explained above, the present invention makes the diameters of the punched holes different on the front and back sides of the metal mask, and arranges the punched holes in a staggered manner so as not to interfere with each other, thereby achieving a good printing condition and reflowing. This has the effect of preventing solder bridges during soldering.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本発明のクリーム半田印刷用メタルマスクの平
面図、第２図は第１図のＡ−Ａ線断面図、第３図は従来
のクリーム半田印刷用メタルマスクの平面図である。 １．１１・・・メタルマスクくり抜き穴、２・・・ＱＦ
Ｐ実装用パターン、３・・・メタルマスク、４・・・メ
タルマスク表面、５・・・メタルマスク裏面。FIG. 1 is a plan view of a metal mask for cream solder printing according to the present invention, FIG. 2 is a sectional view taken along line A--A in FIG. 1, and FIG. 3 is a plan view of a conventional metal mask for cream solder printing. 1.11...Metal mask cutout hole, 2...QF
P mounting pattern, 3...metal mask, 4...metal mask surface, 5...metal mask back side.

Claims (1)

【特許請求の範囲】[Claims] 　くり抜き穴を円形として表面と裏面の穴径を相違させ
、隣接パターンに対して千鳥状に前記くり抜き穴を配置
したことを特徴とするクリーム半田印刷用メタルマスク
。A metal mask for cream solder printing, characterized in that the hollow holes are circular and have different hole diameters on the front and back sides, and the hollow holes are arranged in a staggered manner with respect to adjacent patterns.
JP1270894A 1989-10-17 1989-10-17 Metallic mask for printing creamed solder Pending JPH03131858A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1270894A JPH03131858A (en) 1989-10-17 1989-10-17 Metallic mask for printing creamed solder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1270894A JPH03131858A (en) 1989-10-17 1989-10-17 Metallic mask for printing creamed solder

Publications (1)

Publication Number Publication Date
JPH03131858A true JPH03131858A (en) 1991-06-05

Family

ID=17492455

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1270894A Pending JPH03131858A (en) 1989-10-17 1989-10-17 Metallic mask for printing creamed solder

Country Status (1)

Country Link
JP (1) JPH03131858A (en)

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